CN203243597U - Flexible circuit board stamping structure - Google Patents
Flexible circuit board stamping structure Download PDFInfo
- Publication number
- CN203243597U CN203243597U CN 201320278367 CN201320278367U CN203243597U CN 203243597 U CN203243597 U CN 203243597U CN 201320278367 CN201320278367 CN 201320278367 CN 201320278367 U CN201320278367 U CN 201320278367U CN 203243597 U CN203243597 U CN 203243597U
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- China
- Prior art keywords
- circuit board
- stamp
- positions
- flexible circuit
- hole
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- Expired - Fee Related
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Abstract
The utility model relates to a flexible circuit board stamping structure. The flexible circuit board stamping structure comprises a circuit board body, wherein the circuit board body is provided with a plurality of circuit board units, hole positions for stamp positioning, and plug-pull finger positions, and a first strip-shaped reinforcing layer is arranged above positions provided with the hole positions for stamp positioning; the hole positions for stamp positioning are arranged on both sides or the front ends of the plug-pull finger positions; and a second strip-shaped reinforcing layer is arranged below positions provided with the plug-pull finger positions of the circuit board body. By additionally arranging the reinforcing layers at the hole positions for stamp positioning, the hardness of parts around the positioning holes can be increased, the hole misregistration phenomenon of the target when the positioning holes are subjected to target-stamping is reduced, the stamping deviation phenomenon during external form stamping can be effectively reduced since the sizes of the positioning holes are precise, and the probability of production line rework and customer complaints and claims is decreased.
Description
Technical field
The utility model relates to the flexible circuit board field.
Background technology
Need be designed for the finger-shaped conductive welding disk of plug on some flexible circuit board (FPC), be called plug finger, the client is generally higher to external form back gauge tolerance to the finger center on the limit, to adapt to plugging member.In order to satisfy client's tolerance, after the FPC justifying of this band plug finger is made, need to cooperate exterior mold to make accurately location hole, adopt target to rush the mode punching.Because of FPC itself comparatively soft and thin, phenomenon appears pullling when target rushes location hole easily, part punching distortion or off normal appear, the splicing fingers punching partially when causing part FPC cover location hole to rush external form, the finger center is to the super tolerance of external form back gauge, and this error is visual can't to be checked out, often causes the client seriously to complain claim.
The utility model content
For overcoming the shortcomings and deficiencies of above-mentioned prior art, the utility model provides a kind of flexible circuit board stamp structure.
The technical solution adopted in the utility model is:
A kind of flexible circuit board stamp structure comprises the wiring board body, the polylith wiring board unit is set on the described wiring board body and is used for the position, hole that stamp is located, and the top, place, position, hole with stamp location is provided with the first strip strengthening course.
Preferably, described the first strip strengthening course is the PI flaggy, and this PI flaggy thickness is 0.075mm-0.25mm.
Preferably, described wiring board unit is provided with plug finger position, and both sides or the front end of plug finger position is located in the position, hole of stamp location; Described wiring board has plug finger bit position below and is provided with the second strip strengthening course.
Compared with prior art, the utility model increases PI reinforcement flaggy at stamp location hole place, can increase the hardness at location hole place, when rushing location hole, reduces by target the inclined to one side hole of target phenomenon, and the easy printing opacity of PI reinforcement flaggy, the target impact machine can be identified, and not needing additionally to increase other operations does not affect production efficiency yet; The location hole size has accurately also effectively reduced when rushing external form finger and has rushed inclined to one side phenomenon, has reduced to produce that line is done over again and the probability of customer complaint and claim.
Description of drawings
Fig. 1 is wiring board schematic diagram when not establishing strengthening course.
Fig. 2 is the wiring board stamp structural representation of having established strengthening course described in the utility model.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with specific embodiment and accompanying drawing the utility model theory of constitution is described in further detail.
