CN203031655U - Film delimiting machine structure - Google Patents

Film delimiting machine structure Download PDF

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Publication number
CN203031655U
CN203031655U CN 201220652815 CN201220652815U CN203031655U CN 203031655 U CN203031655 U CN 203031655U CN 201220652815 CN201220652815 CN 201220652815 CN 201220652815 U CN201220652815 U CN 201220652815U CN 203031655 U CN203031655 U CN 203031655U
Authority
CN
China
Prior art keywords
film
base
cutter
rotating shaft
synovial membrane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201220652815
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Chinese (zh)
Inventor
夏金平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUXI RED MICROELECTRONICS CO Ltd
Original Assignee
WUXI RED MICROELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUXI RED MICROELECTRONICS CO Ltd filed Critical WUXI RED MICROELECTRONICS CO Ltd
Priority to CN 201220652815 priority Critical patent/CN203031655U/en
Application granted granted Critical
Publication of CN203031655U publication Critical patent/CN203031655U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The utility model provides a film delimiting machine structure. The film delimiting machine structure guarantees that film is stressed evenly when being delimited, reduces the number of wafer grains which are not tightened on a disk of a machine platform after the blue film is attached to a wafer ring so as to reduce squeezing damage, caused by no tensioning of the wafer grains, to the wafer grains, and improves the defect-free rate. The film delimiting machine structure comprises a base and a central rotating shaft, wherein the central rotating shaft is vertically inserted into the center of the base. The film delimiting machine structure is characterized by further comprising a film delimiting cutter and a film delimiting cutter cross shaft, wherein through radial hole is formed in the upper end of the central rotating shaft, the film delimiting cutter cross shaft penetrates through the radial hole to be parallel to a plane of the base, a vertical limiting threaded hole is formed in the center of the top of the central rotating shaft, the limiting threaded hole is communicated with the radial hole, a limiting threaded rod is connected with the limiting threaded hole in a threaded mode, the lower end of the limiting threaded rod presses tightly the film delimiting cutter cross shaft, the film delimiting cutter is perpendicular to the plane of the base, and one end of the film delimiting cutter cross shaft penetrates through an upper-end radial locating hole of the film delimiting cutter.

Description

A kind of stroke of film machine structure
Technical field
The utility model relates to the wafer central Filming Technology field of semiconductor machining, is specially a kind of stroke of film machine structure.
Background technology
The film process of existing wafer central, it needs the employee to mark the shape of blue film with blade, since artificial when drawing film on hand power can not be consistent constantly, the border discontinuity that causes blue film, and then make blue film after the board disk is tightened, because the border discontinuity of blue film can't guarantee that the crystal grain on the wafer central is all tightened, and then make the crystal grain on the wafer central cause the crystal grain crush injury, the fraction defective height because not tightening.
Summary of the invention
At the problems referred to above, the utility model provides a kind of stroke of film machine structure, and is stressed even when it guarantees to draw film; after making that blue film is attached on the wafer central; the crystal grain quantity that minimizing is not tightened on the board disk, and then reduce crystal grain and cause the crystal grain crush injury because not tightening, yield improved.
A kind of stroke of film machine structure, its technical scheme is such: it comprises base, central rotating shaft, described central rotating shaft vertically is plugged in the center of described base, it is characterized in that: it also comprises the synovial membrane cutter, synovial membrane cutter transverse axis, the upper end of described central rotating shaft is provided with the radial hole that runs through, described synovial membrane cutter transverse axis runs through the horizontal layout that is parallel to described base behind the described radial hole, the top center of described central rotating shaft have vertically to spacing screwed hole, described spacing screwed hole is communicated with described radial hole, spacing screw flight connects described spacing screwed hole, and described synovial membrane cutter transverse axis is pressed in the lower end of described spacing screw rod, described synovial membrane cutter is perpendicular to the horizontal layout of described base, one end of described synovial membrane cutter transverse axis runs through the radial location hole, upper end of described synovial membrane cutter, and the cutter head part of described synovial membrane cutter is towards the plane of described base.
It is further characterized in that: the lower surface of described base is provided with four base pads pin.
After using structure of the present utility model; blue film is placed on the base; determine the distance of synovial membrane cutter and central rotating shaft afterwards according to the size of wafer; guarantee the distance of synovial membrane cutter and central rotating shaft by regulating length that synovial membrane cutter transverse axis gos deep into radial hole; it is the radius of wafer; to compress synovial membrane cutter transverse axis spacing in lower end by spacing screw rod at last; the center of rotation rotating shaft; can mark a standard circular at blue film; and when guaranteeing to draw film stressed evenly, make that blue film is attached on the wafer central after, reduce the crystal grain quantity of on the board disk, not tightening; and then reduce crystal grain and cause the crystal grain crush injury because not tightening, improve yield.
Description of drawings
Fig. 1 is front view structural representation of the present utility model;
Fig. 2 is the vertical view structural representation of Fig. 1.
The specific embodiment
See Fig. 1, Fig. 2, it comprises base 1, central rotating shaft 2, central rotating shaft 2 vertically is plugged in the center of base 1, it also comprises synovial membrane cutter 3, synovial membrane cutter transverse axis 4, the upper end of central rotating shaft 2 is provided with the radial hole 5 that runs through, synovial membrane cutter transverse axis 4 runs through the horizontal layout that is parallel to base 1 behind the radial hole 5, the top center of central rotating shaft 2 have vertically to spacing screwed hole 6, spacing screwed hole 6 is communicated with radial hole 5, the spacing screw rod 7 spacing screwed hole 6 that is threaded, and synovial membrane cutter transverse axis 4 is pressed in the lower end of spacing screw rod 7, synovial membrane cutter 3 is perpendicular to the horizontal layout of base 1, one end of synovial membrane cutter transverse axis 4 runs through the radial location hole, upper end 8 of synovial membrane cutter 3, and the cutter head part 9 of synovial membrane cutter 3 is towards the plane of base 1.The lower surface of base 1 is provided with four base pads pin 10.

