CN203163711U - Novel device for measuring diameter of inner hole of mold - Google Patents
Novel device for measuring diameter of inner hole of mold Download PDFInfo
- Publication number
- CN203163711U CN203163711U CN 201320183525 CN201320183525U CN203163711U CN 203163711 U CN203163711 U CN 203163711U CN 201320183525 CN201320183525 CN 201320183525 CN 201320183525 U CN201320183525 U CN 201320183525U CN 203163711 U CN203163711 U CN 203163711U
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- CN
- China
- Prior art keywords
- inner hole
- mold
- endoporus
- heating
- hopper
- Prior art date
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Abstract
Disclosed is a novel device for measuring diameter of an inner hole of a mold. The problem that existing measurement on an inner hole of a mold is troublesome and not high in accuracy is solved. The device comprises a mounting frame and a heating device, wherein a material hopper used for placing block-shaped low-temperature alloy material is sheathed in the heating device, the mounting frame is provided with a blocking rod, the blocking rod is provided with a first position blocking an inner hole of the material hopper and a second position making the inner hole of the material hopper through, the inner hole of the material hopper corresponds to an inner hole of a to-be-measured mold, and the heating device is connected with a heating controller through a wire. The novel device for measuring the diameter of the inner hole of the mold has the following beneficial effects: the low-temperature alloy material is injected into the inner hole of the to-be-measured mold after being melt through the heating device, and the diameter of the inner hole of the to-be-measured mold can be conveniently and quickly measured after the low-temperature alloy material is solidified; the heating device is controlled by the heating controller so that the heating temperature of the heating device can be better controlled; and the measurement method is fast and the measurement accuracy is high.
Description
Technical field
The utility model relates to a kind of device of novel Measurement die diameter of bore.
Background technology
Methods such as mould industry produce to go up in order to injection moulding, blowing, extrudes, die casting or forging forming, smelting, punching press, stretching obtain various moulds and the instrument of required product.In brief, mould is the instrument of formed article, and this instrument is made of various parts, and different moulds is made of different parts.On the market, the mould of band endoporus can be found everywhere, and the precision of mould often has direct influence to its product processed.The measuring method of existing mould endoporus is measured by internal calliper, and can adopt logical no-go gage or milscale etc. that precision is higher are measured, but it is cumbersome to adopt the mould hole measuring of realizing in such a way.
Summary of the invention
For the measurement that solves existing mold endoporus in the background technology cumbersome, the problem that precision is not high, the utility model provides a kind of device of novel Measurement die diameter of bore.
The technical solution of the utility model is: a kind of device of novel Measurement die diameter of bore, comprise erecting frame and heating arrangement, be arranged with in the described heating arrangement be used to the hopper of laying packaged low-temperature alloy material, described erecting frame is provided with bott stick, described bott stick has the primary importance of stopping up the hopper endoporus and the second place that makes the conducting of hopper endoporus, described hopper endoporus is corresponding with the endoporus of mould to be measured, and described heating arrangement links to each other with heating controller by lead.
As a kind of improvement of the present utility model, described lead is arranged with sleeve pipe outward.
As further improvement of the utility model, described sleeve pipe is provided with rubber sleeve.
As further improvement of the utility model, described sleeve pipe welds mutually respectively at erecting frame, heating arrangement.
As further improvement of the utility model, described erecting frame is provided with dwang, and described bott stick is located at an end of dwang by draw ring.
The beneficial effects of the utility model are, by heating arrangement low-temperature alloy material fusing back is poured in the endoporus of mould to be measured by the hopper endoporus, can conveniently measure the diameter of mould endoporus to be measured after waiting to solidify, heating arrangement is controlled by heating controller, can better control the heating-up temperature of heating arrangement, measuring method is quick, the measuring accuracy height.
Description of drawings
Accompanying drawing 1 is the structural representation of the utility model embodiment.
Accompanying drawing 2 is the cutaway view Amplified image of accompanying drawing 1 heating arrangement 2.
Among the figure, 1, erecting frame; 2, heating arrangement; 3, hopper; 31, hopper endoporus; 4, bott stick; 41, draw ring; 5, lead; 6, heating controller; 7, sleeve pipe; 8, rubber sleeve; 9, dwang.
