CN203110476U - Voltage heating type circuit board pressing system based on Industry Ethernet - Google Patents
Voltage heating type circuit board pressing system based on Industry Ethernet Download PDFInfo
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- CN203110476U CN203110476U CN 201320070860 CN201320070860U CN203110476U CN 203110476 U CN203110476 U CN 203110476U CN 201320070860 CN201320070860 CN 201320070860 CN 201320070860 U CN201320070860 U CN 201320070860U CN 203110476 U CN203110476 U CN 203110476U
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- circuit board
- pressing
- hot pressing
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Abstract
The utility model discloses a voltage heating type circuit board pressing system based on the Industry Ethernet. The system comprises a circuit board hot pressing machine, an industrial computer and a hot pressing control module, wherein an upper pressing electrode plate and a lower pressing electrode plate are arranged on the circuit board hot pressing machine; a pressing mechanism is arranged above the upper pressing electrode plate; the hot pressing control module comprises a hot pressing controller, a hot pressing drive motor and a voltage output circuit; and the hot pressing controller is connected with the industrial computer in a control room through the Industry Ethernet. The voltage heating type circuit board pressing system applies voltage to multiple layers of circuit boards, so that the circuit boards are electrified and heated, the circuit board on each layer can emit heat uniformly, the heating efficiency and the speed are high, and social benefits and economic benefits of the production are greatly improved; and in addition, the circuit board hot pressing machine is connected with the industrial computer in the control room through the Industry Ethernet, so that the circuit board hot pressing machine can be operated and monitored remotely, and human resources are effectively saved.
Description
Technical field
The utility model relates to the hot pressing system in the circuit board processing, particularly a kind of voltage heated type circuit board pressing system based on EPA.
Background technology
In circuit board processing, when needs are made the circuit board of multilayer, need carry out hot pressing processing to circuit board handles, namely the circuit board to multilayer carries out pressing in heating, heat-fusible materials between the multilayer circuit board is melted, thereby produce the wiring board of multilayer, very low by manually circuit board being carried out the mode efficient of hot pressing, at present mainly be by the circuit board hot press circuit board of multilayer to be carried out hot pressing, but existing road plate hot press generally has two kinds, first kind is circuit board to be carried out pressing by heat hot press inner chamber the time, and the mode of heating has electric heating or passes through coal combustion, the mode of gasoline heats; Second kind is that force fit plate is provided with electro-heat equipment, has high temperature by electro-heat equipment by force fit plate, in pressing circuit board is heated.But no matter adopt any one above-mentioned mode, all be that mode by external heat heats circuit board, the circuit board less for the number of plies still can meet the demands, but work as the number of plies of circuit board more for a long time, the temperature of each layer circuit board is difficult to reach unified when heating, make the circuit board distortion easily or directly damage circuit board, production yields on the multilayer circuit board is reduced, very waste circuit board raw material and the energy, and the parameter setting of general circuit board hot press and monitoring need artificial scene to operate, and production and the efficiency of management are low.
The utility model content
For addressing the above problem, the purpose of this utility model is to provide circuit board hot pressing to be heated evenly and the voltage heated type circuit board pressing system based on EPA of parameter can remote monitoring be set.
The technical scheme that the invention for solving the technical problem adopts is:
Voltage heated type circuit board pressing system based on EPA, comprise the circuit board Heat sealer, described circuit board Heat sealer comprises housing, be arranged on the hot pressing inner chamber in the housing, be arranged on feeding mouth and the discharging opening of housing both sides, top of chamber is provided with the pressing battery lead plate in the described hot pressing, the bottom of described hot pressing inner chamber is provided with relative with the last pressing battery lead plate composite electrode plate that presses down, described upward pressing battery lead plate top is provided with to drive goes up the laminating mechanism that the pressing battery lead plate presses down, also be provided with the hot pressing control module in the described circuit board Heat sealer, described hot pressing control module comprises the hot pressing controller, pressing drive motors and voltage follower circuit, described hot pressing controller is connected with voltage follower circuit with the pressing drive motors respectively, the output of described pressing drive motors is connected with the input of laminating mechanism, two output electrodes of described voltage follower circuit respectively with last pressing battery lead plate with press down the composite electrode plate and be connected; Also comprise a control room, be provided with industrial computer in the described control room, described hot pressing controller is connected with industrial computer by EPA.