Claims (2)

1. draw film machine structure for one kind, it comprises base, central rotating shaft, described central rotating shaft vertically is plugged in the center of described base, it is characterized in that: it also comprises the synovial membrane cutter, synovial membrane cutter transverse axis, the upper end of described central rotating shaft is provided with the radial hole that runs through, described synovial membrane cutter transverse axis runs through the horizontal layout that is parallel to described base behind the described radial hole, the top center of described central rotating shaft have vertically to spacing screwed hole, described spacing screwed hole is communicated with described radial hole, spacing screw flight connects described spacing screwed hole, and described synovial membrane cutter transverse axis is pressed in the lower end of described spacing screw rod, described synovial membrane cutter is perpendicular to the horizontal layout of described base, one end of described synovial membrane cutter transverse axis runs through the radial location hole, upper end of described synovial membrane cutter, and the cutter head part of described synovial membrane cutter is towards the plane of described base.
2. a kind of stroke of film machine structure according to claim 1, it is characterized in that: the lower surface of described base is provided with four base pads pin.
CN 201220652815 2012-12-03 2012-12-03 Film delimiting machine structure Expired - Lifetime CN203031655U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220652815 CN203031655U (en) 2012-12-03 2012-12-03 Film delimiting machine structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220652815 CN203031655U (en) 2012-12-03 2012-12-03 Film delimiting machine structure

Publications (1)

Publication Number Publication Date
CN203031655U true CN203031655U (en) 2013-07-03

Family

ID=48683796

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220652815 Expired - Lifetime CN203031655U (en) 2012-12-03 2012-12-03 Film delimiting machine structure

Country Status (1)

Country Link
CN (1) CN203031655U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103021911A (en) * 2012-12-03 2013-04-03 无锡红光微电子有限公司 Film-cutting machine structure
CN105818194A (en) * 2016-05-20 2016-08-03 江阴普顿塑胶有限公司 Cutting device for bin separation boards of septic tank
CN107073733A (en) * 2014-11-05 2017-08-18 株式会社Lg化学 Cut the production method and production system of product

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103021911A (en) * 2012-12-03 2013-04-03 无锡红光微电子有限公司 Film-cutting machine structure
CN107073733A (en) * 2014-11-05 2017-08-18 株式会社Lg化学 Cut the production method and production system of product
CN107073733B (en) * 2014-11-05 2019-08-13 株式会社Lg化学 Cut the production method and production system of product
CN105818194A (en) * 2016-05-20 2016-08-03 江阴普顿塑胶有限公司 Cutting device for bin separation boards of septic tank

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C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20130703

CX01 Expiry of patent term