CN203217470U - Computer radiating device - Google Patents
Computer radiating device Download PDFInfo
- Publication number
- CN203217470U CN203217470U CN 201320279832 CN201320279832U CN203217470U CN 203217470 U CN203217470 U CN 203217470U CN 201320279832 CN201320279832 CN 201320279832 CN 201320279832 U CN201320279832 U CN 201320279832U CN 203217470 U CN203217470 U CN 203217470U
- Authority
- CN
- China
- Prior art keywords
- hole
- clamp plate
- injection
- press plate
- computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000002347 injection Methods 0.000 claims abstract description 20
- 239000007924 injection Substances 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 230000017525 heat dissipation Effects 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims description 7
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 4
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 4
- 241001330002 Bambuseae Species 0.000 claims description 4
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 4
- 239000011425 bamboo Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 abstract description 6
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a computer radiating device which comprises a quadrangular fastening plate, a quadrangular injection press plate, a quadrangular flexible sealing strip and a chip press plate. A fixed through hole is formed in each corner of the fastening plate, a flow-in through hole and a flow-out through hole are formed in the middle of the injection press plate, an injection tube is arranged in the middle at the bottom of the injection press plate, the injection tube is communicated with the flow-in through hole, a flow guide strip arranged spirally is arranged in the upper surface of the chip press plate, and a radiating protrusion array composed of radiating protrusions is arranged in the flow guide strip. According to the computer radiating device, the flow guide strip arranged spirally and the radiating protrusion array in the flow guide strip on the chip press plate are utilized, rotation flowing of cooling water in the chip press plate can be effectively guided, heat exchange time of cooling water is greatly improved, and radiating performance of the radiating device is improved.
Description
Technical Field
The present invention relates to a computer device, and more particularly, to a computer heat dissipation device.
Background
During the operation of the computer, a large amount of heat is generated, and if the heat is not discharged in time, the performance of the computer is seriously affected. Most of the existing heat dissipation modes are air-cooled heat dissipation or water-cooled heat dissipation, particularly water-cooled heat dissipation, and the effect is good, but the effect of the existing water-cooled heat sink still needs to be improved.
SUMMERY OF THE UTILITY MODEL
The utility model discloses solve the technical problem that prior art exists to a computer heat abstractor is provided.
The above technical problem of the present invention can be solved by the following technical solutions:
the utility model provides a computer heat abstractor, computer heat abstractor contain a tetragonal buckle, the injection clamp plate of a square, a tetragonal flexible sealing strip and a chip clamp plate, the four corners of buckle on be equipped with a fixed through hole respectively, the middle part of injection clamp plate be equipped with an inflow through-hole and an outflow through-hole, the bottom central authorities of injection clamp plate be equipped with an injection section of thick bamboo, the injection section of thick bamboo with the inflow through-hole link up mutually, the upper surface of chip clamp plate in be equipped with the water conservancy diversion strip of a spiral setting, the water conservancy diversion strip in be equipped with the outstanding array of heat dissipation of constituteing by the heat dissipation.
As the embodiment of the utility model discloses the preferred, injection clamp plate and chip clamp plate be copper integrated into one piece.
As the preferred embodiment of the present invention, the heat dissipation protrusion is cylindrical.
The utility model discloses a computer heat abstractor utilizes the outstanding array of heat dissipation in the water conservancy diversion strip and the water conservancy diversion strip of the spiral setting on the chip clamp plate, can effectively guide the cooling water to circle round in the chip clamp plate and flow, has improved the time that the cooling water participated in the heat transfer greatly, has improved this heat abstractor's heat dispersion.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an exploded schematic view of a three-dimensional structure of a computer heat dissipation device of the present invention;
FIG. 2 is an exploded perspective view of the heat dissipation device of FIG. 1, shown from another perspective;
FIG. 3 is an enlarged detail view of area A of the computer heat sink of FIG. 1;
FIG. 4 is an enlarged detail view of the area C of the computer heat sink of FIG. 3;
FIG. 5 is an enlarged detail view of the area B of the computer heat sink of FIG. 2;
wherein,
1. a computer heat sink; 2. buckling the plate; 21. a fixing through hole; 3. injecting a pressing plate; 31. an injection cylinder; 32. an inflow through hole; 33. an outflow through hole; 4. a sealing strip; 5. pressing a chip plate; 51. a flow guide strip; 52. the heat dissipation is outstanding.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the scope of the present invention can be more clearly and clearly defined.
The utility model provides a computer heat abstractor.
As shown in fig. 1 to 5, the utility model discloses a computer heat abstractor 1 contains a tetragonal buckle 2, a tetragonal injection clamp plate 3, a tetragonal flexible sealing strip 4 and a chip clamp plate 5, be equipped with a fixing hole 21 on the four corners of this buckle 2 respectively, the middle part that should pour into clamp plate 3 is equipped with an inflow through-hole 32 and an outflow through-hole 33, the bottom central authorities that should pour into clamp plate 3 are equipped with an injection cylinder 31, this injection cylinder 31 link up with this inflow through-hole 32 mutually, be equipped with a spiral arrangement's water conservancy diversion strip 51 in this chip clamp plate 5's the upper surface, be equipped with the outstanding array of heat dissipation of constituteing by the outstanding 52 of heat dissipation in this water conservancy diversion strip 51.
The injection platen 3 and the die platen 5 are both integrally formed of copper.
The heat dissipating protrusion 52 has a cylindrical shape.
The utility model discloses a computer heat abstractor utilizes the outstanding array of heat dissipation in the water conservancy diversion strip and the water conservancy diversion strip of the spiral setting on the chip clamp plate, can effectively guide the cooling water to circle round in the chip clamp plate and flow, has improved the time that the cooling water participates in the heat transfer greatly, has improved this heat abstractor's heat dispersion.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (3)
1. The utility model provides a computer heat abstractor, characterized in that, computer heat abstractor (1) contain tetragonal buckle (2), the injection clamp plate (3) of a square, tetragonal flexible sealing strip (4) and a chip clamp plate (5), the four corners of buckle (2) on be equipped with a fixed through hole (21) respectively, the middle part of injection clamp plate (3) be equipped with one and flow in through-hole (32) and a play through-hole (33), the bottom central authorities of injection clamp plate (3) be equipped with one and pour into a section of thick bamboo (31), pour into a section of thick bamboo (31) with flow in through-hole (32) link up mutually, the upper surface of chip clamp plate (5) in be equipped with a spiral setting's water conservancy diversion strip (51), water conservancy diversion strip (51) in be equipped with the outstanding array of heat dissipation of constituteing by heat dissipation outstanding (52).
2. The heat sink for computer according to claim 1, wherein the injection platen (3) and the die platen (5) are both integrally formed of copper.
3. The heat dissipating device of claim 2, wherein the heat dissipating protrusion (52) has a cylindrical shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320279832 CN203217470U (en) | 2013-05-08 | 2013-05-08 | Computer radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320279832 CN203217470U (en) | 2013-05-08 | 2013-05-08 | Computer radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203217470U true CN203217470U (en) | 2013-09-25 |
Family
ID=49206988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320279832 Expired - Fee Related CN203217470U (en) | 2013-05-08 | 2013-05-08 | Computer radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203217470U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105283038A (en) * | 2014-07-22 | 2016-01-27 | 西门子公司 | Cooling device for cooling electronic and/or electric element in targeted manner |
| CN105979753A (en) * | 2016-05-10 | 2016-09-28 | 福建省汽车工业集团云度新能源汽车股份有限公司 | Balanced heat dissipation device and method of electric vehicle |
-
2013
- 2013-05-08 CN CN 201320279832 patent/CN203217470U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105283038A (en) * | 2014-07-22 | 2016-01-27 | 西门子公司 | Cooling device for cooling electronic and/or electric element in targeted manner |
| CN105283038B (en) * | 2014-07-22 | 2018-08-03 | 西门子公司 | Cooling device for pointedly cooling down electronics and/or electrical equipment |
| CN105979753A (en) * | 2016-05-10 | 2016-09-28 | 福建省汽车工业集团云度新能源汽车股份有限公司 | Balanced heat dissipation device and method of electric vehicle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130925 Termination date: 20140508 |