CN203052585U - Radiator for high-power semiconductor light-emitting diode street lamp - Google Patents
Radiator for high-power semiconductor light-emitting diode street lamp Download PDFInfo
- Publication number
- CN203052585U CN203052585U CN2012203040276U CN201220304027U CN203052585U CN 203052585 U CN203052585 U CN 203052585U CN 2012203040276 U CN2012203040276 U CN 2012203040276U CN 201220304027 U CN201220304027 U CN 201220304027U CN 203052585 U CN203052585 U CN 203052585U
- Authority
- CN
- China
- Prior art keywords
- fin
- heat
- big
- radiator
- radiating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model discloses a radiator for a high-power semiconductor light-emitting diode street lamp. The radiator comprises a radiating substrate, small fins, large fins, a dustproof cover, air flow channels and window orifices, wherein the large fins are longitudinally distributed on the radiating substrate at intervals; the air flow channel is formed in a gap between every two large fins; the dustproof cover is arranged above the large fins; and distances of 5-10mm are arranged between the top ends of the large fins and the dustproof cover; a plurality of small fins and the window orifices are arranged on each large fin at intervals; the small fins and the large fins in the vertical direction form acute angles or right angles; the distance between the small fins in each row or every two window orifices is 2-10mm seen from top to bottom; and the dustproof cover is connected with the radiating substrate. By adopting the radiator, the radiating area is increased; the mobility of the radiator air in the transverse and longitudinal directions is reinforced; the heat exchange coefficient of the radiating surface and the air is improved; and the radiator integrates the radiating function with the dustproof and waterproof functions, and is suitable for the requirements of secondary encapsulation of the high-power light-emitting diode (LED) lamp.
Description
Technical field
The utility model relates to a kind of heat radiation of great-power electronic product, particularly relates to a kind ofly for the large power semiconductor LED street lamp heat radiator, and this radiator is particularly suitable for high-power LED illuminating lamp and looses.
Background technology
The LED light fixture has light efficiency height, environmental protection, long, high directivity of life-span, advantages such as colour rendering is good, be widely used in demonstration, decoration, road and some special lighting fields, yet the electricity conversion of LED only reaches 10-25%, the power conversion heat of about 75-90%, if untimely heat is removed, will cause the performance of light source to descend, influence the life-span of LED.
In existing technology, the designer utilizes the increase area of dissipation to reach removing of heat usually, the temperature of control lamp pearl, but the air flow property of radiator structure is considered deficiency; Increase area of dissipation in addition and make the bulky of radiator, the waste wide variety of materials has increased LED lamp production cost;
In the existing utility model design, for the consideration to material consumption, the general heat sink radiating mode of open type that adopts is the CN201836839U utility model patent as the patent No., dirt accumulation a large amount of in the permanent use have reduced heat sink and heat exchange effect air in heat sink surface greatly.
The utility model content
The purpose of this utility model is to overcome above-mentioned shortcoming, provides a kind of coefficient of heat transfer big, has both had dustproof encapsulation protection, has fluid sense of movement characteristic again, and the LED radiator of good effect of heat exchange is specially adapted to high-powered LED lamp and uses.
To achieve these goals, the utility model proposes following technical scheme:
A kind ofly comprise heat-radiating substrate for the large power semiconductor LED street lamp heat radiator, little fin, big fin, dust cover, air flow passage and fenestra; Big fin longitudinal separation is distributed on the heat-radiating substrate, and the interval between per two big fins forms air flow passage; Dust cover is arranged on the top of big fin, is provided with the spacing of 5-10mm with big fin top; Be interval with a plurality of little fins and fenestra on each big fin, on big fin, carve the open-type indentation at interval, keep and do not make indentation on one side, form a plurality of openings by punching press at big fin, become fenestra, the material that keeps in the fenestra forms little fin at big fin, shape acute angle or right angle between in the vertical direction little fin and the big fin; See that from top to bottom each arranges between the little fin or the spacing 2-10mm between the fenestra; Dust cover is connected with heat-radiating substrate.
Further, described heat-radiating substrate is side's body, and thickness is preferably 3-5mm.
The spacing of described big fin is preferably 8-12mm.
It is square, circular or oval that the shape of described fenestra is preferably.
Described dust cover oval in shape hides heat-radiating substrate fully on the upright projection direction.
Big fin top in the middle of described dust cover is fixed on the heat-radiating substrate.
Described heat-radiating substrate, little fin and big fin are preferably by aluminium alloy or copper production.
