CN202996902U - Safe and reliable LED lamp bead - Google Patents

Safe and reliable LED lamp bead Download PDF

Info

Publication number
CN202996902U
CN202996902U CN2012206198296U CN201220619829U CN202996902U CN 202996902 U CN202996902 U CN 202996902U CN 2012206198296 U CN2012206198296 U CN 2012206198296U CN 201220619829 U CN201220619829 U CN 201220619829U CN 202996902 U CN202996902 U CN 202996902U
Authority
CN
China
Prior art keywords
electrode pin
led chip
safe
led lamp
lamp bead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012206198296U
Other languages
Chinese (zh)
Inventor
程志坚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN SMALITE OPTOELECTRONICS CO Ltd
Original Assignee
SHENZHEN SMALITE OPTOELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN SMALITE OPTOELECTRONICS CO Ltd filed Critical SHENZHEN SMALITE OPTOELECTRONICS CO Ltd
Priority to CN2012206198296U priority Critical patent/CN202996902U/en
Application granted granted Critical
Publication of CN202996902U publication Critical patent/CN202996902U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)

Abstract

A safe and reliable LED lamp bead relates to the field of a light-emitting diode package. A reflection recessed cup is equipped at the center of a packaging housing. The bottom surface of a first electrode pin and the bottom surface of a second electrode pin are equipped at the bottom of the packaging housing. The inside surface of the first electrode pin and the inside surface of the second electrode pin are respectively inserted into the packaging housing. The upper surfaces which are connected with the inside surfaces are equipped at the bottom of the reflection recessed cup. An LED chip is equipped at the bottom of the reflection recessed cup. The LED chip is respectively connected with the first electrode pin and the second electrode pin through a metal lead. Packaging material is equipped in the reflection recessed cup. The safe and reliable LED lamp bead has the following advantages: short heat conduction path, high heat radiation speed, long service life; no easy seepage of outer water through a combination surface between the electrode pins and the packaging body, and improved reliability.

Description

A kind of safe and reliable LED lamp pearl
Technical field:
The utility model relates to the LED package field, is specifically related to a kind of safe and reliable LED lamp pearl.
Background technology:
The SMD light-emitting diode is a kind of novel surface mounted type light emitting semiconductor device; have the advantages such as volume is little, angle of scattering is large, uniformity of luminance is good, the high and low power consumption of reliability, fast response time; glow color comprises the shades of colour of white light; therefore be widely used on various electronic products; encapsulation technology develops on the Discrete device packaging technical foundation and develops; the electrical connection of both completing chip and support is completed in the LED encapsulation; can play again the normal operation of protection tube core and wire, to reach the purpose of the stability that improves product.
The heat dissipation path of path length, the especially horizontal direction of existing LED lamp pearl heat conduction is long, and heat radiation is slow, causes the lamp pearly-lustre to decline greatly, and useful life is short; And when using, external water divides easily from the faying face of electrode pin and package main body and infiltrates, and the reliability of lamp pearl is caused a hidden trouble.
The utility model content:
The purpose of this utility model is to provide a kind of safe and reliable LED lamp pearl, and the path of its heat conduction is short, rapid heat dissipation, and the lamp pearly-lustre declines little, and the life-span is long; And be positioned at the bottom of package main body due to the binding site of electrode pin and package main body, when using, outside moisture is not easy to infiltrate from the faying face of electrode pin and package main body, thereby has improved the reliability of lamp pearl.
in order to solve the existing problem of background technology, the utility model is by the following technical solutions: it comprises encapsulating housing 1, the first electrode pin 2, the second electrode pin 3, reflective concave cup 4, LED chip 5, plain conductor 6 and encapsulating material 7, reflective concave cup 4 is arranged on the center of encapsulating housing 1, the bottom surface 3a of the bottom surface 2a of the first electrode pin 2 and the second electrode pin 3 is arranged on the bottom of encapsulating housing 1, the medial surface 3b of the medial surface 2b of the first electrode pin 2 and the second electrode pin 3 all is embedded in encapsulating housing 1, and the bottom that the upper surface 2c that is connected with medial surface 3b with medial surface 2b and 3c are arranged on reflective concave cup 4, the lateral surface 3d of the lateral surface 2d of the first electrode pin 2 and the second electrode pin 3 is arranged on the outside of encapsulating housing 1, LED chip 5 is arranged on the bottom of reflective concave cup 4, and be connected with the upper surface 2c of the first electrode pin 2, LED chip 5 by plain conductor 6 respectively with the first electrode pin 2 be connected electrode pin 3 and be connected, encapsulating material 7 is arranged in reflective concave cup 4.
Described reflective concave cup 4 can hold LED chip 5, plain conductor 6, encapsulating material 7, and can control out light effect.
The bottom surface 3a of the bottom surface 2a of described the first electrode pin 2 and the second electrode pin 3 is positions that the lamp bead weld connects when using.
Described encapsulating material 7 covers LED chip 5 and plain conductor 6, plays the effect of protection LED chip 5 and plain conductor 6.
The path of the utility model heat conduction is short, rapid heat dissipation, and the lamp pearly-lustre declines little, and the life-span is long; And be positioned at the bottom of package main body due to the binding site of electrode pin and package main body, when using, outside moisture is not easy to infiltrate from the faying face of electrode pin and package main body, thereby has improved the reliability of lamp pearl.
Description of drawings:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is perspective view of the present utility model;
Fig. 3 is the structural representation of the first electrode pin 2 in the utility model;
Fig. 4 is the structural representation of the second electrode pin 3 in the utility model.
Embodiment:
referring to figs. 1 through Fig. 4, this concrete enforcement by the following technical solutions: it comprises encapsulating housing 1, the first electrode pin 2, the second electrode pin 3, reflective concave cup 4, LED chip 5, plain conductor 6 and encapsulating material 7, reflective concave cup 4 is arranged on the center of encapsulating housing 1, the bottom surface 3a of the bottom surface 2a of the first electrode pin 2 and the second electrode pin 3 is arranged on the bottom of encapsulating housing 1, the medial surface 3b of the medial surface 2b of the first electrode pin 2 and the second electrode pin 3 all is embedded in encapsulating housing 1, and the bottom that the upper surface 2c that is connected with medial surface 3b with medial surface 2b and 3c are arranged on reflective concave cup 4, the lateral surface 3d of the lateral surface 2d of the first electrode pin 2 and the second electrode pin 3 is arranged on the outside of encapsulating housing 1, LED chip 5 is arranged on the bottom of reflective concave cup 4, and be connected with the upper surface 2c of the first electrode pin 2, LED chip 5 by plain conductor 6 respectively with the first electrode pin 2 be connected electrode pin 3 and be connected, encapsulating material 7 is arranged in reflective concave cup 4.
Described reflective concave cup 4 can hold LED chip 5, plain conductor 6, encapsulating material 7, and can control out light effect.
The bottom surface 3a of the bottom surface 2a of described the first electrode pin 2 and the second electrode pin 3 is positions that the lamp bead weld connects when using.
Described encapsulating material 7 covers LED chip 5 and plain conductor 6, plays the effect of protection LED chip 5 and plain conductor 6.
The path of this concrete enforcement heat conduction is short, rapid heat dissipation, and the lamp pearly-lustre declines little, and the life-span is long; And be positioned at the bottom of package main body due to the binding site of electrode pin and package main body, when using, outside moisture is not easy to infiltrate from the faying face of electrode pin and package main body, thereby has improved the reliability of lamp pearl.

Claims (1)

1. a safe and reliable LED lamp pearl, is characterized in that it comprises encapsulating housing (1), the first electrode pin (2), the second electrode pin (3), reflective concave cup (4), LED chip (5), plain conductor (6) and encapsulating material (7), reflective concave cup (4) is arranged on the center of encapsulating housing (1), the bottom surface (2a) of the first electrode pin (2) and the bottom surface (3a) of the second electrode pin (3) are arranged on the bottom of encapsulating housing (1), the medial surface (2b) of the first electrode pin (2) and the medial surface (3b) of the second electrode pin (3) all are embedded in encapsulating housing (1), and be connected 3b with medial surface with medial surface (2b)) upper surface (2c) that is connected and the bottom that (3c) is arranged on reflective concave cup (4), the lateral surface (2d) of the first electrode pin (2) and the lateral surface (3d) of the second electrode pin (3) are arranged on the outside of encapsulating housing (1), LED chip (5) is arranged on the bottom of reflective concave cup (4), and be connected with the upper surface (2c) of the first electrode pin (2), LED chip (5) by plain conductor (6) respectively with the first electrode pin (2) be connected electrode pin (3) and be connected, encapsulating material (7) is arranged in reflective concave cup (4).
CN2012206198296U 2012-11-21 2012-11-21 Safe and reliable LED lamp bead Expired - Fee Related CN202996902U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012206198296U CN202996902U (en) 2012-11-21 2012-11-21 Safe and reliable LED lamp bead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012206198296U CN202996902U (en) 2012-11-21 2012-11-21 Safe and reliable LED lamp bead

Publications (1)

Publication Number Publication Date
CN202996902U true CN202996902U (en) 2013-06-12

Family

ID=48568036

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012206198296U Expired - Fee Related CN202996902U (en) 2012-11-21 2012-11-21 Safe and reliable LED lamp bead

Country Status (1)

Country Link
CN (1) CN202996902U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105359284A (en) * 2013-06-28 2016-02-24 西铁城控股株式会社 Led device
CN105761624A (en) * 2016-01-19 2016-07-13 潘尚法 LED element with dip angle, LED lamp bar and display screen

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105359284A (en) * 2013-06-28 2016-02-24 西铁城控股株式会社 Led device
US10170674B2 (en) 2013-06-28 2019-01-01 Citizen Watch Co., Ltd. LED device
CN105359284B (en) * 2013-06-28 2019-05-14 西铁城时计株式会社 LED matrix
CN105761624A (en) * 2016-01-19 2016-07-13 潘尚法 LED element with dip angle, LED lamp bar and display screen
CN105761624B (en) * 2016-01-19 2019-03-15 潘尚法 A kind of LED element with angle, LED light bar and display screen

Similar Documents

Publication Publication Date Title
US20120091487A1 (en) Light emitting diode package and method for manufacturing the same
US8552462B2 (en) LED package and method for manufacturing the same
EP2355191A3 (en) Light emitting device package and lighting system
CN102881685B (en) Light-emitting diode (LED) chip on board (COB) packaging light source
US20140284639A1 (en) Light emitting diode package
JP2010226091A (en) Light emitting device
CN202996902U (en) Safe and reliable LED lamp bead
CN202930426U (en) LED device capable of realizing application effect of different light-emitting directions
CN103872218A (en) LED support and LED luminous body
CN211352619U (en) Circuit board structure with flip chip
CN104241502A (en) LED packaging structure
CN204424311U (en) A kind of terminal, LED photoflash lamp and support, module
CN204130528U (en) A kind of lead frame posture high-power LED light source module
CN203787454U (en) Led bracket and led luminous body
CN203721758U (en) LED support having good sealing performance
CN105070813A (en) Large-power LED support and packaging method thereof
TW200717854A (en) Surface mount light emitting diode package
CN203536466U (en) Top emission type LED bracket and top emission type LED device
CN203733838U (en) Full-angle light-emitting packaged LED (light-emitting diode)
CN203312357U (en) Patch type LED light source with all-angle lighting
CN102593321B (en) The method for packing of LED, LED encapsulation structure and display screen
CN203232909U (en) Integrated LED package structure
US20140319562A1 (en) Light-emitting diode package structure
CN103594599B (en) A kind of SMD LED device of high reliability high brightness
CN204927326U (en) Adopt face down chip's high finger LED fluorescent tube that shows of high light efficiency

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130612

Termination date: 20211121