Embodiment
Below in conjunction with accompanying drawing the utility model embodiment is described further:
By shown in Figure 1, a kind of device of novel Measurement die diameter of bore, comprise erecting frame 1 and heating arrangement 2, be arranged with in the described heating arrangement 2 be used to the hopper 3 of laying packaged low-temperature alloy material, described erecting frame 1 is provided with bott stick 4, described bott stick 4 has the primary importance of stopping up hopper endoporus 31 and the second place that makes 31 conductings of hopper endoporus, described hopper endoporus 31 is corresponding with the endoporus of mould to be measured, and described heating arrangement 2 links to each other with heating controller 6 by lead 5.When mould to be measured is put in hopper endoporus below, to regulate heating controller heating arrangement is heated, this moment, bott stick was in primary importance.Heating controller has the LCDs that shows heating-up temperature, can accurately show the heating-up temperature of heating arrangement, makes packaged low-temperature alloy material to melt fast, is unlikely to again to waste energy simultaneously.Certain packaged low-temperature alloy material also can be selected block sulphur for use, but the expansion coefficient of sulphur is bigger, makes measurement result that error is arranged easily, so the utility model adopts packaged low-temperature alloy material.When packaged low-temperature alloy material is fused into liquid state, make bott stick be in the second place, liquid low-temperature alloy material pours into mould endoporus to be measured along the hopper inwall, bott stick is blocked the hopper endoporus then, after treating liquid low-temperature alloy material solidification, can conveniently measure the diameter of endoporus to be measured.Usually the utility model is used for measuring the diameter of wolfram steel endoporus, and the utility model also can be measured the endoporus of other moulds certainly.The beneficial effects of the utility model are, by heating arrangement low-temperature alloy material fusing back is poured in the endoporus of mould to be measured by the hopper endoporus, can conveniently measure the diameter of mould endoporus to be measured after waiting to solidify, heating arrangement is controlled by heating controller, can better control the heating-up temperature of heating arrangement, measuring method is quick, the measuring accuracy height.
Be arranged with sleeve pipe 7 outside the described lead 5, described sleeve pipe 7 is provided with rubber sleeve 8.Sleeve pipe well guardwire is set, rubber is with good heat-blocking action simultaneously, can be so that the staff is easy to operate.Described sleeve pipe welds mutually respectively at erecting frame 1, heating arrangement 2.Such connected mode is fairly simple, reliable.
Described erecting frame 1 is provided with dwang 9, and described bott stick 4 is located at an end of dwang 9 by draw ring 41.Such structure can be regulated the position of bott stick fast, conveniently, reliably.
Every technician's notice: though the utility model describes according to above-mentioned embodiment; but invention thought of the present utility model is not limited in this utility model; the repacking of any utilization inventive concept all will be included in this patent scope of patent protection.
Claims (5)
1. the device of a novel Measurement die diameter of bore, it is characterized in that: comprise erecting frame (1) and heating arrangement (2), be arranged with in the described heating arrangement (2) be used to the hopper of laying packaged low-temperature alloy material (3), described erecting frame (1) is provided with bott stick (4), described bott stick (4) has the primary importance of stopping up hopper endoporus (31) and the second place that makes hopper endoporus (31) conducting, described hopper endoporus (31) is corresponding with the endoporus of mould to be measured, and described heating arrangement (2) links to each other with heating controller (6) by lead (5).
2. the device of a kind of novel Measurement die diameter of bore according to claim 1 is characterized in that the outer sleeve pipe (7) that is arranged with of described lead (5).
3. the device of a kind of novel Measurement die diameter of bore according to claim 2 is characterized in that described sleeve pipe (7) is provided with rubber sleeve (8).
4. according to the device of claim 2 or 3 described a kind of novel Measurement die diameter of bores, it is characterized in that described sleeve pipe (7) welds mutually respectively at erecting frame (1), heating arrangement (2).
5. the device of a kind of novel Measurement die diameter of bore according to claim 1 is characterized in that described erecting frame (1) is provided with dwang (9), and described bott stick (4) is located at an end of dwang (9) by draw ring (41).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201320183525 CN203163711U (en) | 2013-04-12 | 2013-04-12 | Novel device for measuring diameter of inner hole of mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201320183525 CN203163711U (en) | 2013-04-12 | 2013-04-12 | Novel device for measuring diameter of inner hole of mold |
Publications (1)
Publication Number | Publication Date |
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CN203163711U true CN203163711U (en) | 2013-08-28 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 201320183525 Expired - Fee Related CN203163711U (en) | 2013-04-12 | 2013-04-12 | Novel device for measuring diameter of inner hole of mold |
Country Status (1)
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CN (1) | CN203163711U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105043309A (en) * | 2015-08-13 | 2015-11-11 | 东莞市贝德帕模具科技有限公司 | Method for measuring size of inner hole of mould |
CN108507510A (en) * | 2018-04-02 | 2018-09-07 | 广东劲胜智能集团股份有限公司 | A kind of method and apparatus measuring different amorphous precision part molding difficulty differences |
-
2013
- 2013-04-12 CN CN 201320183525 patent/CN203163711U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105043309A (en) * | 2015-08-13 | 2015-11-11 | 东莞市贝德帕模具科技有限公司 | Method for measuring size of inner hole of mould |
CN108507510A (en) * | 2018-04-02 | 2018-09-07 | 广东劲胜智能集团股份有限公司 | A kind of method and apparatus measuring different amorphous precision part molding difficulty differences |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 Termination date: 20150412 |
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EXPY | Termination of patent right or utility model |