The utlity model has following advantage with respect to prior art:
(1) the big fin vertical symmetry of the utility model is distributed on the heat-radiating substrate surface, and quantity is several, and the height of big fin increases gradually from inside to outside; Outside big fin and the dustproof space length that is covered with 5-10mm flow after the air expanded by heating that is beneficial to air flow channel in the radiator rises outward; Keep distance between the big fin, form the vertical flow channel of air, be beneficial to air at flowing heat transfer longitudinally.
(2) opened fenestra on the big fin surface of the utility model, and the area of reservation fenestra, form little fin at big fin surface, little fin directly has certain angle with big fin in vertical direction, and the winglet sheet extends to the mobile logical direction of air and increases area of dissipation; The existence of little fin strengthened air in the vertical direction, the horizontal and vertical disorderly degree that flows, destroy the laminar sublayer that lamina air flow flows, reduced heat transfer resistance, improved the coefficient of heat transfer, obtain better heat exchange effect.
(3) the utility model is in big fin surface uplifting window hole and keep the area of fenestra, on big fin surface, outside direction is tilted to, keeps certain distance between the little fin in winglet sheet symmetric arrays that big fin forms; The little fin of fin surface broad in the middle interlocks and is tilted to outer the arrangement, is beneficial to air like this in horizontal flowing; Increase flowability and the irregularity of Laminar Flow with meeting of vertical and vertical direction air, thereby disturb and the destruction Laminar Flow raising coefficient of heat transfer;
(5) dust cover both can increase the area of heat transfer, can play the heat-transfer effect of the accumulation affects heat radiation that prevents dust simultaneously again;
Description of drawings
Fig. 1 is for being used for the front view of large power semiconductor LED street lamp heat radiator
Fig. 2 is for being used for the left view of large power semiconductor LED street lamp heat radiator
Shown in the figure: heat-radiating substrate 1, winglet sheet 2, big fin 3, dust cover 4, air flow passage 5, fenestra 6.
The specific embodiment
For understanding the utility model better, below in conjunction with accompanying drawing the utility model is further described, need to prove that protection domain of the present utility model is not limited to the scope of embodiment statement.
The left and right directions of accompanying drawing is that laterally fore-and-aft direction is vertical in the utility model.
As shown in Figure 1, 2, a kind of for the large power semiconductor LED street lamp heat radiator, it comprises heat-radiating substrate 1, winglet sheet 2, big fin 3, dust cover 4, air flow passage 5 and fenestra 6; Heat-radiating substrate 1 is side's body, and thickness is 3-5mm, and thickness can change; Big fin 3 longitudinal separations are distributed on the heat-radiating substrate 1, the spacing of preferred interval 8-12mm, and the interval between per two big fins 3 forms air flow passage 5; Dust cover 4 is arranged on the top of big fin 3, is provided with the spacing of 5-10mm with big fin 3 tops; Be interval with a plurality of winglet sheets 2 and fenestra 6 on each big fin 3, on big fin 3, carve the open-type indentation at interval, do not make indentation Yi Bian keep, form a plurality of openings by punching press at big fin 3, become fenestra 6, the shape of fenestra 6 can be square, circle or ellipse etc.; The material that keeps in the fenestra 6 forms winglet sheet 2 at big fin 3 simultaneously, in the vertical direction shape acute angle or right angle between winglet sheet 2 and the big fin 3; See that from top to bottom each arranges between the little fin or the spacing 2-10mm between the fenestra 6; Dust cover 4 is connected with heat-radiating substrate 1; Dust cover 4 constitutes an integral body with big fin and heat-radiating substrate 1.
Big fin 3 quantity are a plurality of, and big fin 3 is vertically set on above the heat-radiating substrate 1, and preferred big fin 3 increases highly from inside to outside gradually, is beneficial to expanded by heating air lateral flow from inside to outside; Have fenestra 6 above the big fin 3, fenestra 6 is laterally forming horizontal air flow passage, and winglet sheet 2 extends outward to air flow passage 5 and increases area of dissipation; The air flow passage 5 that forms between the fin 3, when having guaranteed that fin 3 surperficial air are heated vertically and vertical direction enough flowing spaces are arranged, guarantee the flowability of air on vertical and vertical direction; Big fin 3 uplifting window holes 6 have also kept the fenestra area, make the area of heat radiation increase about 3-5%; Winglet sheet 2 is distributed on big fin 3 surfaces, between the winglet sheet 2 in the vertical direction (above-below direction) and vertically (fore-and-aft direction) all keep certain distance, winglet sheet 2 be the symmetrical centre symmetrical distribution with the big fin 3 of centre, outside direction is tilted to; Fin 3 lip-deep winglet sheets broad in the middle 2 left and right sides are spaced apart, outside direction is tilted to.
