CN203225246U - Wafer clamping rotating device and wafer cleaning groove - Google Patents
Wafer clamping rotating device and wafer cleaning groove Download PDFInfo
- Publication number
- CN203225246U CN203225246U CN 201220749855 CN201220749855U CN203225246U CN 203225246 U CN203225246 U CN 203225246U CN 201220749855 CN201220749855 CN 201220749855 CN 201220749855 U CN201220749855 U CN 201220749855U CN 203225246 U CN203225246 U CN 203225246U
- Authority
- CN
- China
- Prior art keywords
- clamping
- infrabasal plate
- drive unit
- supporting bracket
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a wafer clamping rotating device comprising a lower surface, which is used for fixing a rotatably-arranged lower substrate of the wafer; and a clamping clamp, which comprises a hook body extended toward a center of the substrate. The hook body is disposed under the lower substrate, and the clamping clamp can be driven to move toward the lower substrate and away from the lower substrate. The wafer clamping rotating device can be used to fixedly clamp the wafer, and can be used to drive the wafer to rotate. The wafer can be cleaned in all directions during the washing, and the cleaning effect is uniform. By using the wafer clamping rotating device, during the electroplating or the etching, the electroplating or the etching of all parts of the wafer can be guaranteed, and the uniform electroplating and the uniform etching can be guaranteed. The use is convenient.
Description
Technical field
The utility model relates to a kind of wafer device for clamping and rotating and wafer rinse bath.
Background technology
Need in the wafer production process to clean.A kind of cleaning method commonly used is that wafer is fixed in the rinse bath, and cleaning fluid sprays to wafer.The flusher of cleaning fluid constantly moves with comprehensive cleaning wafer.Though this device can cleaning wafer, wafer can't rotate, and can't guarantee to clean evenly.In addition, this cleaning device is difficult to the realization level and cleans, and namely is arranged on to wafer level the cleaning fluid top, and cleaning fluid flows to from bottom to top with wafer and contacts with the cleaning wafer surface.Another deficiency is, shower water directly sprays to wafer, and the excessive wafer that makes easily of hydraulic pressure damages.When plating or etching, for guaranteeing to electroplate or etched uniformity, wafer need with electroplate liquid or etching solution comprehensive engagement, it is identical or close to be that each of its surface selected electroplate liquid or the etching solution of contact, if electroplate or during etching wafer can't rotate, each that then can't guarantee crystal column surface selected and can both be contacted identical or close electroplate liquid or etching solution.
Summary of the invention
The purpose of this utility model is in order to overcome deficiency of the prior art, a kind of clamping wafer to be provided and to drive the wafer device for clamping and rotating that wafer rotates.
For realizing above purpose, the utility model is achieved through the following technical solutions:
The wafer device for clamping and rotating is characterized in that, comprising:
Lower surface is used for the fixedly infrabasal plate of wafer, and described infrabasal plate rotatably arranges;
The clamping clip; Described clamping clip comprises the coupler body that extends to substrate center; Coupler body is positioned at the infrabasal plate below; Coupler body is subjected to drive and can arranges towards the infrabasal plate motion with away from infrabasal plate reciprocating motion ground.
Preferably, also comprise first drive unit, described first drive unit and described clamping clip are in transmission connection, and drive described coupler body and move back and forth.
Preferably, also comprise supporting bracket; Described supporting bracket is positioned at the infrabasal plate top, and supporting bracket is subjected to drive towards the infrabasal plate motion or away from infrabasal plate and moves; The clamping clip is connected with supporting bracket, and the clamping clip is subjected to the supporting bracket actuation movement.
Preferably, also comprise upper substrate; Upper substrate and infrabasal plate arrange at interval and interconnect, and supporting bracket is between upper substrate and infrabasal plate; The clamping clip is connected with supporting bracket, and supporting bracket and coupler body lay respectively at infrabasal plate both sides up and down.
Preferably, the power take-off of described first drive unit driving supporting bracket moves towards infrabasal plate; Also comprise elasticity reset device, described elasticity reset device produces the elastic deformation force in supporting bracket when infrabasal plate moves; This elastic deformation force has the supporting bracket of making away from the trend of infrabasal plate.
Preferably, the power take-off mechanism of described first drive unit is provided with piston plate; Elasticity reset device is the compression spring; Compression spring one end is resisted against on the piston plate, and the other end is resisted against on the upper substrate.
Preferably, first drive unit is the unidirectional power output device.