Further, the described two ends that press down the composite electrode plate are provided with roller.By being set, roller can allow circuit board enter the hot pressing inner chamber more easily.
Further, the described below that presses down the composite electrode plate is provided with temperature sensor, and described temperature sensor is connected with the hot pressing controller.Temperature sensor is to the temperature conditions of hot pressing controller feedback hot pressing, and transfers to industrial computer by EPA and carry out remote real-time monitoring, when occurring unusual the time, can pointing out reports to the police or protect operation automatically accordingly.
Further, also comprise a feed mechanism, described feed mechanism comprises the delivery sheet that is connected to circuit board Heat sealer feeding mouth place, and described delivery sheet is provided with the guide wheel that makes things convenient for circuit board to enter the circuit board Heat sealer.Feed mechanism can allow multilayer circuit board more easily enter the hot pressing inner chamber, and is convenient in the process of processing.
Further, described feed mechanism also comprises the support base plate, described delivery sheet below also is provided with for the hydraulic regulator of regulating the delivery sheet height, described hydraulic regulator is installed in and supports on the base plate, and the bottom of described support base plate also is provided with for the pedal of regulating the hydraulic regulator height.Can adjust the height of delivery sheet by hydraulic regulator, the production equipment of differing heights is connected on convenient and the production line.
Further, the bottom of described support base plate is provided with universal wheel.Universal wheel can allow feed mechanism mobile more easily, helps to enhance productivity.
The beneficial effects of the utility model are: the voltage heated type circuit board pressing system based on EPA that the utility model adopts, by last pressing battery lead plate with press down the composite electrode plate and multilayer circuit board is applied voltage make its energising, because circuit board is generally Copper Foil or copper sheet, therefore circuit board can self generate heat in the process of energising, because the circuit board of each layer all generates heat, thereby the hot melt adhesive material between each layer circuit board is melted, go up simultaneously pressing battery lead plate circuit board to multilayer under the effect of laminating mechanism and carry out pressing, realize the hot-forming making of multilayer circuit board, the utility model is because the heating of each layer circuit board is even, therefore circuit board pressing shakiness can not appear, the situation of distortion or damage circuit board, and the efficient height of heating, speed is fast, can effectively improve the efficient of production, save the energy and the former aptitude of circuit board source, improve social benefit and the economic benefit of producing greatly; And, the circuit board Heat sealer is connected to industrial computer in the control room by EPA, can carry out long-range monitoring and operation to the circuit board Heat sealer, also can carry out setting and the monitoring of parameter to many circuit board Heat sealer simultaneously, the production efficiency that improves is effectively saved human resources.
Description of drawings
The utility model is described in further detail below in conjunction with accompanying drawing and example.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is circuit system schematic diagram of the present utility model.
The specific embodiment
With reference to Fig. 1-Fig. 2, voltage heated type circuit board pressing system based on EPA of the present utility model, comprise circuit board Heat sealer 1, described circuit board Heat sealer 1 comprises housing 11, be arranged on the hot pressing inner chamber 12 in the housing 11, be arranged on feeding mouth 13 and the discharging opening 14 of housing 11 both sides, described hot pressing inner chamber 12 tops are provided with pressing battery lead plate 15, the bottom of described hot pressing inner chamber 12 is provided with relative with the last pressing battery lead plate 15 composite electrode plate 16 that presses down, described upward pressing battery lead plate 15 tops are provided with to drive goes up the laminating mechanism 17 that pressing battery lead plate 15 presses down, also be provided with hot pressing control module 2 in the described circuit board Heat sealer 1, described hot pressing control module 2 comprises hot pressing controller 21, pressing drive motors 22 and voltage follower circuit 23, described hot pressing controller 21 is connected with voltage follower circuit 23 with pressing drive motors 22 respectively, the output of described pressing drive motors 22 is connected with the input of laminating mechanism 17, two output electrodes of described voltage follower circuit 23 respectively with last pressing battery lead plate 15 with press down composite electrode plate 16 and be connected; Also comprise a control room 5, be provided with industrial computer 3 in the described control room 5, described hot pressing controller 21 is connected with industrial computer 3 by EPA.
The utility model is by last pressing battery lead plate 15 and press down 16 pairs of multilayer circuit boards of composite electrode plate and apply voltage and make its energising, because circuit board is generally Copper Foil or copper sheet, and adjacent Copper Foil or copper sheet are to connect conducting, therefore circuit board can self generate heat in the process of energising, because the circuit board of each layer all generates heat, thereby the hot melt adhesive material between each layer circuit board is melted, go up simultaneously pressing battery lead plate 15 circuit board to multilayer under the effect of laminating mechanism 17 and carry out pressing, realize the hot-forming making of multilayer circuit board, the utility model is because the heating of each layer circuit board is even, therefore circuit board pressing shakiness can not appear, the situation of distortion or damage circuit board, and the efficient height of heating, speed is fast, can effectively improve the efficient of production, save the energy and the former aptitude of circuit board source, improve social benefit and the economic benefit of producing greatly; And, circuit board Heat sealer 1 is connected to industrial computer 3 in the control room 5 by EPA, can carry out long-range monitoring and operation to circuit board Heat sealer 1, also can carry out setting and the monitoring of parameter to many circuit board Heat sealer 1 simultaneously, the production efficiency that improves is effectively saved human resources.
Further, the described two ends that press down composite electrode plate 16 are provided with roller 18.By being set, roller 18 can allow circuit board enter hot pressing inner chamber 12 more easily.
Further, the described below that presses down composite electrode plate 16 is provided with temperature sensor 19, and described temperature sensor 19 is connected with hot pressing controller 21.Temperature sensor 19 is to the temperature conditions of hot pressing controller 21 feedback hot pressing, and transfers to industrial computer 3 by EPA and carry out remote real-time monitoring, when occurring unusual the time, can pointing out reports to the police or protect operation automatically accordingly.
Further, also comprise a feed mechanism 4, described feed mechanism 4 comprises the delivery sheet 41 that is connected to circuit board Heat sealer 1 feeding mouth 13 places, and described delivery sheet 41 is provided with the guide wheel 42 that makes things convenient for circuit board to enter circuit board Heat sealer 1.Feed mechanism 4 can allow multilayer circuit board more easily enter hot pressing inner chamber 12, and is convenient in the process of processing.
Further, described feed mechanism 4 also comprises support base plate 44, described delivery sheet 41 belows also are provided with for the hydraulic regulator 43 of regulating delivery sheet 41 height, described hydraulic regulator 43 is installed in and supports on the base plate 44, and the bottom of described support base plate 44 also is provided with for the pedal 45 of regulating hydraulic regulator 43 height.Can adjust the height of delivery sheet 41 by hydraulic regulator 43, the production equipment of differing heights is connected on convenient and the production line.
Further, the bottom of described support base plate 44 is provided with universal wheel 46.Universal wheel 46 can allow feed mechanism 4 mobile more easily, helps to enhance productivity.
The above is preferred embodiment of the present utility model, and the utility model is not limited to above-mentioned embodiment, as long as it reaches technique effect of the present utility model with identical means, all should belong to protection domain of the present utility model.
Claims (6)
1. based on the voltage heated type circuit board pressing system of EPA, comprise circuit board Heat sealer (1), it is characterized in that: described circuit board Heat sealer (1) comprises housing (11), be arranged on the hot pressing inner chamber (12) in the housing (11), be arranged on feeding mouth (13) and the discharging opening (14) of housing (11) both sides, described hot pressing inner chamber (12) top is provided with pressing battery lead plate (15), the bottom of described hot pressing inner chamber (12) is provided with relative with last pressing battery lead plate (15) the composite electrode plate (16) that presses down, described upward pressing battery lead plate (15) top is provided with to drive goes up the laminating mechanism (17) that pressing battery lead plate (15) presses down, also be provided with hot pressing control module (2) in the described circuit board Heat sealer (1), described hot pressing control module (2) comprises hot pressing controller (21), pressing drive motors (22) and voltage follower circuit (23), described hot pressing controller (21) is connected with voltage follower circuit (23) with pressing drive motors (22) respectively, the output of described pressing drive motors (22) is connected with the input of laminating mechanism (17), two output electrodes of described voltage follower circuit (23) respectively with last pressing battery lead plate (15) with press down composite electrode plate (16) and be connected; Also comprise a control room (5), be provided with industrial computer (3) in described control room (5), described hot pressing controller (21) is connected with industrial computer (3) by EPA.
