CN203232904U - Flexible substrate group for LED light sources - Google Patents

Flexible substrate group for LED light sources Download PDF

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Publication number
CN203232904U
CN203232904U CN 201320089811 CN201320089811U CN203232904U CN 203232904 U CN203232904 U CN 203232904U CN 201320089811 CN201320089811 CN 201320089811 CN 201320089811 U CN201320089811 U CN 201320089811U CN 203232904 U CN203232904 U CN 203232904U
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China
Prior art keywords
substrate
led light
insulating barrier
light source
batch
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Expired - Fee Related
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CN 201320089811
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Chinese (zh)
Inventor
冼钰伦
张伟
张瑞西
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Top Shun Lighting (china) Co Ltd
Sunsun Lighting China Co Ltd
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Top Shun Lighting (china) Co Ltd
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Priority to CN 201320089811 priority Critical patent/CN203232904U/en
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Abstract

The utility model provides a flexible substrate group for LED light sources, and belongs to the technical field of semiconductor lighting. The flexible substrate group for LED light sources includes: an insulation layer, a reflection layer, and at least 2 substrates. The front surfaces of the substrates are fixed on one surface of the insulation layer, and an interval is provided between the substrates. The insulation layer is provided with an opening at the position opposite to the substrates, and the other surface of the insulation layer is provided with a wiring layer, which is used for the connection with a chip package body. A reflection layer is disposed on the wiring layer and the insulation layer. LED light sources, which employ the flexible substrate group provided by the utility model, have advantages of large spatial light emitting angle, uniform spatial emitting effect, and simple production and manufacturing process.

