CN203259773U - Micromotion module provided with vibration absorption device - Google Patents
Micromotion module provided with vibration absorption device Download PDFInfo
- Publication number
- CN203259773U CN203259773U CN 201320146246 CN201320146246U CN203259773U CN 203259773 U CN203259773 U CN 203259773U CN 201320146246 CN201320146246 CN 201320146246 CN 201320146246 U CN201320146246 U CN 201320146246U CN 203259773 U CN203259773 U CN 203259773U
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- fine motion
- shock
- absorbing means
- balancing weight
- plate
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Abstract
The utility model belongs to the technical field of photoetching devices, and particularly relates to a micromotion module provided with a vibration absorption device. The micromotion module provided with the vibration absorption device comprises a micromotion plate, a vibration isolation device, a carrying device and the vibration absorption device, wherein the vibration isolation device is arranged at the lower part of the micromotion plate; the carrying device is arranged at the upper part of the micromotion plate; the vibration absorption device is arranged on the micromotion plate. The micromotion module disclosed by the utility model can effectively suppress high amplitude caused by the factor that the intrinsic frequency of the micromotion module approaches to a bandwidth by reasonably arranging the vibration absorption device on the micromotion plate inside the micromotion module through a vibration reduction effect of the vibration absorption device, thereby lowering the requirement on enhancement of the intrinsic frequency of the micromotion module and reducing the processing difficulty and cost; the micromotion module disclosed by the utility model can easily, fast and effectively control the vibration of the micromotion module by regulating the vibration absorption device.
Description
Technical field
The utility model belongs to the technical field of lithographic equipment, is specifically related to a kind of fine motion module that is provided with shock-absorbing means.
Background technology
In litho machine, the relative miscellaneous part of objective system, volume is large, and weight reaches hundreds of kilogram, should not move, so photoetching is the ultraprecise synchronous scanning campaign by silicon wafer stage and mask stage, finishing the exposure realization.Along with improving constantly of large scale integrated circuit device integrated level, the continuous enhancing of photolithography resolution, to the characteristic line breadth index request of litho machine also in continuous lifting, its dynamic property to the motion such as silicon wafer stage and mask platform subsystem in the litho machine requires also more and more higher, silicon wafer stage and mask stage general designation work stage.
The motion subsystem of work stage has higher acceleration of motion and movement velocity, and the large inertial force of moving component and other external factor will cause the vibration of litho machine working centre parts-fine motion module, thus the quality of impact exposure.
Vibration control generally can be by weakening vibration source, connecting vibration isolation system or reduce controll plant to the response of vibration source excitation in modes such as the additional shock-absorbing means of controll plant between vibration source and the controll plant.
The vibration that causes for external factor such as basic frameworks mostly adopt with the fine motion module form one independently built-in system realize active vibration damping and passive vibration isolation.Such as carrying out the isolation of external vibration by the floating structure of vapour and gravity compensator; Perhaps adopt weight of air compensator and the voice coil motor of split-type design, supported the gravity of fine motion module by the weight of air compensator, and the motion that makes voice coil motor only provide positioning function for the fine motion module and provide driving force to produce acceleration the fine motion module to be risen has improved the bearing accuracy of fine motion module to a certain extent.
The fine motion module is not subjected to the impact of basic framework vibration substantially, but along with improving constantly that photolithography resolution requires, it is large that the system bandwidth of work stage motion subsystem becomes, and because fine motion module natural frequency causes amplitude to become large near frequency range, has had a strong impact on the exposure quality.Generally be to improve fine motion module natural frequency by the fine motion plate that thickens in the fine motion module at present, but this scheme not only increase cost and power consumption, and later stage fine setting difficulty, it is limited to regulate leeway.
The utility model content
Technical problem to be solved in the utility model is that the fine motion module is closed the vibrative control of inertial force because of self, in order to overcome above deficiency, provides a kind of fine motion module that is provided with shock-absorbing means.
In order to solve the problems of the technologies described above, the technical solution of the utility model is: the described fine motion module that is provided with shock-absorbing means comprises the fine motion plate, be arranged on the isolation mounting of fine motion plate bottom, be arranged on the bogey on fine motion plate top and be arranged on shock-absorbing means on the fine motion plate.
Further, described shock-absorbing means comprises the web member that transmits support, balancing weight, elastic component and connect described transmission support and balancing weight, and described elastic component is arranged between described transmission support and the balancing weight; Described shock-absorbing means is connected with described fine motion plate by described transmission support.
