CN203013682U - Substrate wafer pasting template - Google Patents
Substrate wafer pasting template Download PDFInfo
- Publication number
- CN203013682U CN203013682U CN 201220744892 CN201220744892U CN203013682U CN 203013682 U CN203013682 U CN 203013682U CN 201220744892 CN201220744892 CN 201220744892 CN 201220744892 U CN201220744892 U CN 201220744892U CN 203013682 U CN203013682 U CN 203013682U
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- CN
- China
- Prior art keywords
- substrate wafer
- template
- pasting
- substrate
- wafer pasting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a substrate wafer pasting template, comprising an annular template body; wherein the annular template body is provided with locating slots which are arranged uniformly. The substrate wafer pasting template of the utility model is simple and reasonable in structure, when wafers are pasted, the substrate wafers are put into the locating slots, thus the substrate wafer pasting template can well realize pasting and positioning for the substrate wafers, and can effectively avoid the occurrence of the problem of inconsistent pasting spacing; in addition, the substrate wafer pasting template is convenient in operation, and can effectively adsorb the superfluous wax liquid, thereby raising product quality and working efficiency, and keeping cleaning of a production environment; by adopting modified rubber as a principal raw material, the substrate wafer pasting template has the advantages of good pasting property, heat resistance, deformation resistance, capacity for adsorbing impurity, etc., at the same time, the substrate wafer pasting template is low in production cost, and is energy-saving and environmental friendly.
Description
Technical field
The utility model relates to a kind of paster template, specifically refers to a kind of paster template of waxing and using for substrate wafer.
Background technology
Existing manual waxing machine paster link is carried out paster with operative employee's memory and qualification entirely, therefore causes having spacing not of uniform size between wafer and wafer, wafer and dish, is unfavorable for following process; During paster, air bag can be extruded redundant paraffin power liquid and sticks on air bag, affects cleanliness factor and following process efficient.
The utility model content
For the deficiency that prior art exists, technical problem to be solved in the utility model is, a kind of substrate wafer paster template is provided, and can guarantee that substrate wafer paster time interval is evenly unified, is convenient to following process, improves the quality of products and working (machining) efficiency.
For solving the problems of the technologies described above, technical solution adopted in the utility model is, a kind of substrate wafer paster template, and it comprises the circular die plate body, on described circular die plate body, evenly distributed location notch is set.
Above-mentioned a kind of substrate wafer paster template, its location notch is circular groove, and circular groove and annular template inner circle tangent position arrange opening.
Above-mentioned a kind of substrate wafer paster template, the reverse position of its location notch openend arranges the horizontal line flange.
Above-mentioned a kind of substrate wafer paster template, its location notch is evenly arranged along circular die plate body circumference array.
Above-mentioned a kind of substrate wafer paster template, its circular die plate body is the modified rubber pad.
The utlity model has following advantage and beneficial effect:
1, substrate wafer paster template of the present utility model, simple and reasonable, during paster, substrate wafer put into location notch, can be good at realizing the paster location to substrate wafer, effectively avoids the appearance of paster spacing inconsistence problems.
2, substrate wafer paster template of the present utility model, easy to operate, can effectively adsorb redundant paraffin power liquid, improves the quality of products and operating efficiency, keeps the cleaning of production environment.
3, substrate wafer paster template of the present utility model adopts modified rubber as primary raw material, has stickiness good, heat-resisting, resistance to deformation, can adsorb the advantage such as impurity, low production cost simultaneously, energy-conserving and environment-protective.
Description of drawings
Fig. 1 is substrate wafer paster formwork structure schematic diagram of the present utility model;
In above-mentioned figure:
1-circular die plate body, 2-location notch, 3-opening, 4-horizontal line flange.
Embodiment
The substrate wafer paster template of the present embodiment, it comprises circular die plate body 1, evenly distributed location notch 2 is set on circular die plate body 1, location notch 2 is circular groove, and the tangent position of circular groove and annular template 1 inner circle arranges opening 3, and the reverse position of location notch 2 openends arranges horizontal line flange 4, and location notch 2 is along circular die plate body 1 circumference array, evenly arrange, circular die plate body 1 is the modified rubber pad.
The above, only to preferred embodiment of the present utility model, be not to be that the utility model is done other forms of restriction, any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equivalent variations.But every the utility model scheme content that do not break away to any simple modification made for any of the above embodiments, equivalent variations and remodeling, still belongs to protection range of the present utility model according to technical spirit of the present utility model.
Claims (5)
1. substrate wafer paster template, it is characterized in that: it comprises the circular die plate body, on described circular die plate body, evenly distributed location notch is set.
2. a kind of substrate wafer paster template according to claim 1, it is characterized in that: described location notch is circular groove, and circular groove and annular template inner circle tangent position arrange opening.
3. a kind of substrate wafer paster template according to claim 2, it is characterized in that: the reverse position of described location notch openend arranges the horizontal line flange.
4. according to claim 1,2 or 3 described a kind of substrate wafer paster templates, it is characterized in that: described location notch is evenly arranged along circular die plate body circumference array.
5. a kind of substrate wafer paster template according to claim 1, it is characterized in that: described circular die plate body is the modified rubber pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220744892 CN203013682U (en) | 2012-12-29 | 2012-12-29 | Substrate wafer pasting template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220744892 CN203013682U (en) | 2012-12-29 | 2012-12-29 | Substrate wafer pasting template |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203013682U true CN203013682U (en) | 2013-06-19 |
Family
ID=48605247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220744892 Expired - Fee Related CN203013682U (en) | 2012-12-29 | 2012-12-29 | Substrate wafer pasting template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203013682U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113659056A (en) * | 2021-07-14 | 2021-11-16 | 秦明辉 | A LED wafer substrate paster gasket places equipment for wisdom community |
-
2012
- 2012-12-29 CN CN 201220744892 patent/CN203013682U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113659056A (en) * | 2021-07-14 | 2021-11-16 | 秦明辉 | A LED wafer substrate paster gasket places equipment for wisdom community |
| CN113659056B (en) * | 2021-07-14 | 2023-06-27 | 汇涌进光电(浙江)有限公司 | LED chip substrate patch pad placement equipment for smart community |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180606 Address after: 221300 Pizhou Economic Development Zone, Pizhou, Jiangsu, north of Ring Road North, east of Hongqi Road. Patentee after: Jiangsu Li Long Semiconductor Technology Co., Ltd. Address before: 266114 Shandong Qingdao high tech Industrial Development Zone - Red Island (No. 1) Patentee before: Qingdao iStarWafer Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20191229 |