Description

A kind of flexible LED light source substrate in batch
Technical field
The utility model provides a kind of flexible LED light source substrate of using in the wide-angle light-emitting lamp of being mainly used in, and belongs to field of semiconductor illumination.
Background technology
As lighting technology of new generation, LED development is very fast, and technology constantly promotes, market scale constantly enlarges, and constantly replaces the traditional lighting light fixture by feat of advantages such as energy-saving and environmental protection, all solid state, long-lives.
Over the past two years, the problem that the space luminescence angle of light fixture exists becomes consumers in general and producer's Focal Point of Common Attention, the space luminescence angle of traditional incandescent lamp and fluorescent lamp can reach more than 300 °, luminous close to the total space, and in the space luminescence angle of product nominal, lamp luminescence is very even, does not have tangible dark space and glare phenomenon.Present LED light fixture, as: the space luminescence angle of light fixtures such as LED bulb lamp, LED candle lamp, LED fluorescent tube is all less, its main cause is: all led light sources all are positioned at same plane, light emission direction is identical, and lampshade only is hemisphere or little dome-type, adopting the luminous angle of light fixture maximum space of this lampshade in theory is 180 °, however since the problem of luminous intensity distribution generally can only reach about 120 °.In order to address this problem, people have carried out the improvement of a lot of aspects, such as using the frosted lampshade, increase frosted by the inner surface at lampshade, make light in lampshade inside through repeatedly the reflection, scattering, improve the purpose at the space luminescence angle of light with realization, adopt this method generally can realize 130 °~160 ° space luminescence angle; Someone further, increase the profile of lampshade, make it to surpass semicircle, further promote the space luminescence angle of light fixture by lampshade, this method also can improve light fixture the space luminescence angle, can reach 160 °~230 °, obviously improve the optical issue that of light fixture, but fundamentally do not address this problem, because all light sources still at grade, when light emits from light source, remain to approximate same direction emission; In order further to improve the space luminescence angle of light fixture, address this problem fully, someone has been configured to each light source in the light fixture on the different planes, the light-emitting area of light fixture is arranged to a plurality of independently light-emitting areas, so just can make different light sources shine different directions respectively, CN101893180 provides a kind of LED candle lamp that adopts this conceptual design, in this candle lamp, some LEDs light sources are welded on the correspondence position of radiator respectively, made it to realize substantially the space luminescence more than 300 °, yet still there are some technical problems in this scheme, mainly contain: owing to there is the carrier radiator as strutting piece and heat sink to exist, each concave edges profile place at radiator, all more or less have a light-baffling phenomena, each profile can block the light that the light source of this profile place one side sends, thereby makes light periodic dark space occur in spatial distributions.
Summary of the invention
To be solved in the utility modelly be: LED light fixture space luminescence angle is less than normal, and there are periodically technical problems such as dark space in the light fixture space luminescence.The utility model provides a kind of flexible LED light source substrate in batch and manufacture method, and the led light source that several separate substrates are made folds or enclosing with substrate in batch, can realize needed light fixture space luminescence demand.Concrete technical scheme is:
A kind of flexible LED light source substrate in batch includes insulating barrier, reflector layer and at least 2 substrates, and the one side of insulating barrier is fixed in the front of described substrate, and substrate leaves the gap each other; The position that insulating barrier is relative with substrate is provided with opening, and the insulating barrier another side is provided with for the line layer that connects chip packing-body; Described line layer and insulating barrier another side are provided with reflector layer.
This led light source can be assemblied in LED lamp inside with substrate in batch, and when it was made led light source, the COB that installs in the substrate in batch (chip on board) quantity of light source can be selected according to the structure of the LED lamp of reality, can be set to 3~6 usually; The material of insulating barrier can adopt conventional materials such as FR4, FR5, and it has certain pliability, makes substrate in batch to bend according to actual conditions, and the light source module after guaranteeing to make can throw light on towards different directions.The arrangement of the COB light source in the substrate in batch arranges according to actual conditions, for example: can be made as single file, also can be set to multiple lines and multiple rows; Steep for common LED lamp, a plurality of COB light sources are arranged by single file get final product, if when needing in the light to use the light source module of multirow, the light source module that both can adopt a plurality of this single files to arrange also can adopt multiple lines and multiple rows to be arranged into whole light source module; The light source module that adopts single file to arrange is better, and it is convenient processing and manufacture not only, when the LED lamp is installed, also is convenient to install.
Be to couple together between with chip packing-body in the effect of the line layer that insulating barrier arranges, connected mode can adopt series, parallel or series-parallel connection.When needing, the also pad that can be connected with line layer the setting of the insulating barrier of substrate in batch, by pad substrate in batch is connected with external circuit, the position of pad does not need special restriction, arrange according to the side circuit situation and to get final product, for example: when adopting the light source module of single file arrangement, can on the substrate with two ends in the module pad be installed.
Because by insulating barrier each substrate is linked to each other between the substrate in batch, it has certain flexibility or bendable folding endurance, it can be bent to given shape, to reach to the purpose of different directions irradiation.Crooked shape can be according to actual needs or the structure of LED lamp set, both can become certain cambered surface, also the light source module can be surrounded cast, with reach to around carry out illumination purposes.
Substrate can adopt aluminium base or ceramic substrate, and the interval between the adjacent substrate is 2~10mm preferably; Above-mentioned reflector layer can adopt conventional welding resistance wet goods.
The utility model also provides a kind of method that is suitable for the substrate in batch of industrialized production, specifically:
A kind of flexible LED light source comprises the steps: with the manufacture method of substrate in batch
