CN202984423U - Super-thick hemispheric die - Google Patents
Super-thick hemispheric die Download PDFInfo
- Publication number
- CN202984423U CN202984423U CN 201220380702 CN201220380702U CN202984423U CN 202984423 U CN202984423 U CN 202984423U CN 201220380702 CN201220380702 CN 201220380702 CN 201220380702 U CN201220380702 U CN 201220380702U CN 202984423 U CN202984423 U CN 202984423U
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- CN
- China
- Prior art keywords
- die
- thick
- super
- hemispheric
- counterdie
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Abstract
The utility model relates to a super-thick hemispheric die which comprises an upper die and a lower die, wherein the upper die is of a hemispheric structure, the lower die is an annular support body, an oblique surface is arranged on the upper edge of the inner wall of the lower die, the included angle alpha between the oblique surface and the axis of the lower die is from 30 degrees to 45 degrees, and the upper edge of the oblique surface and the lower edge of the oblique surface are both in circular arc transition. The super-thick hemispheric die is simple in structure. Due to the improvement of the upper edge of the inner wall of the lower die, smooth drawing is guaranteed, plates are protected, and molding efficiency is improved at the same time. The super-thick hemispheric die is reasonable in structure, easy to manufacture and machine, good in using effect, and popularized and applied easily.
Description
Technical field
The utility model relates to the end socket die for manufacturing of metal production industry, is specifically related to a kind of super thick hemisphere mould.
Background technology
The large thick-wall hemispherical head is one of strength member of the equipment such as chemical industry, nuclear power, and the control of its size, shape and wall thickness is the key of drawing process success or failure.Solve its stretch forming problem, of great advantage to the preparation of correctly designing mould and blank.
Summary of the invention
The utility model provides a kind of super thick hemisphere mould for the problem and shortage that exists about large thick-wall hemisphere forming technique in prior art.
Technical scheme: a kind of super thick hemisphere mould, comprise mold (punch) and bed die (die), mold is the semicircle ball shape structure, counterdie is annular support, the inwall top edge of counterdie arranges the inclined plane, the scope of this inclined plane and counterdie axle center angle α is 30 °≤α≤45 °, and the upper and lower rib on this inclined-plane is arc transition respectively.
The scope of inclined plane and counterdie axle center angle α is preferably 35 °≤α≤42 °
Beneficial effect: the utility model mould structure is simple, can guarantee that the smooth and easy of drawing process carries out after bed die inwall top edge is improved, and sheet material is had protective effect, can improve shaping efficiency simultaneously; It is rational in infrastructure, easily makes processing, and result of use is good, is beneficial to very much promotion and implementation.
Description of drawings
Figure l is the cross-sectional view of the super thick hemisphere mould of the utility model.
Fig. 2 is the structural representation of the super thick hemisphere mould of the utility model
In figure, label 1 is mold, and 2 is bed die, and 3 is sheet material.
The specific embodiment
Embodiment one: referring to Fig. 1 and Fig. 2, this super thick hemisphere mould comprises mold 1 and bed die 2, patrix 1 tool is the semicircle ball shape structure, counterdie 2 is annular support, the inwall top edge of counterdie arranges the inclined plane, the scope of this inclined plane and counterdie axle center angle α is 37 °≤α≤39 °, and the upper and lower rib on this inclined-plane is arc transition respectively.
Claims (2)
1. super thick hemisphere mould, it is characterized in that: comprise mold and bed die, mold is the semicircle ball shape structure, counterdie is annular support, the inwall top edge of counterdie arranges the inclined plane, the scope of this inclined plane and counterdie axle center angle α is 30 °≤α≤45 °, and the upper and lower rib on this inclined-plane is arc transition respectively.
2. super thick hemisphere mould according to claim 1 is characterized in that: the scope of inclined plane and counterdie axle center angle α is 35 °≤α≤42 °.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220380702 CN202984423U (en) | 2012-08-02 | 2012-08-02 | Super-thick hemispheric die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220380702 CN202984423U (en) | 2012-08-02 | 2012-08-02 | Super-thick hemispheric die |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202984423U true CN202984423U (en) | 2013-06-12 |
Family
ID=48555646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220380702 Expired - Fee Related CN202984423U (en) | 2012-08-02 | 2012-08-02 | Super-thick hemispheric die |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202984423U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108637093A (en) * | 2018-04-28 | 2018-10-12 | 中南大学 | A kind of aluminium alloy hemispherical shell warm forming die |
-
2012
- 2012-08-02 CN CN 201220380702 patent/CN202984423U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108637093A (en) * | 2018-04-28 | 2018-10-12 | 中南大学 | A kind of aluminium alloy hemispherical shell warm forming die |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20150802 |
|
EXPY | Termination of patent right or utility model |