Further, described transmission support comprises the transmission plate parallel with described fine motion plate.
Further, described balancing weight comprises the upper balancing weight that is arranged on described transmission plate upside and the lower balancing weight that is arranged on described transmission plate downside, and described elastic component comprises the first block rubber that connects transmission plate and upper balancing weight and the second block rubber that connects transmission plate and lower balancing weight.
Further, described web member comprises the holding screw that connects described upper balancing weight and lower balancing weight and is enclosed within the outer sleeve of described holding screw; Described sleeve is located on the sleeve hole of described transmission plate, tightens described holding screw, and described upper balancing weight and lower balancing weight compress described elastic component.Can accurately locate the decrement of elastic component by the sleeve height, this decrement is used for adjusting the vertical stiffness of elastic component, guarantees that shock-absorbing means has fixing mode.
Further, the overall diameter of described sleeve is less than described sleeve hole diameter.Sleeve does not contact with damping block, can be without the friction relative sliding.
Further, described shock-absorbing means is arranged on the place of described fine motion template die attitude mode displacement maximum.
Further, the set-up mode of described shock-absorbing means is for being suspended from fine motion plate below, being hung on fine motion plate one side or embedding the fine motion intralamellar part.
Further, the material of described elastic component is nitrile rubber, neoprene or natural rubber, and the material of described balancing weight is metal material.
The utility model is by the damping effect of shock-absorbing means, by to the favorably situated shock-absorbing means of fine motion plate in the fine motion module, can effectively suppress the higher amplitude that causes near bandwidth because of fine motion module natural frequency, thereby can reduce the requirement that fine motion module natural frequency is improved, reduce difficulty of processing and cost, and can effectively control by regulating the shock-absorbing means Simple fast vibration of fine motion module.
Description of drawings
Fig. 1 is the perspective view of the utility model embodiment 1;
Fig. 2 is the front view of the utility model embodiment 1;
Fig. 3 is the structural representation of shock-absorbing means among Fig. 1;
The acceleration responsive amplitude-frequency comparison diagram of fine motion plate when Fig. 4 has or not shock-absorbing means;
Fig. 5 is the partial view of the utility model embodiment 2;
Fig. 6 is the partial sectional view of the utility model embodiment 3.
Shown in the figure:
1-fine motion plate, 11-the first drift angle, 12-the second drift angle, 13-the 3rd drift angle, 14-the 4th drift angle;
The 2-isolation mounting, 21-gravity compensation air bag component, the vertical electric machine assembly of 22-;
The 3-bogey, 31-coarse motion assembly, 32-board platform, 33-side's mirror assembly;
The 4-shock-absorbing means, 411-web joint, 412-transmission plate, 413-entablature, 414-tie-beam, the upper balancing weight of 421-, balancing weight under the 422-, 431-the first block rubber, 432-the second block rubber, 441-holding screw, 442-sleeve, 443-sleeve hole.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail:
As illustrated in fig. 1 and 2, the fine motion module that is provided with shock-absorbing means described in the utility model comprise fine motion plate 1, be arranged on fine motion plate 1 bottom isolation mounting 2, be arranged on fine motion plate 1 top bogey 3 be arranged on fine motion plate 1 on the identical shock-absorbing means 4 of four structures.
Take a kind of fine motion module of silicon wafer stage as example, described isolation mounting 2 comprises gravity compensation air bag component 21 and vertical electric machine assembly 22.Described bogey 3 comprises coarse motion assembly 31, is arranged on board platform 32 and square mirror assembly 33 on the coarse motion assembly 31, and the silicon wafer stage (not shown) is arranged on the board platform.
It is pointed out that said structure only be a kind of fine motion module in the silicon wafer stage as example, isolation mounting is mainly used in isolating and weakens the vibration that the external factor such as basic framework causes, can be the various isolation mountings of mentioning in the floating or background technology of magnetic.Because be the fine motion of silicon wafer stage, if the fine motion module of mask stage then corresponding component need to adjust accordingly.
Four shock-absorbing means 4 are separately positioned on the first drift angle 11, the second drift angle 12, the 3rd drift angle 13 and the 4th drift angle 14 places of described fine motion plate 1, and described the first drift angle 11, the second drift angle 12, the 3rd drift angle 13 and the 4th drift angle 14 are places of fine motion plate 1 Mode Shape displacement maximum.
