CN202977526U - COB package LED device - Google Patents
COB package LED device Download PDFInfo
- Publication number
- CN202977526U CN202977526U CN 201220724875 CN201220724875U CN202977526U CN 202977526 U CN202977526 U CN 202977526U CN 201220724875 CN201220724875 CN 201220724875 CN 201220724875 U CN201220724875 U CN 201220724875U CN 202977526 U CN202977526 U CN 202977526U
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat
- conducting part
- led device
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model provides a COB package LED device. The COB package LED device comprises a substrate. At least one LED chip is arranged on the substrate. A radiator is arranged below the substrate. The substrate comprises a heat conduction part and a connecting part, wherein the heat conduction part and the connecting part are parallelly arranged in the horizontal direction. The LED chip is arranged on the upper surface of the heat conduction part. The heat conduction part is copper. The connecting part is ceramic or glass fiber. A pad is arranged between the connecting part and the radiator. The substrate is divided into two parts. Good heat conductivity of metal is used, and the convenience of pad arranging of the non-metallic substrate is combined. The defects of two kinds of the traditional single-structure substrates are overcome. The requirement of a high power device for radiation effect is met, and pad arranging is convenient.
Description
Technical field
The utility model relates to a kind of LED device of COB encapsulation.
Background technology
COB is the english abbreviation of Chip On Board (on plate, wafer directly fills), is a kind ofly by adhesive or scolder, LED chip directly to be pasted on substrate, then realizes the encapsulation technology of electrical interconnection between LED chip and substrate by Bonding.Polluted in air or artificial damage for preventing that LED chip is directly exposed to, impact or destruction chip functions use resin glue that LED chip and bonding wire are encapsulated.Substrate can be glass fibre cheaply, can be also the metal substrate of high thermal conductance, as aluminium base or copper-clad base plate etc.
Illustrated in figures 1 and 2 is the structure of the LED device of two kinds of existing COB encapsulation.Be the mode of using the all-metal substrate in Fig. 1, if substrate 1 use is nonweldable aluminium, need to use heat-conducting silicone grease 9 as heat-conducting medium, the heat on substrate 1 is conducted to radiator 3.If the use copper base, pad 7 must be arranged in the upper surface of substrate 1, and necessary welding lead separately, complex process.Figure 2 shows that the non-metal base plate of use, the material of substrate 1 is generally pottery or glass fibre, although can arrange whole pad 7 between the lower surface of substrate 1 and radiator 3, but because conventional its conductive coefficient of nonmetallic materials is lower, so heat conductivility is relatively poor, the integral heat sink effect of LED device is bad, and along with the universal of LED device and power constantly increase, radiating effect will directly affect useful life and the range of application of device.The surface roughness of the upper surface of while non-metal base plate also is difficult to be worked into high-level, the more impossible minute surface of accomplishing, and both surface roughness was 0.006, the low utilance that will reduce light of the rank of surface roughness.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of LED device of COB encapsulation, and the LED device of this COB encapsulation has overcome the defective of above two kinds of substrates, has both satisfied high power device to the requirement of radiating effect, again the convenient pad of arranging.
The technical scheme that the utility model technical solution problem adopts is: the LED device of this COB encapsulation comprises substrate, be provided with at least one LED chip on described substrate, be provided with radiator below described substrate, described substrate comprises heat-conducting part and the connecting portion that is set up in parallel in the horizontal direction, and described LED chip is arranged at the upper surface of described heat-conducting part; Described heat-conducting part is copper, and described connecting portion is pottery or glass fibre, is provided with pad between described connecting portion and radiator.Substrate is divided into two parts, has namely utilized the thermal conductive resin of metal, combines again non-metal base plate in the convenience of arranging on pad, and the defective of two kinds of traditional single structure substrates is all overcome.
Described heat-conducting part equates with the thickness of described connecting portion, and product is more regular, and it is easier that technique is connected.
Be provided with glue-line between described heat-conducting part and described connecting portion, described heat-conducting part and described connecting portion are bonding, and the thickness of described glue-line is less than 0.05mm.The stroke that glue-line can absorbing thermal expansion causes, and can keep the product miniaturization.