2. the voltage heated type circuit board pressing system based on EPA according to claim 1, it is characterized in that: the described two ends that press down composite electrode plate (16) are provided with roller (18).
3. the voltage heated type circuit board pressing system based on EPA according to claim 1, it is characterized in that: the described below that presses down composite electrode plate (16) is provided with temperature sensor (19), and described temperature sensor (19) is connected with hot pressing controller (21).
4. the voltage heated type circuit board pressing system based on EPA according to claim 1, it is characterized in that: also comprise a feed mechanism (4), described feed mechanism (4) comprises and is connected to the delivery sheet (41) that circuit board Heat sealer (1) feeding mouth (13) is located that described delivery sheet (41) is provided with the guide wheel (42) that makes things convenient for circuit board to enter circuit board Heat sealer (1).
5. the voltage heated type circuit board pressing system based on EPA according to claim 4, it is characterized in that: described feed mechanism (4) also comprises support base plate (44), described delivery sheet (41) below also is provided with for the hydraulic regulator (43) of regulating delivery sheet (41) height, described hydraulic regulator (43) is installed in and supports on the base plate (44), and the bottom of described support base plate (44) also is provided with for the pedal (45) of regulating hydraulic regulator (43) height.
6. the voltage heated type circuit board pressing system based on EPA according to claim 5, it is characterized in that: the bottom of described support base plate (44) is provided with universal wheel (46).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201320070860 CN203110476U (en) | 2013-02-06 | 2013-02-06 | Voltage heating type circuit board pressing system based on Industry Ethernet |
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Application Number | Priority Date | Filing Date | Title |
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CN 201320070860 CN203110476U (en) | 2013-02-06 | 2013-02-06 | Voltage heating type circuit board pressing system based on Industry Ethernet |
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CN203110476U true CN203110476U (en) | 2013-08-07 |
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CN 201320070860 Expired - Fee Related CN203110476U (en) | 2013-02-06 | 2013-02-06 | Voltage heating type circuit board pressing system based on Industry Ethernet |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103974544A (en) * | 2014-04-30 | 2014-08-06 | 沪士电子股份有限公司 | Automatic lamination plate temperature monitoring and measuring method |
CN108188531A (en) * | 2018-02-10 | 2018-06-22 | 东莞市联洲知识产权运营管理有限公司 | A kind of wiring board hot press with lifting closing door |
CN114364161A (en) * | 2022-01-13 | 2022-04-15 | 深圳市昶东鑫线路板有限公司 | Automatic control system for circuit board production |
-
2013
- 2013-02-06 CN CN 201320070860 patent/CN203110476U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103974544A (en) * | 2014-04-30 | 2014-08-06 | 沪士电子股份有限公司 | Automatic lamination plate temperature monitoring and measuring method |
CN103974544B (en) * | 2014-04-30 | 2017-05-17 | 沪士电子股份有限公司 | Automatic lamination plate temperature monitoring and measuring method |
CN108188531A (en) * | 2018-02-10 | 2018-06-22 | 东莞市联洲知识产权运营管理有限公司 | A kind of wiring board hot press with lifting closing door |
CN108188531B (en) * | 2018-02-10 | 2020-05-12 | 王梦梦 | Circuit board hot press with lift sealing door |
CN114364161A (en) * | 2022-01-13 | 2022-04-15 | 深圳市昶东鑫线路板有限公司 | Automatic control system for circuit board production |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130807 Termination date: 20160206 |
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CF01 | Termination of patent right due to non-payment of annual fee |