As shown in Figure 3, described shock-absorbing means 4 comprises web member spare and the elastic component of the transmission support, balancing weight, connection transmission support and the balancing weight that are connected with fine motion plate 1.
Described transmission support is L-type, it comprises the web joint 411 that connects with fine motion plate 1 and the transmission plate 412 parallel with fine motion plate 1, described web joint 411 is vertical with fine motion plate 1, the shock-absorbing means 4 at the first drift angle 11 and the second drift angle 12 places all is hung on the front side of fine motion plate 1, and the shock-absorbing means 4 at the 3rd drift angle 13 and the 4th drift angle 14 places is hung on respectively fine motion plate 1 left and right sides.
Described balancing weight comprises the upper balancing weight 421 that is arranged on transmission plate 412 upsides and the lower balancing weight 422 that is arranged on transmission plate 412 downsides, and the material of described balancing weight is metal material.
Described elastic component comprises the first block rubber 431 that connects transmission plate 412 and upper balancing weight 421 and the second block rubber 432 that connects transmission plate 412 and lower balancing weight 422, and the material of described elastic component is neoprene.
Described web member comprises the holding screw 441 that connects upper balancing weight 421 and lower balancing weight 422 and the sleeve 442 that is enclosed within outside the holding screw 441, sleeve 442 is located on the sleeve hole 443 of transmission plate 412, tighten holding screw 441, the up and down two ends of upper balancing weight 421 and lower balancing weight 422 clamp sleeves 442.
The overall diameter of described sleeve 442 is less than sleeve hole 443 diameters.
The absorbing frequency f of described shock-absorbing means 4 is 1 ± 0.1 times of fine motion module natural frequency, described absorbing frequency
Wherein k is the rigidity in parallel of the first block rubber 431 and the second block rubber 432, m is the general assembly (TW) of the first block rubber 431 and the second block rubber 432, rubber block size and length and width scope are 5~20cm, and thickness range is 1~5mm, design the suitable shock-absorbing means of absorbing frequency 4 with this.
As shown in Figure 4, the unit force load that fine motion plate in the fine motion module is carried out 1-1000Hz is carried out the acceleration responsive amplitude frequency diagram of frequency sweep, as seen the amplitude that is provided with the fine motion plate of shock-absorbing means is starkly lower than common fine motion plate, the shock-absorbing means Effective Raise the has been described dynamic property of system.
As shown in Figure 5, transmitting support described in the embodiment 1 is Z-type, and it comprises entablature 413, the transmission plate 412 that is connected with fine motion plate 1 lower surface and is connected the tie-beam 414 of entablature 413 and transmission plate 412.Described entablature 413 is parallel with fine motion plate 1, and four shock-absorbing means 4 all are suspended from the bottom of four drift angles of fine motion plate 1 by entablature 413.
The material of described elastic component is nitrile rubber, and the material of balancing weight is rigid plastic.
The equal reference example 1 of all the other structures.
As shown in Figure 6, the inside of four drift angles of shock-absorbing means embedding fine motion plate 1 among the embodiment 1.The transmission plate 412 parallel with fine motion plate 1 links to each other the transmitting vibrations energy with fine motion plate 1.
The material of described elastic component is natural rubber, and the material of balancing weight is metal material.
All the other structures are all with reference to identical with embodiment 1.
Claims (9)
1. fine motion module that is provided with shock-absorbing means, the bogey that it comprises the fine motion plate, is arranged on the isolation mounting of described fine motion plate bottom and is arranged on described fine motion plate top is characterized in that, also comprises the shock-absorbing means that is arranged on the described fine motion plate.
2. described a kind of fine motion module that is provided with shock-absorbing means according to claim 1, it is characterized in that, described shock-absorbing means comprises the web member that transmits support, balancing weight, elastic component and connect described transmission support and balancing weight, and described elastic component is arranged between described transmission support and the balancing weight; Described shock-absorbing means is connected with described fine motion plate by described transmission support.
3. described a kind of fine motion module that is provided with shock-absorbing means according to claim 2 is characterized in that the material of described elastic component is nitrile rubber, neoprene or natural rubber, and the material of described balancing weight is metal material.
4. described a kind of fine motion module that is provided with shock-absorbing means according to claim 3 is characterized in that described transmission support comprises the transmission plate parallel with described fine motion plate.
