CN203033209U

CN203033209U - Interlayer frame for circular wafer packaging

Info

Publication number: CN203033209U
Application number: CN 201220724525
Authority: CN
Inventors: 鲁泥藕
Original assignee: BEIJING GUOJING INFRARED OPTICAL TECHNOLOGY Co Ltd; Beijing General Research Institute for Non Ferrous Metals
Current assignee: Youyan Photoelectric New Material Co.,Ltd.
Priority date: 2012-12-25
Filing date: 2012-12-25
Publication date: 2013-07-03
Anticipated expiration: 2022-12-25

Abstract

Disclosed is an interlayer frame for circular wafer packaging. The interlayer frame comprises at least one interlayer. Each interlayer comprises a support layer at the top of each layer, and a vault (5) under each support layer. Each support layer comprises a hard sponge frame (2) shaped like a Chinese character 'tian', and divides a space into multiple zones, a hard sponge horizontal partition strip (3) is arranged in each zone, and the hard sponge horizontal partition strip (3) is connected with a hard sponge longitudinal narrow strip (1) in intersection and inserted modes to form slots (4) for packaging the circular wafers. Length of slotting can be adjusted to store the wafers with different diameters, so that the same case can be used for storing the wafers with different sizes; one wafer is put into each of the slots and a part of the same is exposed out of the slot to facilitate storage and picking; height of each vault can be regulated to be adapted to exposed wafers with different height; each layer has big storage quantity, so that the storage is facilitated.

Description

A kind of interlayer frame for circular wafer packaging

Technical field

The utility model relates to a kind of packing of circular wafer, particularly a kind of interlayer frame that is applicable to plurality of specifications, in enormous quantities, small diameter circular wafer packaging.

Background technology

Infrared optical material such as germanium, zinc selenide, zinc sulphide etc. mainly are used as window and the lens of infrared optical system, specification is of a great variety, size does not wait from Φ 10mm-Φ 300mm, shape has disk, square sheet etc., but the maximum Φ 20mm-Φ 30mm of quantity, the sequin of thickness 2-3mm, the annual market demand has hundreds thousand of more than, because this class infra-red material all is hard brittle material, for avoiding in transportation, damaging, high requirement is proposed packing.

At present, the packing box that is used for wafer on the market mostly is the independent packaging of single-wafer, and this kind packing cost is higher, is used for the packing after wafer polishes plated film more.The plastic packing box that also has some can put down ten multi-disc wafers simultaneously, but these packing box materials mostly are thinner duroplasts, and packaged products is as easy as rolling off a log damage in transit, and this packing is used for the above wafer of diameter 50mm more.Seldom be useful on the packing box of batch package small dimension wafer on the market, have some can hold the more wafer case of quantity simultaneously once in a while, but lay easy pickup difficulty.

Therefore be necessary to provide a kind of interlayer frame for minor diameter, many specifications, more large batch of circular wafer packaging.

Summary of the invention

The purpose of this utility model provides a kind of interlayer frame for circular wafer packaging, and this packing interlayer frame is easy to use, transportation safety and with low cost.

For achieving the above object, the utility model is taked following technical scheme:

This interlayer frame for circular wafer packaging, it comprises: at least one interlayer, each interlayer comprises: superposed bearing bed, be positioned at the dome of bearing bed below, described bearing bed comprises: being positioned at the hard sponge framework of sphere of movements for the elephants type of periphery, is a plurality of zones with space segmentation, and hardhead sponge horizontal partition bar is housed in each zone, the horizontal partition bar intersects with the vertical fillet of hardhead sponge and pegs graft, and the space after the grafting is for loading the dead slot of circular wafer.

Described dome is provided with jumps a queue.

Hard sponge material refers to that sponge hardness is 46～55 ° all-out attacking style sponge.

