CN203250791U - Large power LED heat radiating structure - Google Patents
Large power LED heat radiating structure Download PDFInfo
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- CN203250791U CN203250791U CN 201320215405 CN201320215405U CN203250791U CN 203250791 U CN203250791 U CN 203250791U CN 201320215405 CN201320215405 CN 201320215405 CN 201320215405 U CN201320215405 U CN 201320215405U CN 203250791 U CN203250791 U CN 203250791U
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- heating panel
- positioning
- radiating structure
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Abstract
The utility model relates to the technical field of a heat radiating device and particularly relates to a large power LED heat radiating structure. The structure comprises an LED base, a PCB, a heat radiating plate and a fixed column. The PCB is provided with a positioning through hole and a fixed through hole. The fixed column is arranged on the heat radiating plate. A column body of the fixed column is connected with the fixed through hole. The LED base is installed above the positioning through hole. The heat radiating plate is provided with a heat conducting column which is matched with the positioning through hole. The heat conducting column is inserted into the positioning through hole, and the upper end face of the heat conducting column is in contact with the bottom surface of the LED base. According to the large power LED heat radiating structure, the full contact between the bottom surface of an LED lamp holder and the upper end face of the heat conducting column is realized, a contact area between a heat conducting part of the bottom surface of the LED lamp holder and the upper end face of the heat conducting column is effectively increased, heat generated in the working of an LED lamp is conducted out rapidly through the heat conducting column and the heat radiating plate, and the heat conduction and radiation effects are greatly enhanced.
Description
Technical field
The utility model relates to the heat abstractor technical field, refers in particular to
OnePlant high-power LED radiating structure.
Background technology
The characteristics such as LED is long owing to its theoretical life-span, the low one-level environmental protection of energy consumption are widely used in the every field such as indicator light, indoor and outdoor lighting.As everyone knows, affecting the most critical factor in LED useful life is exactly the heat dissipation problem of LED.Existing high-power LED radiating structure mainly contains heat sink, the parts such as aluminium base, heat-conducting silicone grease, heating panel connect and compose successively, LED is connected with aluminium base through heat sink, and this radiator structure exists the main cause of heat conduction and heat radiation poor performance to be the structure setting of aluminium base.Aluminium base generally is formed by stacking successively by protection oil reservoir, copper foil layer, insulating barrier and aluminum layer; wherein; although insulating barrier plays good and effective positive role aspect insulation; but also produced simultaneously heat insulation counter productive; the heat that LED produces can't in time be derived rapidly, thereby has greatly affected the useful life of LED.Therefore be necessary existing high-power LED radiating structure is carried out technological innovation, solve most effectively the heat dissipation problem of LED.
Summary of the invention
The utility model provides for the problem of prior art
OnePlant high-power LED radiating structure simple and compact for structure, good heat dissipation effect.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme:
OnePlant high-power LED radiating structure, comprise LED pedestal, pcb board, heating panel and fixed leg, be provided with positioning through hole and fixed via on the described pcb board, described fixed leg is located on the heating panel, and the cylinder of described fixed leg is connected with fixed via; Described LED pedestal is installed on the top of positioning through hole, and described heating panel is provided with the heating column that is complementary with positioning through hole, and described heating column is pegged graft with positioning through hole and the upper surface of heating column contacts with the bottom surface of LED pedestal.
Wherein, described fixed leg and heating panel are one-body molded.
Wherein, described fixed leg is riveting column.
Wherein, be provided with the copper coin layer between described pcb board and the heating panel, described heating panel and copper coin layer are welded and fixed.
Wherein, described heating panel is provided with some fin.
Wherein, rounded, oval, the triangle of the cross section of described heating column or regular hexagon setting.
Wherein, described positioning through hole inwall is provided with internal thread, is provided with external screw thread on the sidewall of described heating column, and described heating column is threaded with positioning through hole.
Wherein, described heating panel is the heating panel that the red copper material is made.
Wherein, described heating panel is the heating panel that aluminum is made.
Wherein, described heating column is the heating column that the red copper material is made.