Preferably, first drive unit is two-way reciprocating drive unit.
Preferably, described clamping clip also comprises connecting rod, and coupler body is arranged on the connecting rod bottom, and coupler body extends from the downward substrate center of connecting rod; Connecting rod passes infrabasal plate, and the upper end is connected with supporting bracket; Supporting bracket and coupler body lay respectively at infrabasal plate both sides up and down.
Preferably, also comprise second drive unit; Second drive unit and infrabasal plate are in transmission connection; Second drive unit drives infrabasal plate and arranges rotatably.
Preferably, second drive unit and first drive unit are in transmission connection, and second drive unit drives the infrabasal plate rotation by driving the rotation of first drive unit.
Preferably, also comprise upper substrate; Upper substrate and infrabasal plate arrange at interval and interconnect; First drive unit is connected with upper substrate, drives the upper substrate rotation during rotation of first drive unit and the rotation of drive infrabasal plate.
Preferably, also comprise supporting bracket, supporting bracket is arranged between upper substrate and the infrabasal plate movingly; The clamping clip passes infrabasal plate and is connected with supporting bracket; First drive unit and supporting bracket are in transmission connection, and first drive unit drives the supporting bracket motion.
Preferably, also comprise groove lid and case; The groove lid is articulated in the cell body upper end; Case is installed on groove and covers, and case has a cavity volume; Described first drive unit and second drive unit all are arranged in the cavity volume, and first drive unit is rotatably mounted in groove and covers.
Preferably, described first drive unit comprises shell and power take-off; Power take-off is connected with supporting bracket; Described shell rotatably is arranged at groove and covers and pass groove lid and be connected with upper substrate.
Preferably, described shell is connected by sleeve with upper substrate; Sleeve set is at outer casing end, and is rotatably installed in groove and covers, and sleeve passes described groove lid.
Preferably, described power take-off comprises piston plate and piston rod; The piston rod upper end is connected with piston plate, and the lower end is connected with supporting bracket; Piston plate and piston rod are arranged in shell or the sleeve movingly, and piston rod passes upper substrate and is connected with supporting bracket; Be provided with elasticity reset device between piston plate and the upper substrate.
Preferably, be provided with sealing device between described shell or sleeve and the groove lid.
Preferably, described second drive unit is in transmission connection by synchronous band and cylinder baffle.
Preferably, described holing clip subnumber order is more than two, and plural clamping clip along the circumferential direction distributes.
Preferably, the lower surface of described infrabasal plate is provided with plural reference column, and described reference column along the circumferential direction distributes.
Preferably, has draw-in groove between the lower surface of described reference column and infrabasal plate.
Second purpose of the present utility model provides a kind of wafer rinse bath.
The wafer rinse bath is characterized in that, comprises aforesaid wafer device for clamping and rotating, also comprises cell body, and cell body is provided with vallecular cavity; Described wafer device for clamping and rotating is hinged on the notch of cell body.
Wafer device for clamping and rotating in the utility model, both fixing wafer can drive the wafer rotation again.Can guarantee comprehensive cleaning wafer during cleaning, cleaning performance is even.Electroplate or during etching, both can guarantee to electroplate or each position of etched wafer, can guarantee again to electroplate, etching is even.And the utility model is easy to use.
Description of drawings
Fig. 1 is the utility model embodiment 1 structural representation.
Fig. 2 is the utility model embodiment 1 upward view.
Fig. 3 is the B-B cutaway view of Fig. 2.
Fig. 4 is the utility model embodiment 1 cutaway view stereogram.
Fig. 5 is the B-B cutaway view of the utility model embodiment 2.
Fig. 6 is the utility model embodiment 2 structural representations, and Fig. 6 is the state that the groove lid is opened.
