CN203163711U - Novel device for measuring diameter of inner hole of mold - Google Patents

Novel device for measuring diameter of inner hole of mold Download PDF

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Publication number
CN203163711U
CN203163711U CN 201320183525 CN201320183525U CN203163711U CN 203163711 U CN203163711 U CN 203163711U CN 201320183525 CN201320183525 CN 201320183525 CN 201320183525 U CN201320183525 U CN 201320183525U CN 203163711 U CN203163711 U CN 203163711U
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CN
China
Prior art keywords
inner hole
mold
endoporus
heating
hopper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320183525
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Chinese (zh)
Inventor
林玲建
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG KAIYUE FASTENER CO Ltd
Original Assignee
ZHEJIANG KAIYUE FASTENER CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHEJIANG KAIYUE FASTENER CO Ltd filed Critical ZHEJIANG KAIYUE FASTENER CO Ltd
Priority to CN 201320183525 priority Critical patent/CN203163711U/en
Application granted granted Critical
Publication of CN203163711U publication Critical patent/CN203163711U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

Disclosed is a novel device for measuring diameter of an inner hole of a mold. The problem that existing measurement on an inner hole of a mold is troublesome and not high in accuracy is solved. The device comprises a mounting frame and a heating device, wherein a material hopper used for placing block-shaped low-temperature alloy material is sheathed in the heating device, the mounting frame is provided with a blocking rod, the blocking rod is provided with a first position blocking an inner hole of the material hopper and a second position making the inner hole of the material hopper through, the inner hole of the material hopper corresponds to an inner hole of a to-be-measured mold, and the heating device is connected with a heating controller through a wire. The novel device for measuring the diameter of the inner hole of the mold has the following beneficial effects: the low-temperature alloy material is injected into the inner hole of the to-be-measured mold after being melt through the heating device, and the diameter of the inner hole of the to-be-measured mold can be conveniently and quickly measured after the low-temperature alloy material is solidified; the heating device is controlled by the heating controller so that the heating temperature of the heating device can be better controlled; and the measurement method is fast and the measurement accuracy is high.

Description

A kind of device of novel Measurement die diameter of bore
Technical field
The utility model relates to a kind of device of novel Measurement die diameter of bore.
Background technology
Methods such as mould industry produce to go up in order to injection moulding, blowing, extrudes, die casting or forging forming, smelting, punching press, stretching obtain various moulds and the instrument of required product.In brief, mould is the instrument of formed article, and this instrument is made of various parts, and different moulds is made of different parts.On the market, the mould of band endoporus can be found everywhere, and the precision of mould often has direct influence to its product processed.The measuring method of existing mould endoporus is measured by internal calliper, and can adopt logical no-go gage or milscale etc. that precision is higher are measured, but it is cumbersome to adopt the mould hole measuring of realizing in such a way.
Summary of the invention
For the measurement that solves existing mold endoporus in the background technology cumbersome, the problem that precision is not high, the utility model provides a kind of device of novel Measurement die diameter of bore.
The technical solution of the utility model is: a kind of device of novel Measurement die diameter of bore, comprise erecting frame and heating arrangement, be arranged with in the described heating arrangement be used to the hopper of laying packaged low-temperature alloy material, described erecting frame is provided with bott stick, described bott stick has the primary importance of stopping up the hopper endoporus and the second place that makes the conducting of hopper endoporus, described hopper endoporus is corresponding with the endoporus of mould to be measured, and described heating arrangement links to each other with heating controller by lead.
As a kind of improvement of the present utility model, described lead is arranged with sleeve pipe outward.
As further improvement of the utility model, described sleeve pipe is provided with rubber sleeve.
As further improvement of the utility model, described sleeve pipe welds mutually respectively at erecting frame, heating arrangement.
As further improvement of the utility model, described erecting frame is provided with dwang, and described bott stick is located at an end of dwang by draw ring.
The beneficial effects of the utility model are, by heating arrangement low-temperature alloy material fusing back is poured in the endoporus of mould to be measured by the hopper endoporus, can conveniently measure the diameter of mould endoporus to be measured after waiting to solidify, heating arrangement is controlled by heating controller, can better control the heating-up temperature of heating arrangement, measuring method is quick, the measuring accuracy height.
Description of drawings
Accompanying drawing 1 is the structural representation of the utility model embodiment.
Accompanying drawing 2 is the cutaway view Amplified image of accompanying drawing 1 heating arrangement 2.
Among the figure, 1, erecting frame; 2, heating arrangement; 3, hopper; 31, hopper endoporus; 4, bott stick; 41, draw ring; 5, lead; 6, heating controller; 7, sleeve pipe; 8, rubber sleeve; 9, dwang.
Embodiment
Below in conjunction with accompanying drawing the utility model embodiment is described further:
By shown in Figure 1, a kind of device of novel Measurement die diameter of bore, comprise erecting frame 1 and heating arrangement 2, be arranged with in the described heating arrangement 2 be used to the hopper 3 of laying packaged low-temperature alloy material, described erecting frame 1 is provided with bott stick 4, described bott stick 4 has the primary importance of stopping up hopper endoporus 31 and the second place that makes 31 conductings of hopper endoporus, described hopper endoporus 31 is corresponding with the endoporus of mould to be measured, and described heating arrangement 2 links to each other with heating controller 6 by lead 5.When mould to be measured is put in hopper endoporus below, to regulate heating controller heating arrangement is heated, this moment, bott stick was in primary importance.Heating controller has the LCDs that shows heating-up temperature, can accurately show the heating-up temperature of heating arrangement, makes packaged low-temperature alloy material to melt fast, is unlikely to again to waste energy simultaneously.Certain packaged low-temperature alloy material also can be selected block sulphur for use, but the expansion coefficient of sulphur is bigger, makes measurement result that error is arranged easily, so the utility model adopts packaged low-temperature alloy material.When packaged low-temperature alloy material is fused into liquid state, make bott stick be in the second place, liquid low-temperature alloy material pours into mould endoporus to be measured along the hopper inwall, bott stick is blocked the hopper endoporus then, after treating liquid low-temperature alloy material solidification, can conveniently measure the diameter of endoporus to be measured.Usually the utility model is used for measuring the diameter of wolfram steel endoporus, and the utility model also can be measured the endoporus of other moulds certainly.The beneficial effects of the utility model are, by heating arrangement low-temperature alloy material fusing back is poured in the endoporus of mould to be measured by the hopper endoporus, can conveniently measure the diameter of mould endoporus to be measured after waiting to solidify, heating arrangement is controlled by heating controller, can better control the heating-up temperature of heating arrangement, measuring method is quick, the measuring accuracy height.
Be arranged with sleeve pipe 7 outside the described lead 5, described sleeve pipe 7 is provided with rubber sleeve 8.Sleeve pipe well guardwire is set, rubber is with good heat-blocking action simultaneously, can be so that the staff is easy to operate.Described sleeve pipe welds mutually respectively at erecting frame 1, heating arrangement 2.Such connected mode is fairly simple, reliable.
Described erecting frame 1 is provided with dwang 9, and described bott stick 4 is located at an end of dwang 9 by draw ring 41.Such structure can be regulated the position of bott stick fast, conveniently, reliably.
Every technician's notice: though the utility model describes according to above-mentioned embodiment; but invention thought of the present utility model is not limited in this utility model; the repacking of any utilization inventive concept all will be included in this patent scope of patent protection.