S1: be taken to few 2 substrates, described substrate be fixed on the one side of insulating barrier with being spaced from each other, the contacted position of described insulating barrier and substrate is provided with opening;
S2: the another side at insulating barrier is installed line layer and pad;
S3: not pasted reflector layer by the zone of line layer and pad covering on the line layer and on the described insulating barrier another side, obtain flexible LED light source substrate in batch.
When using this substrate in batch to make light source, chip is installed on opening part, the encapsulation of insulating barrier on the substrate in batch, again line layer is connected with chip, get final product.
Technique effect
The flexible LED light source that the utility model provides is mainly used to make the LED light fixture with wide-angle space luminescence with substrate in batch, as the LED candle lamp, the LED bulb lamp, light fixtures such as LED fluorescent lamp, it is big that the LED light fixture that the flexible LED light source that adopts the utility model to provide produces with substrate in batch has the space luminescence angle, space luminescence is even, advantage such as the production of light fixture, manufacturing process are simple.
Description of drawings
Fig. 1 is the flexible LED light source that provides of the utility model with the agent structure schematic diagram of substrate in batch;
Fig. 2 is the flexible LED light source substrate in batch structural representation of a kind of cascaded structure of providing of the utility model;
Fig. 3 is the flexible LED light source substrate in batch structural representation of a kind of parallel-connection structure of providing of the utility model;
Fig. 4 is the flexible LED light source that provides of the utility model with the cross section structure schematic diagram of substrate in batch.
Fig. 5 is the flexible LED light source that provides of the utility model becomes to have the luminous angle of large space light source with the substrate in batch enclosing structural representation.
Wherein the 11,12, the 13rd, substrate; 21, the 22, the 23rd, insulating barrier; 31, the 32,33, the 34th, line layer; 41, the 42, the 43rd, reflector layer; 51, the 52, the 53rd, chip packing-body; 61, the 62nd, pad.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described further.
Embodiment 1
Referring to Fig. 1,2,4, a bigger aluminium base section bar of area is cut into 3 independently little substrates 11,12,13, remove waste material, be arranged as single file between these independently little substrates, distance between the adjacent substrate is 2mm, paste insulating barrier 21 at independently little substrate surface then, 22,23, according to technological requirement, pasting insulating barrier 21,22, before 23, can be at little substrate 11,12,13 surface-coated glue layer, insulating barrier 21,22,23 are covered in substrate 11,12, part on 13 is provided with opening, makes substrate 11,12, expose in some zone in the middle of 13, and the chip after this zone of exposing is used for is installed.As a rule, when substrate is pasted insulating barrier, adopt the insulating layer material of a monoblock to get final product, again with each little substrate sticking on this insulating barrier, in Fig. 1,2,4, because therefore the insulating barrier middle opening is represented with Reference numeral 21,22,23 insulating barrier of opening both sides respectively.As shown in Figure 4, with on the cross section of substrate in batch, insulating barrier 21,22,23 will couple together between the adjacent substrate 11,12,13, forms an integral body from led light source, and the subregion that is positioned on the substrate 11,12,13 is disconnected, and represents with insulating barrier 21,22,23 in Fig. 4.Dotted line among Fig. 1 and Fig. 2 is represented be below insulating barrier 21,22,23, the substrate 11,12 that is blocked, 13 outline line.
Use it for when making light source, need be according to the circuit design requirement, at insulating barrier 21,22, paste line layer 31 on 23,32,33,34, in Fig. 2, circuit layer 31,32,33,34 adopt series system, adopt series system to couple together in the circuit of three luminous zones, pad 61,62 are connected with circuit layer, and finally by pad 61,62 link to each other with external circuit, then line layer and be not coated with line layer and the insulating barrier of pad above paste reflector layer 41,42,43, obtained flexible LED light source substrate in batch this moment, adopt conventional packaging technology then, in the luminous zone of insulating barrier opening, install chip, encapsulate, obtain chip packing- body 51,52,53, get final product.
In Fig. 2, be succinct demonstration, be positioned at insulating barrier 21,22,23 and the reflector layer 41,42,43 of circuit layer 31,32,33,34 tops do not draw.
Embodiment 2
Referring to Fig. 1,3,4, a bigger ceramic wafer section bar of area is cut into 3 independently little substrates 11,12,13, remove waste material, be arranged as single file between these independently little substrates, distance between the adjacent substrate is 10mm, paste insulating barrier 21 at independently little substrate surface then, 22,23, according to technological requirement, pasting insulating barrier 21,22, before 23, can be at little substrate 11,12,13 surface-coated glue layer, insulating barrier 21,22,23 are covered in substrate 11,12, part on 13 is provided with opening, makes substrate 11,12, expose in some zone in the middle of 13, and the chip after this zone of exposing is used for is installed.As a rule, when substrate is pasted insulating barrier, adopt the insulating layer material of a monoblock to get final product, again with each little substrate sticking on this insulating barrier, in Fig. 1,3,4, because therefore the insulating barrier middle opening is represented with Reference numeral 21,22,23 insulating barrier of opening both sides respectively.As shown in Figure 4, with on the cross section of substrate in batch, insulating barrier 21,22,23 will couple together between the adjacent substrate 11,12,13, forms an integral body from led light source, and the subregion that is positioned on the substrate 11,12,13 is disconnected, and represents with insulating barrier 21,22,23 in Fig. 4.Dotted line among Fig. 1 and Fig. 3 is represented be below insulating barrier 21,22,23, the substrate 11,12 that is blocked, 13 outline line.
Use it for when making light source, need be according to the circuit design requirement, at insulating barrier 21,22, paste line layer 31 on 23,32,33,34, in Fig. 3, circuit layer 31,32,33,34 adopt parallel way, adopt series system to couple together in the circuit of three luminous zones, pad 61,62 are connected with circuit layer, and finally by pad 61,62 link to each other with external circuit, then line layer and be not coated with line layer and the insulating barrier of pad above paste reflector layer 41,42,43, obtained flexible LED light source substrate in batch this moment, adopt conventional packaging technology then, in the luminous zone of insulating barrier opening, install chip, encapsulate, obtain chip packing- body 51,52,53, get final product.
In Fig. 3, be succinct demonstration, be positioned at insulating barrier 21,22,23 and the reflector layer 41,42,43 of circuit layer 31,32,33,34 tops do not draw.
Embodiment 3
Referring to Fig. 5, the flexible LED light source that the utility model is provided with the substrate in batch enclosing on an assembly that three sides are arranged, and fixing, then this sub-assembly overall package can be produced a kind of LED light fixture with the luminous angle of large space on light fixture.