Fig. 7 is the utility model embodiment 2 structural representations, and Fig. 7 is the state of groove lid sealing vallecular cavity.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail:
Embodiment 1
As Fig. 1, Fig. 2, Fig. 3 and shown in Figure 4, the wafer device for clamping and rotating comprises groove lid 50.On the groove lid 50 case 51 is installed.Case 51 has cavity volume 52.Be provided with tubular support 521 and motor 54 in the cavity volume 52.Cylinder 53 comprises shell 531, piston plate 56 and piston rod 532.The shell 531 of cylinder 53 is installed in rotation in the tubular support 521 by two bearings 535.Shell 531 upper ends are equipped with first synchronous pulley 533.First synchronous pulley 533 is positioned at outside the tubular support 521.Second synchronous pulley 61 is installed on the output shaft of motor 54.By synchronous band (not shown), motor 54 drives cylinder 53 rotations.Shell 531 lower ends are equipped with sleeve 55.Shell 531 and sleeve 55 all are rotatably mounted on the groove lid 50, and sleeve 55 passes groove lid 50 and is connected with upper substrate 20.Between shell 531 and the groove lid 50, sleeve 55 is provided with O type circle 58 between covering 50 with groove.Piston plate 56 is arranged in the sleeve 55 movably with piston rod 532, and can be subjected to source of the gas and compress the spring promotion and move.Be provided with two compression springs 57 between piston plate 56 and the upper substrate 20.Piston rod 532 upper ends are connected with piston plate 56, and pass groove lid 50 and upper substrate 20, and its lower end is connected with supporting bracket 30.
Supporting bracket 30 is arranged between infrabasal plate 10 and the upper substrate 20.Clamping clip 31 comprises coupler body 311 and connecting rod 312.Coupler body 311 is arranged on connecting rod 312 lower ends.Connecting rod 312 upper ends are connected with supporting bracket 30.Clamping clip 31 numbers are six, and six clamping clips 31 along the circumferential direction distribute.Each connecting rod 32 passes infrabasal plate 10, and its lower end connects coupler body 311.Coupler body 311 extends to infrabasal plate 10 centers from connecting rod 312.Coupler body 311 extends to infrabasal plate 10 centers can clamp the length that is placed on eight wafers 60 between the reference column 12.
In the utility model, be cylinder 53 air feed, piston rod 532 promotes supporting bracket 30 downwards towards infrabasal plate 10 motions, moves down thereby promote clamping clip 31.Compress spring 57 compressed generation elastic deformation forces this moment, clamping clip 31 moves down the back and has certain distance with infrabasal plate 10 lower surfaces.Wafer 60 is put between eight reference columns 12, and wafer 60 edges are between the lower surface of six coupler bodies 311 and infrabasal plate 10.Eight reference columns 12 help to locate the position of wafer 60.After wafer 60 is in place, cut off the source of the gas of cylinder 53.Piston plate 56 is homing under the effect of compression spring 57, drive piston rod 532 and supporting bracket 20 and move up, thereby pulling coupler body 311 is near infrabasal plate 10 lower surfaces.Move to until coupler body 311 and to press wafer 60 edges, wafer 60 is fixed on the lower surface of infrabasal plate 10.After wafer 60 positions were completely fixed, starter motor 54 drove shell 531 rotations of cylinder 53 by synchronous band, and then drove upper substrate 20 and infrabasal plate 10 rotations.The wafer 60 that is clamped in infrabasal plate 10 lower surfaces is rotated synchronously.
Embodiment 2
Present embodiment is with the difference of implementing 1, as shown in Figure 5, sleeve 55 is not set.The shell 531 of cylinder is rotatably mounted on the groove lid 50, and is connected with upper substrate 30 after passing groove lid 50.Piston plate 56 is arranged in the shell 531 movably.Be provided with O type circle 58 between shell 531 and the groove lid 50.All the other structures are identical with enforcement 1.
Embodiment 3
As Fig. 6, shown in Figure 7, the wafer rinse bath comprises wafer device for clamping and rotating and cell body 70 among embodiment 1 or the embodiment 2.Cell body 70 is provided with vallecular cavity 71.Groove lid 50 is hinged on the cell body 70, installs turningly.After wafer 60 was fixed, turning groove lid 50 made it seal vallecular cavity 71 as shown in Figure 6, and rinse water enters from cell body 70 lower ends, travels up to and wafer 60 position contacting, cleaning wafer 60.In the cleaning process, the wafer device for clamping and rotating drives wafer 60 rotations.
Embodiment in the utility model only is used for the utility model is described, and does not constitute the restriction to the claim scope, and other substituting of being equal in fact that those skilled in that art can expect are all in the utility model protection range.
Claims (23)
1. the wafer device for clamping and rotating is characterized in that, comprising:
Lower surface is used for the fixedly infrabasal plate of wafer, and described infrabasal plate rotatably arranges;
The clamping clip; Described clamping clip comprises the coupler body that extends to substrate center; Coupler body is positioned at the infrabasal plate below; Coupler body is subjected to drive and can arranges towards the infrabasal plate motion with away from infrabasal plate reciprocating motion ground.
2. wafer device for clamping and rotating according to claim 1 is characterized in that, also comprises first drive unit, and described first drive unit and described clamping clip are in transmission connection, and drive described coupler body and move back and forth.
3. wafer device for clamping and rotating according to claim 2 is characterized in that, also comprises supporting bracket; Described supporting bracket is positioned at the infrabasal plate top, and supporting bracket is subjected to drive towards the infrabasal plate motion or away from infrabasal plate and moves; The clamping clip is connected with supporting bracket, and the clamping clip is subjected to the supporting bracket actuation movement.
4. wafer device for clamping and rotating according to claim 3 is characterized in that, also comprises upper substrate; Upper substrate and infrabasal plate arrange at interval and interconnect, and supporting bracket is between upper substrate and infrabasal plate; The clamping clip is connected with supporting bracket, and supporting bracket and coupler body lay respectively at infrabasal plate both sides up and down.
5. wafer device for clamping and rotating according to claim 3 is characterized in that, the power take-off of described first drive unit drives supporting bracket and moves towards infrabasal plate; Also comprise elasticity reset device, described elasticity reset device produces the elastic deformation force in supporting bracket when infrabasal plate moves; This elastic deformation force has the supporting bracket of making away from the trend of infrabasal plate.
6. wafer device for clamping and rotating according to claim 5 is characterized in that, the power take-off mechanism of described first drive unit is provided with piston plate; Elasticity reset device is the compression spring; Compression spring one end is resisted against on the piston plate, and the other end is resisted against on the upper substrate.
7. wafer device for clamping and rotating according to claim 6 is characterized in that, first drive unit is the unidirectional power output device.
8. wafer device for clamping and rotating according to claim 4 is characterized in that, first drive unit is two-way reciprocating drive unit.
9. wafer device for clamping and rotating according to claim 2 is characterized in that, described clamping clip also comprises connecting rod, and coupler body is arranged on the connecting rod bottom, and coupler body extends from the downward substrate center of connecting rod; Connecting rod passes infrabasal plate, and the upper end is connected with supporting bracket; Supporting bracket and coupler body lay respectively at infrabasal plate both sides up and down.
10. wafer device for clamping and rotating according to claim 2 is characterized in that, also comprises second drive unit; Second drive unit and infrabasal plate are in transmission connection; Second drive unit drives infrabasal plate and arranges rotatably.
11. wafer device for clamping and rotating according to claim 10 is characterized in that, second drive unit and first drive unit are in transmission connection, and second drive unit drives the infrabasal plate rotation by driving the rotation of first drive unit.
12. wafer device for clamping and rotating according to claim 11 is characterized in that, also comprises upper substrate; Upper substrate and infrabasal plate arrange at interval and interconnect; First drive unit is connected with upper substrate, drives the upper substrate rotation during rotation of first drive unit and the rotation of drive infrabasal plate.
13. wafer device for clamping and rotating according to claim 12 is characterized in that, also comprises supporting bracket, supporting bracket is arranged between upper substrate and the infrabasal plate movingly; The clamping clip passes infrabasal plate and is connected with supporting bracket; First drive unit and supporting bracket are in transmission connection, and first drive unit drives the supporting bracket motion.
14. wafer device for clamping and rotating according to claim 12 is characterized in that, also comprises groove lid and case; The groove lid is articulated in the cell body upper end; Case is installed on groove and covers, and case has a cavity volume; Described first drive unit and second drive unit all are arranged in the cavity volume, and first drive unit is rotatably mounted in groove and covers.
15. wafer device for clamping and rotating according to claim 14 is characterized in that, described first drive unit comprises shell and power take-off; Power take-off is connected with supporting bracket; Described shell rotatably is arranged at groove and covers and pass groove lid and be connected with upper substrate.
16. wafer device for clamping and rotating according to claim 15 is characterized in that described shell is connected by sleeve with upper substrate; Sleeve set is at outer casing end, and is rotatably installed in groove and covers, and sleeve passes described groove lid.
17. according to claim 15 or 16 described wafer device for clamping and rotating, it is characterized in that described power take-off comprises piston plate and piston rod; The piston rod upper end is connected with piston plate, and the lower end is connected with supporting bracket; Piston plate and piston rod are arranged in shell or the sleeve movingly, and piston rod passes upper substrate and is connected with supporting bracket; Be provided with elasticity reset device between piston plate and the upper substrate.
18. according to claim 15 or 16 described wafer device for clamping and rotating, it is characterized in that, be provided with sealing device between described shell or sleeve and the groove lid.
19. wafer device for clamping and rotating according to claim 11 is characterized in that, described second drive unit is in transmission connection by synchronous band and cylinder baffle.
20. wafer device for clamping and rotating according to claim 1 is characterized in that, described holing clip subnumber order is more than two, and plural clamping clip along the circumferential direction distributes.
21. wafer device for clamping and rotating according to claim 1 is characterized in that the lower surface of described infrabasal plate is provided with plural reference column, described reference column along the circumferential direction distributes.
22. wafer device for clamping and rotating according to claim 21 is characterized in that, has draw-in groove between the lower surface of described reference column and infrabasal plate.
23. the wafer rinse bath is characterized in that, comprises the described wafer device for clamping and rotating of aforementioned arbitrary claim, also comprises cell body, cell body is provided with vallecular cavity; Described wafer device for clamping and rotating is hinged on the notch of cell body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220749855 CN203225246U (en) | 2012-12-31 | 2012-12-31 | Wafer clamping rotating device and wafer cleaning groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220749855 CN203225246U (en) | 2012-12-31 | 2012-12-31 | Wafer clamping rotating device and wafer cleaning groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203225246U true CN203225246U (en) | 2013-10-02 |
Family
ID=49252241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220749855 Expired - Lifetime CN203225246U (en) | 2012-12-31 | 2012-12-31 | Wafer clamping rotating device and wafer cleaning groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203225246U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151291A (en) * | 2012-12-31 | 2013-06-12 | 上海新阳半导体材料股份有限公司 | Wafer-clamping rotary device and wafer-washing groove |
-
2012
- 2012-12-31 CN CN 201220749855 patent/CN203225246U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151291A (en) * | 2012-12-31 | 2013-06-12 | 上海新阳半导体材料股份有限公司 | Wafer-clamping rotary device and wafer-washing groove |
| CN103151291B (en) * | 2012-12-31 | 2016-06-01 | 上海新阳半导体材料股份有限公司 | Wafer device for clamping and rotating and wafer rinse bath |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103065996B (en) | Wafer surface treatment device | |
| CN204912146U (en) | A universal cleaning equipment for refabrication of automatic transmission casing | |
| CN103151291A (en) | Wafer-clamping rotary device and wafer-washing groove | |
| CN201440405U (en) | Silicon chip spraying cleaning tank | |
| CN208059674U (en) | A kind of hot-water heating pipe cleaning device for outer walls | |
| CN203620983U (en) | Cleaning device for surface of aluminum rod | |
| CN203118915U (en) | Wafer surface treatment device | |
| CN203225246U (en) | Wafer clamping rotating device and wafer cleaning groove | |
| CN215314104U (en) | High-precision aluminum plate's belt cleaning device | |
| CN208643475U (en) | A kind of lossless Quick cleaning device of lens of laparoscope | |
| CN205762684U (en) | A kind of convenient ultrasonic electric integral cleaning machine cleaning bottle interior | |
| CN211679163U (en) | Reation kettle convenient to wash | |
| CN210706156U (en) | Glove dyeing device | |
| CN115672842B (en) | Cleaning device for processing of iron artware | |
| CN215143153U (en) | Cleaning device for production of toughened glass | |
| CN108686997A (en) | A kind of spare parts processing machinery device of machinery field | |
| CN101890416B (en) | Cleaner for inner wall of steel pipe | |
| CN201735561U (en) | Cleaning device for inner wall of steel pipe | |
| CN211386160U (en) | Be used for copper pipe inner wall cleaning equipment | |
| CN210497395U (en) | Belt cleaning device is used in production of LED lamps and lanterns | |
| CN204107124U (en) | A kind of automatic developing machine for high-pressure pressure filter | |
| CN210541416U (en) | Automatic cup washing machine | |
| CN209577530U (en) | Cleaning device is used in high-frequency mixed-compression board production | |
| CN216618098U (en) | Composite support rod | |
| CN211071054U (en) | Automatic cleaning device for basket filter after offline |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170925 Address after: 201616 Shanghai city Songjiang District Sixian Road No. 3600 Building No. 10 West 1 floor Patentee after: XINYANG GUIMI (SHANGHAI) SEMICONDUCTOR TECHNOLOGY CO.,LTD. Address before: 201616 Shanghai city Songjiang District Sixian Road No. 3600 Patentee before: SHANGHAI SINYANG SEMICONDUCTOR MATERIALS Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131002 |
|
| CX01 | Expiry of patent term |