Claims (5)

1. the device of a novel Measurement die diameter of bore, it is characterized in that: comprise erecting frame (1) and heating arrangement (2), be arranged with in the described heating arrangement (2) be used to the hopper of laying packaged low-temperature alloy material (3), described erecting frame (1) is provided with bott stick (4), described bott stick (4) has the primary importance of stopping up hopper endoporus (31) and the second place that makes hopper endoporus (31) conducting, described hopper endoporus (31) is corresponding with the endoporus of mould to be measured, and described heating arrangement (2) links to each other with heating controller (6) by lead (5).
2. the device of a kind of novel Measurement die diameter of bore according to claim 1 is characterized in that the outer sleeve pipe (7) that is arranged with of described lead (5).
3. the device of a kind of novel Measurement die diameter of bore according to claim 2 is characterized in that described sleeve pipe (7) is provided with rubber sleeve (8).
4. according to the device of claim 2 or 3 described a kind of novel Measurement die diameter of bores, it is characterized in that described sleeve pipe (7) welds mutually respectively at erecting frame (1), heating arrangement (2).
5. the device of a kind of novel Measurement die diameter of bore according to claim 1 is characterized in that described erecting frame (1) is provided with dwang (9), and described bott stick (4) is located at an end of dwang (9) by draw ring (41).
CN 201320183525 2013-04-12 2013-04-12 Novel device for measuring diameter of inner hole of mold Expired - Fee Related CN203163711U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320183525 CN203163711U (en) 2013-04-12 2013-04-12 Novel device for measuring diameter of inner hole of mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320183525 CN203163711U (en) 2013-04-12 2013-04-12 Novel device for measuring diameter of inner hole of mold

Publications (1)

Publication Number Publication Date
CN203163711U true CN203163711U (en) 2013-08-28

Family

ID=49024889

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320183525 Expired - Fee Related CN203163711U (en) 2013-04-12 2013-04-12 Novel device for measuring diameter of inner hole of mold

Country Status (1)

Country Link
CN (1) CN203163711U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105043309A (en) * 2015-08-13 2015-11-11 东莞市贝德帕模具科技有限公司 Method for measuring size of inner hole of mould
CN108507510A (en) * 2018-04-02 2018-09-07 广东劲胜智能集团股份有限公司 A kind of method and apparatus measuring different amorphous precision part molding difficulty differences

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105043309A (en) * 2015-08-13 2015-11-11 东莞市贝德帕模具科技有限公司 Method for measuring size of inner hole of mould
CN108507510A (en) * 2018-04-02 2018-09-07 广东劲胜智能集团股份有限公司 A kind of method and apparatus measuring different amorphous precision part molding difficulty differences

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130828

Termination date: 20150412

EXPY Termination of patent right or utility model