The beneficial effects of the utility model:
Provided by the utility model
OnePlant high-power LED radiating structure, comprise LED pedestal, pcb board, heating panel and fixed leg, be provided with positioning through hole and fixed via at pcb board, this fixed leg is located on the heating panel, and the cylinder of fixed leg is connected with fixed via; The LED pedestal is installed on the top of positioning through hole, and heating panel is provided with the heating column that is complementary with positioning through hole, and heating column is pegged graft with positioning through hole and the upper surface of heating column contacts with the bottom surface of LED pedestal.The bottom surface of LED lamp socket of the present utility model realizes fully contacting with the upper surface of heating column, effectively increase the thermal conduction portions of LED lamp socket bottom surface and the contact area of heating column upper surface, the heat that the LED lamp produces when work is derived rapidly through heating column and heating panel, and its heat conduction and heat radiation effect strengthens greatly.
Description of drawings
Fig. 1 is the overall structure generalized section of a kind of high-power LED radiating structure of the present utility model.
Fig. 2 is the decomposing schematic representation of a kind of high-power LED radiating structure of the present utility model.
Reference numeral in Fig. 1 to Fig. 2 comprises:
1-LED pedestal, 2-pcb board, 3-heating panel
4-fixed leg, 5-positioning through hole, 6-fixed via
7-heating column, 8-copper coin layer, 9-fin.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with embodiment and accompanying drawing the utility model is further described, the content that execution mode is mentioned not is to restriction of the present utility model.Referring to Fig. 1 to Fig. 2, below in conjunction with accompanying drawing the utility model is described in detail.
OnePlant high-power LED radiating structure, comprise LED pedestal 1, pcb board 2, heating panel 3 and fixed leg 4, be provided with positioning through hole 5 and fixed via 6 on the described pcb board 2, described fixed leg 4 is located on the heating panel 3, in the present embodiment, fixed leg 4 is one-body molded with heating panel 3, and the cylinder of described fixed leg 4 is connected with fixed via 6; Described LED pedestal 1 is installed on the top of positioning through hole 5, and described heating panel 3 is provided with the heating column 7 that is complementary with positioning through hole 5, and described heating column 7 is pegged graft with positioning through hole 5 and the upper surface of heating column 7 contacts with the bottom surface of LED pedestal 1.In the present embodiment, described fixed leg 4 is riveting column, and the upper end of this riveting column and fixed via 6 riveted joints are so that pcb board 2 is fixed together with heating panel 3.
The utility model is not in the situation that affect LED lamp socket 1 and electrode welding, the bottom surface of LED lamp socket 1 realizes fully contacting with the upper surface of heating column 7, the thermal conduction portions of LED lamp socket 1 bottom surface and the contact area of heating column 7 upper surfaces have effectively been increased, the heat that LED produces when work is derived rapidly through heating column 7 and heating panel 3, and its heat conduction and heat radiation effect strengthens greatly.
Wherein, be provided with copper coin layer 8 between described pcb board 2 and the heating panel 3, described heating panel 2 is welded and fixed with copper coin layer 8, with the firmness of further increase high-power LED radiating structure, improves the compact conformation degree, indirectly strengthens performance and the radiating effect of heat conduction.
Wherein, described heating panel 3 is provided with some fin 9.Heating panel 3 of the present utility model can in time be dispersed out rapidly with the heat that LED produces; Be provided with some fin 9 at heating panel 3, to increase the area of dissipation of heating panel 3, further strengthen the radiating effect of heating panel 3.
5 shape size of heating column of the present utility model 7 and positioning through hole is complementary, and the cross section of described heating column 7 can be rounded, oval, triangle or regular hexagon setting.Wherein, described positioning through hole 5 inwalls are provided with internal thread, are provided with external screw thread on the sidewall of described heating column 7, and described heating column 7 is threaded with positioning through hole 5, so that heating panel 3 is tightr with being connected of pcb board 2, indirectly improves the heat conduction and heat radiation function.
Wherein, described heating panel 3 is the heating panel that red copper material and aluminum are made.The heating column that described heating column 7 is made for the red copper material.Red copper and aluminum all have good heat conduction and heat radiation function, and heating panel 3 and heating column 7 adopt red copper and aluminum to make, and are conducive to realize heat radiation purpose of the present invention.Certainly the said structure main body also can adopt other metal materials with good heat conductive heat dispersion to make.