Claims (5)

1. flexible LED light source substrate in batch, include insulating barrier (21,22,23), reflector layer (41,42,43) and at least 2 substrates, it is characterized in that: the one side of insulating barrier (21,22,23) is fixed in the front of described substrate, and substrate leaves the gap each other; Insulating barrier (21,22, the 23) position relative with substrate is provided with opening; The another side of insulating barrier (21,22,23) is provided with for the line layer (31,32,33,34) that connects chip packing-body (51,52,53); Described line layer (31,32,33,34) and insulating barrier (21,22,23) another side are provided with reflector layer (41,42,43).
2. flexible LED light source substrate in batch according to claim 1, it is characterized in that: described substrate is 3~6.
3. flexible LED light source substrate in batch according to claim 1, it is characterized in that: described substrate is single-row and arranges.
4. according to each described flexible LED light source substrate in batch of claim 1~3, it is characterized in that: the spacing between the adjacent described substrate is 2~10mm.
5. flexible LED light source substrate in batch according to claim 1, it is characterized in that: described substrate is aluminium base or ceramic substrate.
CN 201320089811 2013-02-27 2013-02-27 Flexible substrate group for LED light sources Expired - Fee Related CN203232904U (en)

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Application Number Priority Date Filing Date Title
CN 201320089811 CN203232904U (en) 2013-02-27 2013-02-27 Flexible substrate group for LED light sources

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320089811 CN203232904U (en) 2013-02-27 2013-02-27 Flexible substrate group for LED light sources

Publications (1)

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CN203232904U true CN203232904U (en) 2013-10-09

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103151444A (en) * 2013-02-27 2013-06-12 上舜照明(中国)有限公司 Base plate group for flexible LED (Light Emitting Diode) light source and manufacturing method thereof
CN104835897A (en) * 2014-02-11 2015-08-12 晶元光电股份有限公司 Light emitting device and method for manufacturing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103151444A (en) * 2013-02-27 2013-06-12 上舜照明(中国)有限公司 Base plate group for flexible LED (Light Emitting Diode) light source and manufacturing method thereof
CN103151444B (en) * 2013-02-27 2016-04-27 上舜照明(中国)有限公司 A kind of flexible LED light source substrate group and manufacture method thereof
CN104835897A (en) * 2014-02-11 2015-08-12 晶元光电股份有限公司 Light emitting device and method for manufacturing the same
CN104835897B (en) * 2014-02-11 2020-12-04 晶元光电股份有限公司 Light emitting device and method for manufacturing the same

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131009

Termination date: 20170227

CF01 Termination of patent right due to non-payment of annual fee