A kind of interlayer frame for circular wafer packaging adopts the hardhead sponge material as interlayer, and the hardhead sponge framework of interlayer matrix pattern is divided into the zone of four memory chips to this interlayer, and the position in these four zones is the fixed position, can not change.And the several rows fluting is arranged in each zone, this fluting separates with hardhead sponge horizontal partition bar, so each zone can be divided into 3 row or 4 row flutings.

Below the interlayer, with four positions that the zone is corresponding, be provided with the dome of adjustment height.

This interlayer frame can be an interlayer, also can be that a plurality of interlayers build up.

Be positioned at the dome of bearing bed below, this dome can be used as the top cover of the following one deck that is right after.

The utility model has the advantages that: the adjustable length of fluting is fit to deposit in the groove wafer of different-diameter, therefore the wafer of available identical box stores different size; After wafer was put into groove, some was exposed at outside the groove, makes things convenient for access; The dome of adjustment height is fit to expose the groove differing heights of wafer outward; Every layer of storage content is big, convenient storage.

Description of drawings

Fig. 1: the utility model interlayer front view.

Fig. 2: hardhead sponge horizontal partition bar front view.

Fig. 3: the vertical fillet of hardhead sponge horizontal partition bar and hardhead sponge intersects the grafting birds-eye view.

Fig. 4: the birds-eye view of a kind of superposed bearing bed that the utility model provides.

Fig. 5: the shape of jumping a queue figure.

Deposit position view behind the wafer in Fig. 6 groove.

Among Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6,1 is the vertical fillet of hardhead sponge, and 2 be the hardhead sponge framework, and 3 be hardhead sponge horizontal partition bar, and 4 is to slot, and 5 is dome, 6, jump a queue, and 7 is wafer.

The specific embodiment

Referring to Fig. 3 and Fig. 4, the circular wafer packaging box of the many specifications of the utility model interlayer adopts the hardhead sponge material, the interlayer upper surface comprises the hardhead sponge framework 2 of matrix pattern, and this structure is mainly used in bearing wafer weight, and interlayer is divided into four zones (I, II, III, IV); Indulge fillet 1 with the immutable hardhead sponge that the matrix pattern framework is connected as a single entity; The hardhead sponge horizontal partition bar 3 of removable position; Hardhead sponge horizontal partition bar 3 injects the groove on the vertical fillet 1 of hardhead sponge, and 3 and 1 intersects to form fluting 4, is used for depositing wafer.Because the position difference that horizontal partition bar 3 is placed can form 3 row or 4 row flutings.(being 3 row flutings among Fig. 1)

The bottom of bearing bed is the real end of being made by hard sponge, and upwards arches upward in the position that dome 5 corresponding next interlayer wafers protrude.

The interlayer lower surface comprises the dome 5 of adjustment height, what this dome was interior jumps a queue 6, is all the hardhead sponge material, is the tile shape (see figure 5) of two sideband circular arcs, can be by interpolation 6 height that change dome of jumping a queue, thus be fit to the differing heights that wafer exposes slotted section.

Fig. 6 is for depositing position view behind the wafer in the groove, and 7 for wafer exposes the part of fluting, and this part conveniently picks and places.

The wafer of 30-50 sheet can be deposited in each zone of this interlayer, so each interlayer can pile up the wafer of 100-200 sheet, and this interlayer of filling wafer is piled up successively in the carton of standard, and each chest can be piled up the wafer of 300-600 sheet.

Claims

1. interlayer frame that is used for circular wafer packaging, it is characterized in that: it comprises: at least one interlayer, each interlayer comprises: superposed bearing bed, be positioned at the dome (5) of bearing bed below, described bearing bed comprises: the hard sponge framework of sphere of movements for the elephants type (2) that is positioned at periphery, be a plurality of zones with space segmentation, hardhead sponge horizontal partition bar (3) is housed in each zone, horizontal partition bar (3) intersects with the vertical fillet (1) of hardhead sponge and pegs graft, and the space after the grafting is for loading the dead slot (4) of circular wafer.

2. a kind of interlayer frame for circular wafer packaging according to claim 1, it is characterized in that: described dome (5) is provided with jump a queue (6).