Above content only is preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.
Claims (10)
1.
OnePlant high-power LED radiating structure, it is characterized in that: comprise LED pedestal, pcb board, heating panel and fixed leg, be provided with positioning through hole and fixed via on the described pcb board, described fixed leg is located on the heating panel, and the cylinder of described fixed leg is connected with fixed via; Described LED pedestal is installed on the top of positioning through hole, and described heating panel is provided with the heating column that is complementary with positioning through hole, and described heating column is pegged graft with positioning through hole and the upper surface of heating column contacts with the bottom surface of LED pedestal.
2. high-power LED radiating structure according to claim 1, it is characterized in that: described fixed leg and heating panel are one-body molded.
3. according to claim 1
OnePlant high-power LED radiating structure, it is characterized in that: described fixed leg is riveting column.
4. according to claim 1
OnePlant high-power LED radiating structure, it is characterized in that: be provided with the copper coin layer between described pcb board and the heating panel, described heating panel and copper coin layer are welded and fixed.
5. according to claim 1
OnePlant high-power LED radiating structure, it is characterized in that: described heating panel is provided with some fin.
6. according to claim 1
OneKind of high-power LED radiating structure is characterized in that: the cross section of described heating column is rounded, oval, triangle or regular hexagon setting.
7. according to claim 1
OnePlant high-power LED radiating structure, it is characterized in that: described positioning through hole inwall is provided with internal thread, is provided with external screw thread on the sidewall of described heating column, and described heating column is threaded with positioning through hole.
8. each described high-power LED radiating structure according to claim 1-7 is characterized in that: described heating panel is the heating panel that the red copper material is made.
9. each described high-power LED radiating structure according to claim 1-7 is characterized in that: described heating panel is the heating panel that aluminum is made.
10. each described high-power LED radiating structure according to claim 1-7 is characterized in that: described heating column is the heating column that the red copper material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320215405 CN203250791U (en) | 2013-04-25 | 2013-04-25 | Large power LED heat radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320215405 CN203250791U (en) | 2013-04-25 | 2013-04-25 | Large power LED heat radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203250791U true CN203250791U (en) | 2013-10-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320215405 Expired - Fee Related CN203250791U (en) | 2013-04-25 | 2013-04-25 | Large power LED heat radiating structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN203250791U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093660A (en) * | 2017-06-13 | 2017-08-25 | 湖南粤港光电科技有限公司 | A kind of radiator light-source structure integrated with chip package |
| CN109616452A (en) * | 2018-10-26 | 2019-04-12 | 武汉光迅科技股份有限公司 | A kind of radiating subassembly, corresponding radiator and corresponding circuit board |
| CN109959807A (en) * | 2018-10-11 | 2019-07-02 | 郭建国 | A kind of intelligent electric meter current loop sampling current divider and its metering circuit |
-
2013
- 2013-04-25 CN CN 201320215405 patent/CN203250791U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093660A (en) * | 2017-06-13 | 2017-08-25 | 湖南粤港光电科技有限公司 | A kind of radiator light-source structure integrated with chip package |
| CN107093660B (en) * | 2017-06-13 | 2018-11-13 | 湖南粤港模科实业有限公司 | A kind of radiator and the integrated light-source structure of chip package |
| CN109959807A (en) * | 2018-10-11 | 2019-07-02 | 郭建国 | A kind of intelligent electric meter current loop sampling current divider and its metering circuit |
| CN109616452A (en) * | 2018-10-26 | 2019-04-12 | 武汉光迅科技股份有限公司 | A kind of radiating subassembly, corresponding radiator and corresponding circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171109 Address after: 523565 Guangdong city of Dongguan province Changping Zhen Heng Jiang Jiang Xia Heng Industrial Road, set up a file Patentee after: KINGSUN OPTOELECTRONIC CO., LTD. Address before: 523565 Guangdong province Dongguan city Changping town Hengjiang Dongguan KingSun Au Optronics Co set up a file Patentee before: Dongguan Qinshang Photoelectric Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131023 Termination date: 20190425 |