Dust cover 4 oval in shape, on the upright projection direction, can hide heat-radiating substrate 1 fully, big fin 3 tops in the middle of preferably being fixed on the heat-radiating substrate 1, the distance that keeps 5-10mm at two ends dust cover 4 and outside fin 3 in the vertical direction, the air that expanded by heating rises, from radiator longitudinally air flow passage 5 flow or uphill process be subjected to hindering to laterally flowing, it is mobile from the space between dust cover 4 and the fin 3 also can to rise to the top.
The utility model radiator is when work, heat from led chip passes to heat-radiating substrate 1 bottom surface through heat conducting mode, the bottom surface temperature rises, and makes heat-radiating substrate 1 and big fin 3 have temperature difference, and heat further is delivered on the big fin 3 by heat-radiating substrate 1 bottom surface; Heat is by radiation, and heat transfer, convection type pass to heat the air from big fin 3 surfaces; Because heat is upwards to be delivered to from heat-radiating substrate 1 on the big fin 3 at radiator, the surface temperature of heat-radiating substrate 1 is than the temperature height of big fin 3; The air that is heated on heat-radiating substrate 1 surface expands, and density reduces, and rises along heat-radiating substrate 1 surface, forms free convection, is conducive to strengthen the heat exchange between heat-radiating substrate 1, winglet sheet 2, big fin 3 and the air; The air expanded by heating on winglet sheet 2, big fin 3 surfaces, density reduces, and causes small pressure differential, and the air that promotes winglet sheet 2, big fin 3 surfaces flows, and strengthens the flowability of the air of air flow passage 5, further enhanced heat exchange; The air that rises runs into winglet sheet 2 and hinders generation fluctuation concussion, destroy air and fin 2, big fin 3 surperficial fluidized bed laminar sublayers, simultaneously air is laterally owing to also exist small pressure differential, also there is lateral flow in air at passage 5, therefore increase the air movement disorder, thereby increase the heat transfer coefficient of winglet sheet 2, big fin 3 and air, obtain good heat exchange effect; Heated air rises to the bottom of dust cover 4, and the part heat passes to dust cover 4 by free convection, and after-heat is then passed in the atmosphere from inside to outside by the space between air flow passage 5 or dust cover 4 and the big fin 3 by air and goes.The radiator top adds dust cover 4, can prevent owing to dust or other foreign material particles accumulate in the middle heat exchange effect that reduces between radiator and the air of air flow channel, the therefore service life that can improve radiating effect and radiator for a long time.
The utility model LED radiator, simple in structure, be easy to processing; Taken into full account the flowability of heated air, utilized fin 3 uplifting window holes 6, formed winglet sheet 2 simultaneously, not only do not reduced area of dissipation, area of dissipation increases about 3% on the contrary; Mobile fluctuation and the concussion of air of air flow passage 5 also strengthened in the existence of winglet sheet 2, increased the irregularity that flows, destroyed under the free convection, the laminar sublayer that flows of air and spreader surface, thereby enhancing exchange capability of heat, improve the effect of heat exchange, guaranteed that the led chip temperature is in normal working range.
Utilize ProE software to set up physical model, utilize Fluent software to carry out emulation, symmetry according to model, / 2nd of a simulation delivery type is simulated, around model, set up the fluid flow region territory, the top of fluid mass distance from top model is 2 times of height of model, and the side, fluid mass is 1/2 of model width to the distance of model; The bottom, fluid mass overlaps with model; Model and fluid mass are carried out the grid division, and number of grid is about 1,800,000, and the poorest mesh quality is 0.8, meets the requirement of calculating; The boundary condition that fluid flows is set to pressure entrance.Analog radiator ambient air temperature is set to 30 ℃, and the density calculation of air utilizes the approximation method of boussinesq, and the heat flow density of the generation of monolithic chip is 8 * 10
5W/m
2The input general power of chip is 28W, and pressure term adopts the discrete method of Body ForceWeigh, and all the other equations adopt the second order upstreame scheme discrete; Energy curve residual error convergence is 10
-8, all the other are 10 years old
-5Analog result shows that maximum temperature can control at 62 ℃, is lower than the temperature requirement of 120 ℃ of operate as normal far below led chip; The flow velocity of air reaches 0.257m/s in the air flow channel 5, on the market between the existing heronsbill heat radiator fin air velocity generally can only reach about 0.1m/s, and air velocity is even between the big fin 3 of the present utility model, form tangible stack effect between the air that rises and the dust cover 4, improved the radiating effect of radiator.
