CN203181415U - PCB board with heat dissipation air channel - Google Patents
PCB board with heat dissipation air channel Download PDFInfo
- Publication number
- CN203181415U CN203181415U CN 201320148938 CN201320148938U CN203181415U CN 203181415 U CN203181415 U CN 203181415U CN 201320148938 CN201320148938 CN 201320148938 CN 201320148938 U CN201320148938 U CN 201320148938U CN 203181415 U CN203181415 U CN 203181415U
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- CN
- China
- Prior art keywords
- pcb board
- heat dissipation
- air channel
- inductance
- inductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a PCB board with a heat dissipation air channel. A plurality of inductors (3) are arranged on the PCB board. Heat dissipation holes (2) are arranged around positions where the inductors (3) are arranged on a PCB board body (1) or are arranged among the inductors (3). By using the PCB board of the utility model, the heat dissipation holes arranged around the inductors or among the inductors form the air channel and air convection is generated around the air channel so that temperatures of the inductors around the air channel are reduced.
Description
Technical field
The utility model relates to pcb board, relates in particular to a kind of pcb board that carries heat dissipation wind channel.
Background technology
The heat radiation of inductance is by increasing the every structure class parameter of self, improving heat dispersion and heat resistanceheat resistant performance from inductance itself on the pcb board of existing product.When the pcb board horizontal positioned, inductance is unreasonable because of radiating mode, and temperature is obviously than height when other angle of pcb board is placed.As shown in Figure 1, inductance is placed on the pcb board, and the heat that sends during inductance work only distributes from a direction.Bad because of radiating mode, improve every structure class parameter index at induction structure, increase cost significantly and also increased simultaneously volume, particularly when the pcb board horizontal positioned, even increase the structure class parameter of inductance, can not effectively improve the heat radiation of inductance.
Summary of the invention
The purpose of this utility model is the defective that exists at above-mentioned prior art, and a kind of pcb board that carries heat dissipation wind channel is provided.
The technical solution adopted in the utility model is, designs a kind of pcb board that carries heat dissipation wind channel, and a plurality of inductance are installed on this pcb board, wherein, be equipped with on the pcb board body around the position of inductance or between be provided with louvre.
In one embodiment, described louvre is strip hole, square hole or circular port.
Compared with prior art, adopt pcb board of the present utility model and since inductance around or between the louvre that is provided with form the air channel, make that near the air the air channel produces convection current, thereby reduce near the temperature of the inductance louvre.
Description of drawings
Fig. 1 is the schematic diagram of prior art pcb board.
Fig. 2 is the schematic diagram of the utility model pcb board.
Embodiment
Be described in detail below in conjunction with accompanying drawing 2 and the utility model of embodiment.
As shown in Figure 2, a kind of pcb board that carries heat dissipation wind channel that the utility model proposes is equipped with a plurality of inductance 3 on this pcb board, wherein, be equipped with on the described pcb board body 1 around the position of inductance or between be provided with louvre 2.
In the present embodiment, louvre 2 adopts strip hole, square hole or circular port.
Louvre by car or mill etc. method directly on pcb board body 1 once property process, the size in hole, quantity are adjusted accordingly by the structure class parameter of inductance self.
Adopt pcb board of the present utility model, have a spot of louvre at inductance periphery and bottom, louvre forms heat dissipation wind channel, problem by inductance heat radiation on the effective pcb board that solves of the air energy of flow, very easy and useful to stability that product is provided, and do not influence the cost of product and the volume of inductance.
Above-described embodiment only is used for explanation embodiment of the present utility model.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and variation, these distortion and variation all should belong to protection scope of the present invention.
Claims (2)
1. a pcb board that carries heat dissipation wind channel is equipped with a plurality of inductance (3) on the described pcb board, it is characterized in that: be equipped with on the described pcb board body (1) around the position of inductance (3) or between be provided with louvre (2).
2. pcb board according to claim 1 is characterized in that: described louvre (2) employing strip hole, square hole or circular port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320148938 CN203181415U (en) | 2013-03-29 | 2013-03-29 | PCB board with heat dissipation air channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320148938 CN203181415U (en) | 2013-03-29 | 2013-03-29 | PCB board with heat dissipation air channel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203181415U true CN203181415U (en) | 2013-09-04 |
Family
ID=49078067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320148938 Expired - Fee Related CN203181415U (en) | 2013-03-29 | 2013-03-29 | PCB board with heat dissipation air channel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203181415U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545299A (en) * | 2013-10-21 | 2014-01-29 | 大连德维电子科技有限公司 | High-voltage rectification silicon stack |
| CN106028648A (en) * | 2016-06-28 | 2016-10-12 | 北京中讯四方科技股份有限公司 | Apparatus and method allowing surface acoustic wave device to work normally under high temperature condition |
-
2013
- 2013-03-29 CN CN 201320148938 patent/CN203181415U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545299A (en) * | 2013-10-21 | 2014-01-29 | 大连德维电子科技有限公司 | High-voltage rectification silicon stack |
| CN106028648A (en) * | 2016-06-28 | 2016-10-12 | 北京中讯四方科技股份有限公司 | Apparatus and method allowing surface acoustic wave device to work normally under high temperature condition |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN JINGFUYUAN TECH. CO., LTD. Free format text: FORMER NAME: SHENZHEN JINGFUYUAN TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: Shenzhen Nanshan District City, Guangdong province 518000 white pine Luxili Nangang Second Industrial Park 12 Building 1, 2, 5 floor Patentee after: SHENZHEN JINGFUYUAN TECHNOLOGY CO., LTD. Address before: Shenzhen Nanshan District City, Guangdong province 518000 white pine Luxili Nangang Second Industrial Park twelfth 5 floor Patentee before: Shenzhen Jingfuyuan Tech Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20160329 |