5. described a kind of fine motion module that is provided with shock-absorbing means according to claim 4, it is characterized in that, described balancing weight comprises the upper balancing weight that is arranged on described transmission plate upside and the lower balancing weight that is arranged on described transmission plate downside, and described elastic component comprises the first block rubber that connects transmission plate and upper balancing weight and the second block rubber that connects transmission plate and lower balancing weight.
6. described a kind of fine motion module that is provided with shock-absorbing means according to claim 5 is characterized in that, described web member comprises the holding screw that connects described upper balancing weight and lower balancing weight and is enclosed within the outer sleeve of described holding screw; Described sleeve is located on the sleeve hole of described transmission plate, tightens described holding screw, and described upper balancing weight and lower balancing weight compress described elastic component.
7. described a kind of fine motion module that is provided with shock-absorbing means according to claim 6 is characterized in that the overall diameter of described sleeve is less than described sleeve hole diameter.
8. described a kind of fine motion module that is provided with shock-absorbing means according to claim 1 is characterized in that described shock-absorbing means is arranged on the place of described fine motion template die attitude mode displacement maximum.
9. described a kind of fine motion module that is provided with shock-absorbing means according to claim 1 is characterized in that, the set-up mode of described shock-absorbing means is for being suspended from fine motion plate below, being hung on fine motion plate one side or embedding the fine motion intralamellar part.
Priority Applications (1)
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CN 201320146246 CN203259773U (en) | 2013-03-27 | 2013-03-27 | Micromotion module provided with vibration absorption device |
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CN 201320146246 CN203259773U (en) | 2013-03-27 | 2013-03-27 | Micromotion module provided with vibration absorption device |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104791413A (en) * | 2015-04-27 | 2015-07-22 | 中国直升机设计研究所 | Spring built-in type anti-resonance vibration abatement device |
CN106292193A (en) * | 2015-05-24 | 2017-01-04 | 上海微电子装备有限公司 | Shock-absorbing means and vibration absorption method, Optical Coatings for Photolithography |
CN109185377A (en) * | 2018-11-07 | 2019-01-11 | 苗改燕 | A kind of precision damping component and the vibration reduction platform being made of it |
CN109212909A (en) * | 2017-06-30 | 2019-01-15 | 上海微电子装备(集团)股份有限公司 | A kind of counter-force Wai Yin mechanism, electric machine and litho machine |
CN109388029A (en) * | 2017-08-10 | 2019-02-26 | 上海微电子装备(集团)股份有限公司 | A kind of reticle stage system and litho machine |
CN113341660A (en) * | 2021-06-10 | 2021-09-03 | 江苏瑞鑫集成电路设备有限公司 | Shock suppression bearing seat of precision lithography machine |
-
2013
- 2013-03-27 CN CN 201320146246 patent/CN203259773U/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104791413A (en) * | 2015-04-27 | 2015-07-22 | 中国直升机设计研究所 | Spring built-in type anti-resonance vibration abatement device |
CN104791413B (en) * | 2015-04-27 | 2017-06-13 | 中国直升机设计研究所 | A kind of internal inserted spring type antiresonance equipment for inhibiting of vibration |
CN106292193A (en) * | 2015-05-24 | 2017-01-04 | 上海微电子装备有限公司 | Shock-absorbing means and vibration absorption method, Optical Coatings for Photolithography |
CN106292193B (en) * | 2015-05-24 | 2019-01-29 | 上海微电子装备(集团)股份有限公司 | Shock-absorbing means and vibration absorption method, Optical Coatings for Photolithography |
CN109212909A (en) * | 2017-06-30 | 2019-01-15 | 上海微电子装备(集团)股份有限公司 | A kind of counter-force Wai Yin mechanism, electric machine and litho machine |
CN109388029A (en) * | 2017-08-10 | 2019-02-26 | 上海微电子装备(集团)股份有限公司 | A kind of reticle stage system and litho machine |
CN109185377A (en) * | 2018-11-07 | 2019-01-11 | 苗改燕 | A kind of precision damping component and the vibration reduction platform being made of it |
CN113341660A (en) * | 2021-06-10 | 2021-09-03 | 江苏瑞鑫集成电路设备有限公司 | Shock suppression bearing seat of precision lithography machine |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee after: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) Co.,Ltd. Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee before: SHANGHAI MICRO ELECTRONICS EQUIPMENT Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CX01 | Expiry of patent term |
Granted publication date: 20131030 |
|
CX01 | Expiry of patent term |