In order to increase thermal conductivity and fastness, described heat-conducting part and the welding of described radiator.
The surface roughness of the upper surface of described heat-conducting part is 0.006, and the upper surface of heat-conducting part reaches mirror effect, has improved the reflectivity of light, makes the light intensity of emergent light higher.
The beneficial effects of the utility model are: the LED device of this COB encapsulation is by changing the structure of substrate, substrate is divided into heat-conducting part and connecting portion two parts, both utilize good thermal conductivity and the weldability of metallic copper, inherited again non-metal base plate in the advantage of arranging on pad.Overcome the defective separately of the substrate of two kinds of traditional single structures, the advantages with two kinds of substrates has improved heat transfer efficiency, thereby has extended the whole service life of LED device, has also satisfied the heat radiation requirement of high-power illumination light fixture.Simultaneously, do not need to change on the technique of arranging pad, processing cost is well controlled.Utilize the good machining property of copper, the upper surface of heat-conducting part can process mirror effect at an easy rate, has improved the reflectivity of substrate to light, and the light that LED chip sends is utilized better, in the situation that equal power output, illumination brightness is stronger.
Description of drawings
Fig. 1 is a kind of structural representation of structure of the LED device of existing COB encapsulation.
Fig. 2 is the structural representation of another kind of structure of the LED device of existing COB encapsulation.
Fig. 3 is the structural representation of the LED device of the utility model COB encapsulation.
Embodiment
As shown in Figure 3, substrate 1 comprises heat-conducting part 4 and connecting portion 5 two parts.LED chip 2 is arranged on the upper surface of heat-conducting part 4, heat-conducting part 4 uses sheet copper, utilize the good heat conductivility of copper, the heat that LED chip 2 can be sent conducts on radiator 3 fast, and with respect to the alloy of aluminium or aluminium, the weldability of copper is better, can use tin cream etc. that heat-conducting part 4 and radiator 3 are welded together.The connecting portion 5 of substrate 1 is nonmetal, preferably adopts pottery of the prior art or glass fibre, so just can lay easily pad 7 on connecting portion 5, and is very little to the change of existing Wiring technique, even can not change.Heat-conducting part 4 is set up in parallel with connecting portion 5 levels, and thickness is equal, and heat-conducting part 4 is positioned at the centre of connecting portion 5, although adopt the thermal conductivity of nonmetallic connecting portion 5 lower, but the heat-conducting effect of heat-conducting part 4 is very good, and the heat that can rapidly LED chip 2 be sent conducts on radiator 3.Substrate 1 is divided into two parts, utilizes metal and nonmetallic separately advantage, overcome the defective of prior art, make heat conduction and arrange that the effect of pad all arrives the best.
a kind of better mode is, between heat-conducting part 4 and connecting portion 5, glue-line 6 is set, utilize the adhesivess such as silicon rubber that heat-conducting part 4 and connecting portion 5 are bonded together, because heat-conducting part 4 is different with the material of connecting portion 5, the coefficient that expands with heat and contract with cold is also different, in the situation that LED chip 2 is lighted for a long time, heat can cause the swell increment of heat-conducting part 4 and connecting portion 5 different, and adhesives generally still has certain elasticity after curing, glue-line 6 can absorb the stroke that heat-conducting part 4 and connecting portion 5 produce when expanding with heat and contract with cold, avoid two parts mutually conflict or break away from fully.The thickness of glue-line 6 so neither affects the each several part of substrate 1 and the overall dimensions of LED device preferably less than 0.05mm, can guarantee again adhesive strength and enough extendable rooms.
Claims (6)
1.COB the LED device of encapsulation, comprise substrate (1), be provided with at least one LED chip (2) on described substrate (1), be provided with radiator (3) in the below of described substrate (1), it is characterized in that: described substrate (1) comprises heat-conducting part (4) and the connecting portion (5) that is set up in parallel in the horizontal direction, and described LED chip (2) is arranged at the upper surface of described heat-conducting part (4); Described heat-conducting part (4) is copper, and described connecting portion (5) is pottery or glass fibre, is provided with pad (7) between described connecting portion (5) and radiator (3).
2. the LED device of COB according to claim 1 encapsulation, it is characterized in that: described heat-conducting part (4) equates with the thickness of described connecting portion (5).
3. the LED device of COB according to claim 1 encapsulation, it is characterized in that: be provided with glue-line (6) between described heat-conducting part (4) and described connecting portion (5), described heat-conducting part (4) and described connecting portion (5) are bonding.
4. the LED device of COB according to claim 3 encapsulation, it is characterized in that: the thickness of described glue-line (6) is less than 0.05mm.
5. the LED device of COB encapsulation according to claim 1, is characterized in that: described heat-conducting part (4) and described radiator (3) welding.
6. the LED device of COB according to claim 1 encapsulation, it is characterized in that: the surface roughness of the upper surface of described heat-conducting part (4) is 0.006.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220724875 CN202977526U (en) | 2012-12-25 | 2012-12-25 | COB package LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220724875 CN202977526U (en) | 2012-12-25 | 2012-12-25 | COB package LED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202977526U true CN202977526U (en) | 2013-06-05 |
Family
ID=48518566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220724875 Expired - Fee Related CN202977526U (en) | 2012-12-25 | 2012-12-25 | COB package LED device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202977526U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576876A (en) * | 2013-10-28 | 2015-04-29 | 四川新力光源股份有限公司 | Integrated circular cone COB packaging LED light source and preparation method thereof |
-
2012
- 2012-12-25 CN CN 201220724875 patent/CN202977526U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576876A (en) * | 2013-10-28 | 2015-04-29 | 四川新力光源股份有限公司 | Integrated circular cone COB packaging LED light source and preparation method thereof |
| CN104576876B (en) * | 2013-10-28 | 2017-10-31 | 四川新力光源股份有限公司 | One-piece type circular cone COB encapsulated LED light sources and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201187696Y (en) | Flexible circuit board of LED illumination array | |
| CN101603636A (en) | Light supply apparatus | |
| CN203481273U (en) | LED light source module based on AlSiC composite substrate | |
| CN101592322A (en) | The LED method for packing of high-power LED lighting fixture | |
| CN102064247A (en) | Packaging method and packaging structure for embedded light emitting diode | |
| CN201956388U (en) | Softly connected LED (light-emitting diode) device based on liquid metal substrate | |
| CN101984510A (en) | Flexibly connected light-emitting diode (LED) device based on liquid metal base | |
| CN212851202U (en) | Novel LED drive circuit board | |
| CN203605189U (en) | Integrated heat dissipation structure applicable to LED lamp and backlight module | |
| CN102364684B (en) | LED (Light-Emitting Diode) module and manufacturing process thereof | |
| CN202977526U (en) | COB package LED device | |
| CN101949521A (en) | LED integrated light source board and manufacturing method thereof | |
| CN107887352B (en) | Convenient for the rectifying device of heat dissipation | |
| CN202183413U (en) | Epoxy resin-based low power white light LED packaging structure | |
| CN201412786Y (en) | LED mounting structure of large power LED illumination lamp | |
| CN201243024Y (en) | Non-throwing encapsulation structure of LED | |
| CN201829498U (en) | Light emitting diode (LED) integrated light source panel | |
| CN203746850U (en) | High-efficiency LED module group device capable of omnibearing light emission | |
| CN202101047U (en) | High-power LED (light-emitting diode) light source module with excellent heat dissipation performance | |
| CN203800073U (en) | COB light source composite aluminum substrate support | |
| CN203351666U (en) | Led module | |
| CN201570516U (en) | LED packaging structure | |
| CN207216219U (en) | The FPC and backlight module of a kind of backlight module | |
| CN202712234U (en) | Solar cell module having heat-dissipation packaging structure | |
| CN202092078U (en) | Heat-dissipation system of light-emitting diode (LED) lamp and LED lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20171225 |