As shown in Figure 1, 2, flexible circuit board stamp structure described in the utility model comprises wiring board body 10, at wiring board body 10 polylith wiring board unit 11 and plug finger position 13 are set, the position, hole 12 that both sides or the front end in plug finger position 13 is provided for the stamp location.All are feature boards independently behind each wiring board unit stamp.The top, 12 places, position, hole that the utility model has the stamp location in the circuit board arranges a strip strengthening course 14, the easy printing opacity of the strengthening course of PI material, the target impact machine also can be identified after having added strengthening course, covering the hole can increase the hardness of finger place location hole, reduces the inclined to one side hole of target phenomenon when the location hole of target punching finger front end or both sides.Below having plug finger bit position, a strip strengthening course is set also, can increases wiring board finger position intensity, be beneficial to the making of finger pad.The strip strengthening course at two places all adopts the PI material as reinforcement.
PI plate strengthening course thickness at 12 places, position, hole that stamp is located is generally 0.075-0.25mm.PI strengthening course thickness below plug finger position is generally 0.15+/-0.03mm.
During making, can at the marking line of circuit film design reinforcing layer, after circuit completes, the marking line 15 of reinforcing layer namely be arranged, such as Fig. 1 on the plate.Be covered with the PI stiffening plate according to the marking line that etches during assembling, carry out again punching and stamp, can greatly improve the dimensional accuracy that target rushes location hole.
Need to prove, not breaking away under the utility model design prerequisite its any minor variations of doing and being equal to replacement, all should belong to protection range of the present utility model.
Claims (6)
1. a flexible circuit board stamp structure comprises the wiring board body, the polylith wiring board unit is set on the described wiring board body and is used for the position, hole that stamp is located, and it is characterized in that: the top, place, position, hole with stamp location is provided with the first strip strengthening course.
2. flexible circuit board stamp structure according to claim 1, it is characterized in that: described the first strip strengthening course is the PI flaggy.
3. flexible circuit board stamp structure according to claim 2, it is characterized in that: described PI flaggy thickness is 0.075mm-0.25mm.
4. flexible circuit board stamp structure according to claim 1 is characterized in that: described wiring board unit is provided with plug finger position, and both sides or the front end of plug finger position is located in the position, hole of stamp location.
5. flexible circuit board stamp structure according to claim 4 is characterized in that: described wiring board has plug finger bit position below and is provided with the second strip strengthening course.
6. flexible circuit board stamp structure according to claim 5, it is characterized in that: described the second strip strengthening course is the PI reinforced layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320278367 CN203243597U (en) | 2013-05-21 | 2013-05-21 | Flexible circuit board stamping structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320278367 CN203243597U (en) | 2013-05-21 | 2013-05-21 | Flexible circuit board stamping structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203243597U true CN203243597U (en) | 2013-10-16 |
Family
ID=49320850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320278367 Expired - Fee Related CN203243597U (en) | 2013-05-21 | 2013-05-21 | Flexible circuit board stamping structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203243597U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106941761A (en) * | 2017-04-20 | 2017-07-11 | 苏州市华扬电子股份有限公司 | A kind of target practice hole orifice ring of flexible PCB |
| CN108990252A (en) * | 2017-06-05 | 2018-12-11 | 上达电子（深圳）股份有限公司 | Flexible circuit board, plug finger and its forming method |
-
2013
- 2013-05-21 CN CN 201320278367 patent/CN203243597U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106941761A (en) * | 2017-04-20 | 2017-07-11 | 苏州市华扬电子股份有限公司 | A kind of target practice hole orifice ring of flexible PCB |
| CN106941761B (en) * | 2017-04-20 | 2019-11-19 | 苏州市华扬电子股份有限公司 | A kind of target practice hole orifice ring of flexible circuit board |
| CN108990252A (en) * | 2017-06-05 | 2018-12-11 | 上达电子（深圳）股份有限公司 | Flexible circuit board, plug finger and its forming method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131016 Termination date: 20180521 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |