CN203218695U - Conductive cooling side pumping all-solid-state laser module - Google Patents
Conductive cooling side pumping all-solid-state laser module Download PDFInfo
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- CN203218695U CN203218695U CN 201320149025 CN201320149025U CN203218695U CN 203218695 U CN203218695 U CN 203218695U CN 201320149025 CN201320149025 CN 201320149025 CN 201320149025 U CN201320149025 U CN 201320149025U CN 203218695 U CN203218695 U CN 203218695U
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Abstract
The utility model provides a conductive cooling side pumping all-solid-state laser module comprising two laser modules with the same structure: a first laser module and a second laser module; each of the first laser module and the second laser module sequentially comprises, from top to bottom, a columned laser medium heat sink, a columned laser medium, an arc-shaped semiconductor laser area array and an arc-shaped semiconductor laser area array heat sink; and a light through direction of the laser mediums is made as the axle center of both of the first laser module and the second laser module, and the above parts with the same structure are arranged in a straight line in a manner of corresponding to each other. The conductive cooling side pumping all-solid-state laser module provided by the utility model has the advantages of high output beam quality, high energy exchange efficiency and low integral power consumption.
Description
Technical field
The utility model relates to all solid state laser field, particularly a kind of side pumping full solid-state laser module that conducts cooling.
Background technology
All solid state laser has characteristics such as volume is little, electro-optical efficiency is high, long-play good stability, is widely used in fields such as retrofit, laser ranging, biologic medical and material preparation.The thermal effect problem of all solid state laser interior optics is accompanied by the birth of laser, and is a remarkable and serious problem that hinders the solid state laser development always.The even distribution on laser medium of the uniform pumping of laser medium and pump light is the principal element that influences the energy even degree of laser output laser facula.
The mode of the laser medium cooling of conventional all solid state laser has two kinds: a kind of is the liquid cooling mode, adopt the cooling fluid high velocity stream to cross the side of laser crystal, the heat that produces when taking away laser medium work, another is the conduction cooling, it is heat sink to utilize the laser medium side to be close to, by heat conducting mode laser medium is cooled off, and for than the laser of working under the rugged environment, the laser volume of liquid cooling is too huge, complex structure, reliability is relatively low, and the laser structure of heat sink conduction is simple relatively, the reliability height is more suitable for working under the above-mentioned occasion.
And for the laser of the heat sink conduction cooling of profile pump, pump light will enter the inside of laser medium by the side, and heat sink as laser medium heat radiation, need dispel the heat to laser medium by the side equally, both certainly will have conflict on space structure, cause the laser medium can't Homogeneouslly-radiating, it be uniform causing the laser medium internal heat to distribute then.
Yet enter the pump light of laser medium owing to be subjected to the spacial influence of heat dispersion heat sink structure by the side, it is inhomogeneous equally that pump light distributes.The inhomogeneities of pump light makes that the harmonic light in the laser cavity can't have the better space volume overlapping with it, makes that the laser facula of output is not circular light spot, and has also reduced the whole delivery efficiency of laser.And the inhomogeneities of laser crystal heat distribution causes the uneven distribution of the thermal lens of laser medium, makes the skew of resonant cavity service area, the light spot shape distortion of output.In utility model patent (patent No.: ZL 200420114915.7) " arch semiconductor laser side pump Pu module ", utilize arch semiconductor linear array, the linear array area of coaxial covering laser medium side of trying one's best of arranging, pump light distributes to obtain uniformly, but inevitably reduced the heat sink area of dissipation that contacts with laser medium, because thermal relaxation effect, make the laser medium heat distribution uniformity become very poor, even can't in time take heat out of laser medium, cause crystal itself to produce heat accumulation and restrict the raising of power or the energy of laser.
Summary of the invention
The purpose of this utility model is in the existing technical background, conduction cooling type side-pump laser device module pump light skewness, the heat radiation uniformity is relatively poor and cause laser to be difficult to obtain high light beam quality, the problem of high power output, the laser of the conduction cooling type side pump configuration of a kind of uniform pumping coupling, Homogeneouslly-radiating is provided, to obtain high light beam quality, high power output new pattern laser device.
The technical scheme that the utility model proposes is as follows:
A kind of side pumping full solid-state laser module that conducts cooling, comprise the identical laser module of two block structures: first laser module and second laser module, described first laser module and second laser module comprise successively that from top to bottom heat sink, the cylindric laser medium of cylindric laser medium, circular arc type semiconductor laser face battle array and circular arc type semiconductor laser face battle array are heat sink; First laser module and second laser module are with laser medium optical direction concentric, and above-mentioned each identical in structure parts mode is in correspondence with each other arranged point-blank; Wherein, first laser module comprises that the first cylindric laser medium is heat sink, the first cylindric laser medium, the first circular arc type semiconductor laser face battle array and the first circular arc type semiconductor laser face battle array are heat sink; Second laser module comprises that the second cylindric laser medium is heat sink, the second cylindric laser medium, the second circular arc type semiconductor laser face battle array and the second circular arc type semiconductor laser face battle array are heat sink.
Preferably, the described first and second cylindric laser mediums are the Nd:YAG crystal of low concentration doping, or crystal such as Nd:YVO4, Nd:GdVO4 or Nd:YLF, and two ends are coated with the anti-reflection film of optical maser wavelength.
Preferably, the size of the described first and second cylindric laser mediums and index are identical.
Preferably, size and the index of the described first and second circular arc type semiconductor laser face battle arrays are identical, and the axle center along the first and second cylindric laser mediums evenly is arranged in the heat sink inboard of the first and second circular arc type semiconductor laser face battle arrays respectively.
Preferably, 180 ° side of the described first and second cylindric laser medium sides respectively with heat sink contact of the first and second circular arc type semiconductor laser face battle arrays, connected mode between the first cylindric laser medium and the first circular arc type semiconductor laser face battle array are heat sink, between the second cylindric laser medium and the second circular arc type semiconductor laser face battle array are heat sink is to be bonded together with glue, and is perhaps with the mode of welding that both are welded together.
Preferably, the described first and second circular arc type semiconductor laser face battle arrays are heat sink to be semicircular structure, the inner evenly parallel arrangement strip semiconductor laser of its circular arc, the heat sink length of the first and second circular arc type semiconductor laser face battle arrays is the integral multiple of strip semiconductor laser, purpose is to arrange many group strip semiconductor lasers along central axial direction.
With existing technology contrast, characteristics of the present utility model are, two inhomogeneous pumpings, the laser medium of non-homogeneous heat radiation, coaxial placement, structure is placed in correspondence with each other, thereby reach complementary effect, make a laser medium evenly distribute and partly replenish another non-homogeneous part, the non-homogeneous part of laser medium before another laser medium evenly distributes and partly replenishes simultaneously, the laser that makes both produce produces the optical coherence synergistic effect in laserresonator interior resonance process, thereby the laser facula that makes output presents circular symmetry to distribute, to obtain high light beam quality, high-power laser output.
Description of drawings
Fig. 1 is the schematic diagram according to the side pumping full solid-state laser module of the conduction cooling of the utility model embodiment.
Reference numeral is as follows:
1.1: cylindric laser medium 1.2: circular arc type semiconductor laser face battle array 1.3: cylindric laser medium is heat sink
1.4: circular arc type semiconductor laser face battle array heat sink 1.6: cylindric laser medium 1.6: circular arc type semiconductor laser face battle array
1.7: circular arc type semiconductor laser face battle array heat sink 1.8: cylindric laser medium is heat sink
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing and embodiment, but be not limited thereto.
As shown in Figure 1, a kind of side pumping full solid-state laser module that conducts cooling, comprise the identical laser module of two block structures: the first laser module a and the second laser module b, the described first laser module a and the second laser module b comprise successively that from top to bottom heat sink, the cylindric laser medium of cylindric laser medium, circular arc type semiconductor laser face battle array and circular arc type semiconductor laser face battle array are heat sink; The first laser module a and the second laser module b arrange point-blank with laser medium optical direction concentric, each identical in structure parts mode in correspondence with each other.
Wherein, the first laser module a comprises the first cylindric laser medium heat sink 1.3, the first cylindric laser medium 1.1, the first circular arc type semiconductor laser face battle array 1.2 and the first circular arc type semiconductor laser face battle array heat sink 1.4; The second laser module b comprises the second cylindric laser medium heat sink 1.7, the second cylindric laser medium 1.5, the second circular arc type semiconductor laser face battle array 1.6 and the second circular arc type semiconductor laser face battle array heat sink 1.8.
Wherein, the described first circular arc type semiconductor laser face battle array 1.2 and the second circular arc type semiconductor laser face battle array 1.6 are made up of a plurality of diode laser array unit respectively, diode laser array is arranged along the central axis of the logical light face of laser medium, the spacing of arranging is identical, and the needs of how much exporting according to the laser integral energy of the diode laser array quantity of arranging come calmly.The described first circular arc type semiconductor laser face battle array 1.2 and the second circular arc type semiconductor laser face battle array 1.6 are welded on respectively on the first circular arc type semiconductor laser face battle array heat sink 1.4 and the second circular arc type semiconductor laser face battle array heat sink 1.7, realize good thermal conduction effect, make the laser diode stack good heat radiating.And because semiconductor laser is evenly arranged, the pump light that produces is evenly distributed on the side of the laser medium close with it, there are two laser modules to arrange along coaxial again, the complementary pumping homogeneity of pump light has guaranteed the uniformity of the distribution of photons of pump light on the cross section of the axis of Laser emission.
The described first cylindric laser medium 1.1 and the first cylindric laser medium heat sink 1.3 link together, and the described second cylindric laser medium 1.5 and the second cylindric laser medium heat sink 1.8 link together.The described first and second cylindric laser mediums are two blocks of identical Nd:YAG laser crystals, and its neodymium ion doped concentration is 0.6%-1%, and the crystal bar diameter is φ 5mm-φ 8mm, and length 40mm is to 80mm.The side that the semi arch of its side is 180 ° tightly contacts with heat sink semicircle cambered surface, playing the effect of crystal heat radiation, laser medium and heat sink between connected mode can be that be bonded together with glue also can be welded together with both with the mode of welding.
The corresponding characteristics of placing of two modules of described a, b, make that also the radiator structure of two laser crystals also is complementary, make inhomogeneous two laser of original heat distribution on the cross section of its optical direction, arrive complementation, the final laser that also makes is when the resonant cavity interior resonance, obtain even complementation, and the laser facula uniformity of output improves.
Cross section coupling that the uniform pump light of laser medium is coupled, laser medium dispels the heat has uniformly guaranteed this laser output laser facula outgoing cross section energy distribution uniformity, and spatial model is overlapping to greatest extent in laser medium inside also to make the laser of pump light and laser cavity interior resonance, improve laser medium to the absorption transformation efficiency of pump light, increase the energy of laser output.By as can be seen above, by optimizing laser medium pump light coupling uniformity and laser medium heat radiation cross section coupling uniformity, namely improved the beam quality of laser output beam, also increased the energy conversion efficiency of system.
What described semicircular arc semiconductor laser face battle array was heat sink is semicircular structure, the circular arc axis coinciding of its circular arc axle center and laser medium, material is red copper or other thermal conductivity preferred metal materials processing, and the unnecessary heat that makes semiconductor laser produce when work is dispelled the heat timely.
The thermal conductivity preferred metal materials processing that described cylindric laser medium heat sink material is red copper, its semicircle cambered surface and laser medium are fitted closely good.
Preferably, the described first and second cylindric laser mediums are the Nd:YAG crystal of low concentration doping, or crystal such as Nd:YVO4, Nd:GdVO4 or Nd:YLF, and two ends are coated with the anti-reflection film of optical maser wavelength.
Preferably, the size of the described first and second cylindric laser mediums and index are identical.
Preferably, the described first and second circular arc type semiconductor laser face battle arrays, its size and index are identical, and the axle center along the first and second cylindric laser mediums evenly is arranged in the heat sink inboard of the first and second circular arc type semiconductor laser face battle arrays respectively.
Preferably, the described first and second cylindric laser mediums, 180 ° side of its side respectively with heat sink contact of the first and second circular arc type semiconductor laser face battle arrays, connected mode between the first cylindric laser medium and the first circular arc type semiconductor laser face battle array are heat sink, between the second cylindric laser medium and the second circular arc type semiconductor laser face battle array are heat sink is to be bonded together with glue, and is perhaps with the mode of welding that both are welded together.
Preferably, the described first and second circular arc type semiconductor laser face battle arrays are heat sink to be semicircular structure, the inner evenly parallel arrangement strip semiconductor laser of its circular arc, the heat sink length of the first and second circular arc type semiconductor laser face battle arrays is the integral multiple of strip semiconductor laser, purpose is to arrange many group strip semiconductor lasers along central axial direction.
The side pumping full solid-state mode of laser of the conduction cooling that the utility model proposes has following advantage:
1, output beam quality is good.Adopt the pumping configuration of symmetrical complement and the laser medium radiator structure of symmetrical complement, improved the laser output mode, optimized the Laser Output Beam quality.
2, energy conversion efficiency height.The cross section coupling of dispelling the heat uniformly of the coupling of the uniform pump light of laser medium, laser medium makes the laser of pump light and laser cavity interior resonance spatial model is overlapping to greatest extent in laser medium inside, improve laser medium to the absorption transformation efficiency of pump light, increase the energy of laser output.
3, Overall Power Consumption is low.Owing to adopt semiconductor laser as the pumping source of module, improved the energy conversion efficiency of module, reduced Overall Power Consumption.
Should be noted that at last above embodiment is only in order to illustrate that the technical solution of the utility model is not intended to limit; Although with reference to preferred embodiment the utility model is had been described in detail; those of ordinary skill in the field are to be understood that; still can make amendment or the part technical characterictic is equal to the embodiment of this utility model and replace and do not break away from the spirit of technical solutions of the utility model, it all should be contained in the middle of the technical scheme scope that the utility model asks for protection.
Claims (6)
1. side pumping full solid-state laser module that conducts cooling, comprise the identical laser module of two block structures: first laser module (a) and second laser module (b) is characterized in that: described first laser module (a) and second laser module (b) comprise successively that from top to bottom heat sink, the cylindric laser medium of cylindric laser medium, circular arc type semiconductor laser face battle array and circular arc type semiconductor laser face battle array are heat sink; First laser module (a) and second laser module (b) are with laser medium optical direction concentric, and above-mentioned each identical in structure parts mode is in correspondence with each other arranged point-blank; Wherein, first laser module (a) comprises the first cylindric laser medium heat sink (1.3), the first cylindric laser medium (1.1), the first circular arc type semiconductor laser face battle array (1.2) and the first circular arc type semiconductor laser face battle array heat sink (1.4); The second laser module b comprises the second cylindric laser medium heat sink (1.7), the second cylindric laser medium (1.5), the second circular arc type semiconductor laser face battle array (1.6) and the second circular arc type semiconductor laser face battle array heat sink (1.8).
2. the side pumping full solid-state laser module of conduction as claimed in claim 1 cooling, it is characterized in that: the described first and second cylindric laser mediums (1.1,1.5) be the Nd:YAG crystal of low concentration doping, or Nd:YVO4, Nd:GdVO4 or Nd:YLF crystal, two ends are coated with the anti-reflection film of optical maser wavelength.
3. the side pumping full solid-state laser module of conduction as claimed in claim 2 cooling, it is characterized in that: size and the index of the described first and second cylindric laser mediums (1.1,1.5) are identical.
4. the side pumping full solid-state laser module of conduction as claimed in claim 1 cooling, it is characterized in that: the described first and second circular arc type semiconductor laser face battle arrays (1.2,1.6) size and index identical, respectively along the first and second cylindric laser mediums (1.1,1.5) the axle center evenly be arranged in first and second circular arc type semiconductor laser face battle array heat sink (1.4, the 1.8) inboards.
5. the side pumping full solid-state laser module of conduction as claimed in claim 1 cooling, it is characterized in that: the described first and second cylindric laser mediums (1.1,1.5) 180 ° side of side respectively with the first and second circular arc type semiconductor laser face battle arrays heat sink (1.4,1.8) contact, between the first cylindric laser medium (1.1) and the first circular arc type semiconductor laser face battle array heat sink (1.4), connected mode between the second cylindric laser medium (1.5) and the second circular arc type semiconductor laser face battle array heat sink (1.8) is to be bonded together with glue, and is perhaps with the mode of welding that both are welded together.
6. the side pumping full solid-state laser module of conduction as claimed in claim 4 cooling, it is characterized in that: the described first and second circular arc type semiconductor laser face battle arrays heat sink (1.4,1.8) be semicircular structure, the inner evenly parallel arrangement strip semiconductor laser of its circular arc, the length of the first and second circular arc type semiconductor laser face battle arrays heat sink (1.4,1.8) is the integral multiple of strip semiconductor laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320149025 CN203218695U (en) | 2013-03-29 | 2013-03-29 | Conductive cooling side pumping all-solid-state laser module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320149025 CN203218695U (en) | 2013-03-29 | 2013-03-29 | Conductive cooling side pumping all-solid-state laser module |
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| CN203218695U true CN203218695U (en) | 2013-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320149025 Expired - Lifetime CN203218695U (en) | 2013-03-29 | 2013-03-29 | Conductive cooling side pumping all-solid-state laser module |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105305218A (en) * | 2015-12-05 | 2016-02-03 | 中国航空工业集团公司洛阳电光设备研究所 | All solid state laser |
| CN106129793A (en) * | 2016-08-11 | 2016-11-16 | 南京伏尔甘光电科技有限公司 | A kind of DPL pulse laser side pump housing |
| CN111952825A (en) * | 2020-08-19 | 2020-11-17 | 科谱(宁波)科技有限公司 | Gain medium cooling device of laser |
-
2013
- 2013-03-29 CN CN 201320149025 patent/CN203218695U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105305218A (en) * | 2015-12-05 | 2016-02-03 | 中国航空工业集团公司洛阳电光设备研究所 | All solid state laser |
| CN106129793A (en) * | 2016-08-11 | 2016-11-16 | 南京伏尔甘光电科技有限公司 | A kind of DPL pulse laser side pump housing |
| CN111952825A (en) * | 2020-08-19 | 2020-11-17 | 科谱(宁波)科技有限公司 | Gain medium cooling device of laser |
| CN111952825B (en) * | 2020-08-19 | 2023-01-13 | 科谱(宁波)科技有限公司 | Gain medium cooling device of laser |
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Granted publication date: 20130925 |
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