Claims (7)
1. one kind is used for the large power semiconductor LED street lamp heat radiator, it is characterized in that comprising heat-radiating substrate, little fin, big fin, dust cover, air flow passage and fenestra; Big fin longitudinal separation is distributed on the heat-radiating substrate, and the interval between per two big fins forms air flow passage; Dust cover is arranged on the top of big fin, is provided with the spacing of 5-10mm with big fin top; Be interval with a plurality of little fins and fenestra on each big fin; Fenestra is to carve the open-type indentation on big fin at interval, does not make indentation Yi Bian keep, and forms at big fin by punching press; Little fin is that the material that keeps in the fenestra on big fin forms; Shape acute angle or right angle between in the vertical direction little fin and the big fin; See that from top to bottom each arranges between the little fin or the spacing 2-10mm between the fenestra; Dust cover is connected with heat-radiating substrate.
2. according to claim 1 for the large power semiconductor LED street lamp heat radiator, it is characterized in that: described heat-radiating substrate is side's body, and thickness is 3-5mm.
3. according to claim 1 for the large power semiconductor LED street lamp heat radiator, it is characterized in that: the spacing of described big fin is 8-12mm.
4. according to claim 1 for the large power semiconductor LED street lamp heat radiator, it is characterized in that: being shaped as of described fenestra is square, circular or oval.
5. according to claim 1 for the large power semiconductor LED street lamp heat radiator, it is characterized in that: described dust cover oval in shape hides heat-radiating substrate in the upright projection direction.
6. according to claim 1 for the large power semiconductor LED street lamp heat radiator, it is characterized in that: the big fin top in the middle of described dust cover is fixed on the heat-radiating substrate.
7. according to claim 1 for the large power semiconductor LED street lamp heat radiator, it is characterized in that: described heat-radiating substrate, little fin and big fin are by aluminium alloy or copper production.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203040276U CN203052585U (en) | 2012-06-26 | 2012-06-26 | Radiator for high-power semiconductor light-emitting diode street lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203040276U CN203052585U (en) | 2012-06-26 | 2012-06-26 | Radiator for high-power semiconductor light-emitting diode street lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203052585U true CN203052585U (en) | 2013-07-10 |
Family
ID=48735532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012203040276U Expired - Fee Related CN203052585U (en) | 2012-06-26 | 2012-06-26 | Radiator for high-power semiconductor light-emitting diode street lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203052585U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112103166A (en) * | 2019-06-18 | 2020-12-18 | 东京毅力科创株式会社 | Substrate processing apparatus |
-
2012
- 2012-06-26 CN CN2012203040276U patent/CN203052585U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112103166A (en) * | 2019-06-18 | 2020-12-18 | 东京毅力科创株式会社 | Substrate processing apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102721024A (en) | Radiator for light-emitting diode (LED) lamp | |
| CN201184574Y (en) | LED lamp heat radiation seat | |
| CN107677152A (en) | A kind of Micro-channel Liquid-cooling Cold Plate | |
| CN204176603U (en) | A kind of module group radiator and lighting device | |
| CN203052585U (en) | Radiator for high-power semiconductor light-emitting diode street lamp | |
| CN205030024U (en) | Cooling fin | |
| CN205026622U (en) | Heat radiation structure of projecting lamp | |
| CN102230604B (en) | Modular heat radiator for LED lamps | |
| CN203478154U (en) | LED radiator | |
| CN201636810U (en) | LED (Light Emitting Diode) street lamp radiating rib | |
| CN203223887U (en) | Array type LED heat sink | |
| CN102155716A (en) | LED (light-emitting diode) radiator | |
| CN206247284U (en) | A kind of fin of alterable radiator volume | |
| CN201606843U (en) | Heat radiating structure of LED lamp | |
| CN203190368U (en) | LED lamp heat radiating device | |
| CN204649054U (en) | A kind of Split radiator | |
| CN202032485U (en) | LED (Light-emitting Diode) radiating module and LED lamp | |
| CN202647673U (en) | Radiator for light emitting diode (LED) light | |
| CN202835274U (en) | Light-emitting diode (LED) lamp shell based on principle of heat-flow density | |
| CN203586137U (en) | Heat radiation structure of LED tunnel lamp | |
| CN201697087U (en) | Radiator for LED lamp | |
| CN204994203U (en) | Reverse pyramid describes radiator | |
| CN205005416U (en) | Piece formula electronic heat dissipation ware | |
| CN203395981U (en) | Radiator | |
| CN203642130U (en) | LED radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130710 Termination date: 20160626 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |