CN202995238U - Projector heat dissipation device - Google Patents
Projector heat dissipation device Download PDFInfo
- Publication number
- CN202995238U CN202995238U CN 201220460476 CN201220460476U CN202995238U CN 202995238 U CN202995238 U CN 202995238U CN 201220460476 CN201220460476 CN 201220460476 CN 201220460476 U CN201220460476 U CN 201220460476U CN 202995238 U CN202995238 U CN 202995238U
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- liquid
- liquid cooling
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- cooling pipe
- heat radiator
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Abstract
The utility model relates to the projector technology, to be specific, relates to a projector heat dissipation device comprising a liquid cooling box, a liquid pipe, a water tank, and a water pump. A liquid circulation circuit can be formed by connecting the liquid cooling box, the water tank, and the water pump together, and the liquid cooling pipe passes through a refrigeration device. The utility model is advantageous in that the temperature of the solid-state light source can be greatly reduced by using the refrigeration device, the working of the solid-state light source under the constant low temperature can be realized, the stability of the working of the solid-state light source can be maintained, and the service lifetime of the solid-state light source can be prolonged.
Description
Technical field
The utility model relates to projector's technology, is specifically related to a kind of projector heat sink.
Background technology
Projector the inside has multiple component to need heat radiation, as bulb, image device, by the optical element of source ends etc., and the main wind-cooling heat dissipating mode that adopts at present.Dispelling the heat take bulb as the projection of light source machine, it is not high to require, and substantially has wind to cross and gets final product.Yet, present emerging solid state light emitter, as LED light source or LASER Light Source, heat radiation is required highlyer, the quality of heat radiation directly has influence on stability and the life-span of solid state light emitter, so the heat radiation of how to do well solid state light emitter is to be related to the important ring that can projector steady operation.
The heat dissipating method of LED light source or LASER Light Source can adopt the mode of air-cooled or liquid cooling, the structure of wind-cooling heat dissipating as shown in Figure 1, heat radiator is close on the LED heat-radiating substrate, one deck heat-conducting glue is covered to guarantee fully heat conduction in the centre, be added with fan on heat radiator, in air, this is the most frequently used heat dissipating method with the dissipation of heat on heat radiator.Liquid cooling is first derived the heat of light source by liquid as shown in Fig. 2 and 3, and through heat radiator and fan, liquid is completed the heat interchange with surrounding air, and the liquid after the reduction temperature refluxes through water tank and water pump again.The heat radiation process of this radiating mode is carried out heat interchange by distinguished and admirable and heat radiator and environment and is realized, so the temperature that heat radiator can be realized can not be lower than environment temperature, and, owing to will realizing heat interchange, the temperature of heat radiator must be higher than environment temperature, in case temperature and the environment temperature of heat radiator are suitable, this heat interchange has just stopped.Test shows, for realizing effective heat interchange, the temperature of heat radiator will be higher than environment temperature 5 degree 10 degree even.Consider the temperature difference of intermediate link in addition, the temperature of LED light source heat-radiating substrate will be higher than about environment temperature 10 degree.Yet, in current conditions, environment temperature arrival 30 degree are very normal, at this moment, the temperature of LED light source heat-radiating substrate will be up to more than 40 degree, be transformed into the temperature of the inner PN junction of semiconductor just up to more than 100 degree, surpass the working temperature that LED light source allows, have a strong impact on working stability and the life-span of LED.
The utility model content
The technical matters that the utility model solves is to overcome the deficiencies in the prior art, and a kind of projector heat sink that can decrease solid state light emitter temperature is provided.
For solving the problems of the technologies described above, the technical solution of the utility model is as follows:
A kind of projector heat sink comprises liquid cooling box, liquid cooling pipe, water tank and water pump, and liquid cooling box and water tank, water pump are connected to form liquid circulation loop by the liquid cooling pipe, and described liquid cooling pipe passes refrigerating plant.
As a kind of preferred version, described refrigerating plant comprises refrigeration groove, semiconductor chilling plate, heat radiator, the cold junction of semiconductor chilling plate and the outside surface of refrigeration groove are fitted, on its hot junction, heat radiator is installed, the liquid cooling pipe is connected with U-shaped pipeline in refrigeration groove or passes from refrigeration groove and the duct wall and the refrigeration groove inside surface that are arranged in refrigeration groove is close to.When U-shaped pipeline being set in refrigeration groove being connected with the liquid cooling pipe, the U-shaped duct wall and the refrigeration groove inside surface that are arranged in refrigeration groove are close to; When U-shaped pipeline is not set in refrigeration groove but when the liquid cooling pipe was directly passed refrigeration groove, the tube wall and the refrigeration groove inside surface that are arranged in the liquid cooling pipe of refrigeration groove were close to, and are beneficial to can carry out heat interchange with the cold junction of semiconductor chilling plate from the liquid heat that wherein passes through.
As further preferred version, the cold and hot two ends of described semiconductor chilling plate are provided with heat-conducting glue.
As further preferred version, also comprise the fan supporting with heat radiator in refrigerating plant.Utilize supporting fan facing to the heat radiator blowing, can accelerate the radiating rate of heat radiator.
As further preferred version, the liquid cooling pipe passes refrigeration groove in U-shaped pipeline coiling mode.
As further preferred version, described semiconductor chilling plate is connected with the supply unit of capable of regulating power.
As another kind of preferred version, the liquid cooling pipe was also fitted before passing refrigerating plant and is passed liquid-cooling heat radiator.In order further to improve the refrigeration of the liquid in the liquid cooling pipe, before freezing to the liquid cooling pipe, refrigerating plant also by liquid-cooling heat radiator, the liquid in the liquid cooling pipe is dispelled the heat.Wherein, the liquid in the liquid cooling pipe is not out well-determined by water tank, refrigerating plant, liquid-cooling heat radiator three's order from liquid cooling box afterwards, and its need assurance liquid first dispelled the heat by liquid-cooling heat radiator before freezing by refrigerating plant and gets final product.
As another kind of preferred version, described liquid-cooling heat radiator comprise heat radiator and with the supporting fan of heat radiator, liquid cooling pipe and heat radiator are fitted and the liquid cooling pipe passes heat radiator in U-shaped pipeline coiling mode.
As another kind of preferred version, described refrigerating plant is compression refigerating machine, and compression refigerating machine is plugged in the liquid cooling pipe, and the liquid in the liquid cooling pipe passes through from compression refigerating machine.
As another kind of preferred version, the surface that liquid cooling box engages with thermal source is provided with heat-conducting glue.
Compared with prior art, the beneficial effect of technical solutions of the utility model is:
(1) the utility model is by using the temperature that refrigerating plant can the decrease solid state light emitter, can realize that even solid state light emitter works under constant low temperature, keeps the working stability of solid state light emitter, extends the life-span of solid state light emitter.
(2) the utility model can also adopt semiconductor chilling plate as the core component of refrigerating plant, the advantage such as have the motion of shockproof, machinery-free, noise is little, volume is little and the life-span is long.
(3) power of semiconductor chilling plate can be regulated by power supply, can increase its power to improve the refrigeration of semiconductor chilling plate when environment temperature is high, can reduce its power when environment temperature is low, when environment temperature is enough low, liquid-cooling heat radiator can satisfy heat radiation when requiring, can close refrigerating plant and only use liquid-cooling heat radiator, to save power consumption.
Description of drawings
Fig. 1 is the structural representation that in prior art, solid state light emitter is dispelled the heat by air cooling way;
Fig. 2 is the structural representation that in prior art, solid state light emitter is dispelled the heat by the liquid cooling mode;
Fig. 3 is the structural representation when in prior art, the liquid-cooling heat radiation mode is applied to projector and dispels the heat;
Fig. 4 is structure diagram of the present utility model;
Fig. 5 is the structural representation of specific embodiment in the utility model;
Fig. 6 is the structural representation of concrete Application Example in the utility model.
1-light source heat radiation substrate; 2-liquid cooling pipe; 3,4-heat radiator; 5,6-fan; The 7-semiconductor chilling plate; The 8-refrigeration groove; The 9-heat-conducting glue; The 10-liquid cooling box; The 11-refrigerating plant; The 12-liquid-cooling heat radiator.
Embodiment
Below in conjunction with drawings and Examples, the technical solution of the utility model is described further.
As shown in Figure 3, be the structure diagram of a kind of projector heat sink in the present embodiment, it comprises liquid cooling box 10, liquid cooling pipe 2, water pump and water tank; Liquid cooling box 10 carries out heat interchange with thermal source, and its surface that combines with thermal source is provided with heat-conducting glue 9, and liquid cooling box 10 and water tank, water pump are connected to form liquid circulation loop by liquid cooling pipe 2, wherein water pump and the water tank installation that can link into an integrated entity.Particularly, two through holes can be set on fluid cartridge 10, a through hole is used for installing liquid cooling pipe 2, liquid cooling pipe 2 is communicated with fluid cartridge 10, another through hole is connected with an end of water tank by connecting pipe and communicates, liquid cooling pipe 2 one ends are connected with the through hole of fluid cartridge 10 and communicate, and the other end just is connected with the water tank other end and communicates, and liquid circulates in the effect by water pump of fluid cartridge 10, liquid cooling pipe 2 and water tank.Liquid cooling pipe 10 passes refrigerating plant 11, and further, liquid cooling pipe 2 also passed liquid-cooling heat radiator 12 before passing refrigerating plant 11.water tank wherein, liquid-cooling heat radiator 12, the position of refrigerating plant 11 in no particular order, but generally reached lower by the fluid temperature after refrigerating plant 11 refrigeration, if can cause adverse effect on the contrary by liquid-cooling heat radiator 12 heat radiations again, therefore, optimum mode is to pass refrigerating plant 11 after liquid line 2 first passes liquid-cooling heat radiator 12 again, particularly: liquid cooling pipe 2 can with first pass liquid-cooling heat radiator 12 before water tank is connected and pass again refrigerating plant 11, perhaps liquid cooling pipe 2 first passes liquid-cooling heat radiator 12 and is connected with water tank, pass at last refrigerating plant 11, perhaps liquid cooling pipe 2 first is connected with water tank, then successively pass liquid-cooling heat radiator 12 and refrigerating plant 11.
As shown in Figure 4, in a most preferred specific embodiment, liquid-cooling heat radiator 12 comprise heat radiator 3 and with the supporting fan 5 of heat radiator 3, liquid cooling pipe 2 is fitted with heat radiator 3 and is also passed heat radiator 3 in U-shaped pipeline coiling mode.Refrigerating plant 11 comprise refrigeration groove 8, semiconductor chilling plate 7, heat radiator 4 and with the supporting fan 6 of heat radiator 4, the cold and hot two ends of semiconductor chilling plate 7 are provided with heat-conducting glue, its cold junction is fitted by the side surface of heat-conducting glue and refrigeration groove 8, heat radiator 4 is installed after heat-conducting glue is set again in its hot junction, and liquid cooling pipe 2 is connected with U-shaped pipeline in refrigeration groove 8 or passes from refrigeration groove 8 and the duct wall and the refrigeration groove inside surface that are arranged in refrigeration groove 8 is close to.When U-shaped pipeline being set in refrigeration groove 8 being connected with liquid cooling pipe 2, the U-shaped duct wall and refrigeration groove 8 inside surfaces that are arranged in refrigeration groove 8 are close to; When U-shaped pipeline is not set in refrigeration groove 8 but when liquid cooling pipe 2 is directly passed refrigeration groove 8, the liquid cooling pipe 2 that is arranged in refrigeration groove 8 passes refrigeration groove 8 and its tube wall and refrigeration groove 8 inside surfaces in U-shaped pipeline coiling mode to be close to, and is beneficial to can carry out heat interchange with the cold junction of semiconductor chilling plate 7 from the liquid heat that wherein passes through.
During work, liquid is drawn the heat of thermal source by heat-conducting glue 9 in fluid cartridge 10, liquid flows in liquid line 2, after completing heat interchange through heat radiator 3 and air when liquid line 2 passes liquid-cooling heat radiator 12, the temperature of liquid gets reduction to a certain extent, by refrigerating plant 11, utilize semiconductor chilling plate 7 that the temperature of liquid is further reduced again, make it reach the needed temperature of desirable heat radiation.Wherein liquid adopts U-shaped pipeline coiling mode to pass through in refrigeration groove 8, realizes heat interchange by refrigeration groove 8 and the cold junction of semiconductor chilling plate 7, thus the temperature of decrease liquid; The hot junction of semiconductor chilling plate 7 and heat radiator 4 are realized the heat conduction, by the heat interchange of heat radiator 4 and fan 6 realizations and surrounding air.By being back to heat absorption again in fluid cartridge 10 after water tank and water pump, then carry out heat radiation refrigeration next time after liquid process refrigerating plant 11 refrigeration cool-downs.
In another specific embodiment, refrigerating plant 11 adopts compression refigerating machine, and compression refigerating machine is plugged in liquid cooling pipe 2, and the liquid in liquid cooling pipe 2 passes through from compression refigerating machine.Liquid line 2 can first pass liquid-cooling heat radiator 12 and then grafting compression refigerating machine, makes liquid wherein pass through the compression refigerating machine refrigeration cool-down, and then liquid line 2 is connected with water tank, realizes the circulating reflux of liquid.Liquid line 2 also can only connect compression refigerating machine to carry out refrigeration cool-down and is connected the circulating reflux that realizes liquid with water tank again.
Projector heat sink is applied to actual time, as shown in Figure 5, heat-conducting glue 9 on liquid cooling box 10 fits with the light source heat radiation substrate 1 in projector, and the number of liquid cooling box 10 can be set according to the quantity of light source in projector system, is communicated with by liquid cooling pipe 2 between a plurality of liquid cooling boxs 10.The projector heat sink refrigeration of can also dispelling the heat to the image device in projector system realizes heat interchange thereby the heat-conducting glue 9 on liquid cooling box 10 and image device in projector are fitted.After being communicated with by liquid cooling pipe 2 between a plurality of liquid cooling boxs 10, then is communicated with liquid circulation loop of formation with water tank, then passes according to actual needs liquid-cooling heat radiator 12 and refrigerating plant 11 refrigeration of dispelling the heat.
Claims (9)
1. a projector heat sink, comprise liquid cooling box, liquid cooling pipe, water tank and water pump, and liquid cooling box and water tank, water pump are connected to form liquid circulation loop by the liquid cooling pipe, it is characterized in that, described liquid cooling pipe passes refrigerating plant;
The liquid cooling pipe was also fitted before passing refrigerating plant and is passed liquid-cooling heat radiator.
2. projector heat sink according to claim 1, it is characterized in that, described refrigerating plant comprises refrigeration groove, semiconductor chilling plate, heat radiator, the cold junction of semiconductor chilling plate and the outside surface of refrigeration groove are fitted, on its hot junction, heat radiator is installed, the liquid cooling pipe is connected with U-shaped pipeline in refrigeration groove or passes from refrigeration groove and the duct wall and the refrigeration groove inside surface that are arranged in refrigeration groove is close to.
3. projector heat sink according to claim 2, is characterized in that, the cold and hot two ends of described semiconductor chilling plate are provided with heat-conducting glue.
4. projector heat sink according to claim 2, is characterized in that, also comprises the fan supporting with heat radiator in refrigerating plant.
5. projector heat sink according to claim 2, is characterized in that, the liquid cooling pipe passes refrigeration groove in U-shaped pipeline coiling mode.
6. projector heat sink according to claim 2, is characterized in that, described semiconductor chilling plate is connected with the supply unit of capable of regulating power.
7. projector heat sink according to claim 1, is characterized in that, described liquid-cooling heat radiator comprise heat radiator and with the supporting fan of heat radiator, liquid cooling pipe and heat radiator are fitted and the liquid cooling pipe passes heat radiator in U-shaped pipeline coiling mode.
8. projector heat sink according to claim 1, is characterized in that, described refrigerating plant is compression refigerating machine, and compression refigerating machine is plugged in the liquid cooling pipe, and the liquid in the liquid cooling pipe passes through from compression refigerating machine.
9. the described projector heat sink of according to claim 1 to 8 any one, is characterized in that, the surface that liquid cooling box engages with thermal source is provided with heat-conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220460476 CN202995238U (en) | 2012-09-11 | 2012-09-11 | Projector heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220460476 CN202995238U (en) | 2012-09-11 | 2012-09-11 | Projector heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202995238U true CN202995238U (en) | 2013-06-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220460476 Expired - Fee Related CN202995238U (en) | 2012-09-11 | 2012-09-11 | Projector heat dissipation device |
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| Country | Link |
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| CN (1) | CN202995238U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102830581A (en) * | 2012-09-11 | 2012-12-19 | 广东威创视讯科技股份有限公司 | Radiating device of projector |
| CN103676429A (en) * | 2013-12-29 | 2014-03-26 | 苏州市峰之火数码科技有限公司 | Heat absorber device for pipe of projector |
| WO2017088398A1 (en) * | 2015-11-25 | 2017-06-01 | 广景视睿科技（深圳）有限公司 | Projector |
| WO2017088806A1 (en) * | 2015-11-27 | 2017-06-01 | 深圳市绎立锐光科技开发有限公司 | Integrated liquid cooling system and projection device |
| CN107340676A (en) * | 2017-08-04 | 2017-11-10 | 深圳市奈士迪技术研发有限公司 | A kind of high power intelligent projector equipment for being capable of high efficiency and heat radiation |
| CN108387991A (en) * | 2017-02-24 | 2018-08-10 | 武汉普惠海洋光电技术有限公司 | Applied to optical accurate temperature controller method and apparatus |
| CN109140291A (en) * | 2018-07-09 | 2019-01-04 | 慈溪生轩照明灯具有限公司 | A kind of LED projector lamp equipped with radiator |
| CN110824818A (en) * | 2019-09-30 | 2020-02-21 | 深圳市火乐科技发展有限公司 | Projector with a light source |
| CN114994965A (en) * | 2022-05-23 | 2022-09-02 | 湖北如新电子有限公司 | Liquid crystal screen projector with winding displacement from end side |
| CN117406843A (en) * | 2023-11-08 | 2024-01-16 | 无锡巨日装备科技有限公司 | Heat abstractor based on liquid heat transfer medium |
-
2012
- 2012-09-11 CN CN 201220460476 patent/CN202995238U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102830581A (en) * | 2012-09-11 | 2012-12-19 | 广东威创视讯科技股份有限公司 | Radiating device of projector |
| CN102830581B (en) * | 2012-09-11 | 2015-03-25 | 广东威创视讯科技股份有限公司 | Radiating device of projector |
| CN103676429A (en) * | 2013-12-29 | 2014-03-26 | 苏州市峰之火数码科技有限公司 | Heat absorber device for pipe of projector |
| WO2017088398A1 (en) * | 2015-11-25 | 2017-06-01 | 广景视睿科技（深圳）有限公司 | Projector |
| WO2017088806A1 (en) * | 2015-11-27 | 2017-06-01 | 深圳市绎立锐光科技开发有限公司 | Integrated liquid cooling system and projection device |
| CN108387991A (en) * | 2017-02-24 | 2018-08-10 | 武汉普惠海洋光电技术有限公司 | Applied to optical accurate temperature controller method and apparatus |
| CN107340676A (en) * | 2017-08-04 | 2017-11-10 | 深圳市奈士迪技术研发有限公司 | A kind of high power intelligent projector equipment for being capable of high efficiency and heat radiation |
| CN109140291A (en) * | 2018-07-09 | 2019-01-04 | 慈溪生轩照明灯具有限公司 | A kind of LED projector lamp equipped with radiator |
| CN109140291B (en) * | 2018-07-09 | 2021-02-02 | 慈溪生轩照明灯具有限公司 | LED projecting lamp with heat abstractor |
| CN110824818A (en) * | 2019-09-30 | 2020-02-21 | 深圳市火乐科技发展有限公司 | Projector with a light source |
| CN114994965A (en) * | 2022-05-23 | 2022-09-02 | 湖北如新电子有限公司 | Liquid crystal screen projector with winding displacement from end side |
| CN114994965B (en) * | 2022-05-23 | 2024-02-27 | 湖北如新电子有限公司 | End-side-outlet flat cable liquid crystal screen projector |
| CN117406843A (en) * | 2023-11-08 | 2024-01-16 | 无锡巨日装备科技有限公司 | Heat abstractor based on liquid heat transfer medium |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20190911 |