CN202977415U - Warm light LED (Light Emitting Diode) lamp package structure - Google Patents
Warm light LED (Light Emitting Diode) lamp package structure Download PDFInfo
- Publication number
- CN202977415U CN202977415U CN2012207093111U CN201220709311U CN202977415U CN 202977415 U CN202977415 U CN 202977415U CN 2012207093111 U CN2012207093111 U CN 2012207093111U CN 201220709311 U CN201220709311 U CN 201220709311U CN 202977415 U CN202977415 U CN 202977415U
- Authority
- CN
- China
- Prior art keywords
- chip
- led
- chips
- light
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a warm light LED (Light Emitting Diode) lamp package structure comprising a bracket, and a light emitting chip, a reflection cup and a lens, which are arranged on the bracket, wherein the light emitting chip is composed of three serially connected LED chips, the chip at the middle is a red light LED chip, the chips on the two sides are blue light LED chips, and yellow fluorescence excitation layers are arranged on the blue light LED chips. The white light emitted by the LED lamp utilizing the chips arranged in a combination manner is low in color temperature and soft in vision, so that the lamp is suitable to be used as an indoor LED illuminating lamp. Meanwhile, only the yellow fluorescence excitation layers are utilized during the package process, so that the performance is stable, the cost is low and the lamp is convenient to manufacture.
Description
Technical field
The utility model belongs to LED lamp encapsulation technology field, specifically relates to a kind of encapsulating structure of warm colour light LED lamp.
Background technology
Along with the popularization of LED on illumination is used, more and more higher to the quality requirements of light.Particularly room lighting, not only require it that higher color rendering index and luminous efficiency are arranged, and be the warm white that colour temperature is lower, radiation response is warm.The way of existing use is generally to utilize blue chip to add composite phosphor to realize, composite phosphor is to add the different fluorescent material such as ruddiness, green glow on the basis of gold-tinted fluorescent material.The price comparison of the fluorescent material such as ruddiness, green glow is high, makes trouble, unstable properties.The warm light LED lamp cost of making of composite phosphor is high, the bad control of the indexs such as luminous efficiency.For reducing the market cost of warm light LED lamp, the mode of the blue and red chip collocation of some employings, but the LED lamp of existing combination collocation, its encapsulating structure complexity, bright dipping is soft not.
Summary of the invention
It is low that the technical problems to be solved in the utility model is to provide a kind of cost, the warm light LED lamp encapsulation structure that color rendering is good.
For solving the problems of the technologies described above, the utility model comprises support and luminescence chip, reflector and the lens established thereon, its design feature is that described luminescence chip is made of 3 LED chips that are connected in series, chip in the middle of it is red LED chip, the chip on both sides is blue-light LED chip, and described blue-light LED chip is provided with the yellow fluorescence excitation layer.
The LED chip of described 3 series connection is the warm light unit of, and 3 chips in this warm light unit are arranged in a linear, and red LED chip and the distance between blue-light LED chip of described warm light unit are 0.5 to 3 millimeter.
After adopting said structure, because luminescence chip is made of 3 LED chips that are connected in series, namely luminescence chip is in series by blue light, red LED chip, and does not establish the fluorescence excitation layer on middle red LED chip.Adopt the LED lamp of this assembled arrangement chip, the white light colour temperature that it sends is low, and vision is soft, is suitable for room lighting.Simultaneously, only adopt the yellow fluorescence excitation layer during encapsulation, its stable performance, cost is low, is convenient to make.
Description of drawings
Below in conjunction with drawings and Examples, the utility model is further described:
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model cutaway view.
Embodiment
With reference to accompanying drawing, should comprise support 1 by warm light LED lamp encapsulation structure, support 1 is provided with the warm light luminescence unit that is composed in series by 3 LED chips, also be provided with reflector 5 on support 1,3 chips of this luminescence unit are in a reflector 5, the interior establishing optical lens 6 of reflector 5, lens 6 join with support 1.3 LED chips that are connected in series in luminescence unit, the chip in the middle of it is red LED chip 3, the chip on both sides is blue-light LED chip 2, is provided with yellow fluorescence excitation layer 4 on blue-light LED chip 2, red LED chip 3 directly and lens 6 join.Light effect for improving, 3 chips are arranged in a linear, and the distance that red LED chip 3 and blue-light LED chip are 2 is 0.5 to 3 millimeter.
Claims (2)
1. warm light LED lamp encapsulation structure, comprise support (1) and establish thereon luminescence chip, reflector (5) and lens (6), it is characterized in that described luminescence chip is made of 3 LED chips that are connected in series, chip in the middle of it is red LED chip (3), the chip on both sides is blue-light LED chip (2), and described blue-light LED chip (2) is provided with yellow fluorescence excitation layer (4).
2. according to warm light LED lamp encapsulation structure claimed in claim 1, the LED chip that it is characterized in that described 3 series connection is the warm light unit of, should warm light 3 chips in the unit be arranged in a linear, red LED chip (3) and the distance between blue-light LED chip (2) of described warm light unit are 0.5 to 3 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012207093111U CN202977415U (en) | 2012-12-20 | 2012-12-20 | Warm light LED (Light Emitting Diode) lamp package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012207093111U CN202977415U (en) | 2012-12-20 | 2012-12-20 | Warm light LED (Light Emitting Diode) lamp package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202977415U true CN202977415U (en) | 2013-06-05 |
Family
ID=48518457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012207093111U Expired - Lifetime CN202977415U (en) | 2012-12-20 | 2012-12-20 | Warm light LED (Light Emitting Diode) lamp package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202977415U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529389A (en) * | 2015-08-25 | 2016-04-27 | 王子欣 | Full-spectrum light-emitting diode and application thereof |
-
2012
- 2012-12-20 CN CN2012207093111U patent/CN202977415U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529389A (en) * | 2015-08-25 | 2016-04-27 | 王子欣 | Full-spectrum light-emitting diode and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101769455A (en) | LED bulb adopting whole-body fluorescence conversion technology | |
| CN104295945A (en) | An omnidirectional light bulb and manufacture method thereof | |
| CN101740705A (en) | Warm white LED and preparation method thereof | |
| CN102661500B (en) | Light emitting diode (LED) light source component and LED lamp provided with same | |
| CN103867947A (en) | LED bulb lamp | |
| CN103557453B (en) | Remote fluorescent LED (Light Emitting Diode) device | |
| CN203757501U (en) | LED (Light Emitting Diode) lighting lamp | |
| CN207962121U (en) | The LED illuminator structure and LED lamp structure of gas conduction excitation | |
| CN201621499U (en) | LED bulb employing integral fluorescence conversion technology | |
| CN202977415U (en) | Warm light LED (Light Emitting Diode) lamp package structure | |
| CN102966866A (en) | Light-emitting diode (LED) bulb | |
| CN203176866U (en) | Novel remote fluorescent light-emitting diode (LED) bulb lamp | |
| CN202629621U (en) | Light-emitting diode (LED) lamp and lighting system | |
| CN202585533U (en) | Discrete LED (Light Emitting Diode) white light module | |
| CN202259432U (en) | Red LED lamp bead and indoor lamp adopting same | |
| CN108036243B (en) | LED ground lamp | |
| CN202140862U (en) | Lamp compounding OLED (organic light-emitting diode) and LED (light-emitting diode) | |
| CN204099985U (en) | A kind of dual-colored LED lamp pearl and lamp group | |
| CN201836692U (en) | High-lighting effect and high-coloration LED (light-emitting diode) module | |
| CN219606787U (en) | Luminous filament and luminous lamp | |
| CN204167319U (en) | NTSC colour gamut SMD lamp bead seal assembling structure and backlight module thereof | |
| CN202647395U (en) | High-voltage mixed light LED gas station lamp | |
| CN202487646U (en) | White light light-emitting diode (LED) with high color rendering | |
| CN102206908A (en) | Color-adjustable OLED (Organic Light Emitting Diode) lamp holder of lighting lamp for sewing machine | |
| CN202419257U (en) | Novel light-emitting diode (LED) white lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Warm light LED (Light Emitting Diode) lamp package structure Effective date of registration: 20180806 Granted publication date: 20130605 Pledgee: Changle Shandong rural commercial bank Limited by Share Ltd. Pledgor: SHANDONG KAIYUAN ELECTRONIC Co.,Ltd. Registration number: 2018980000099 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191029 Granted publication date: 20130605 Pledgee: Changle Shandong rural commercial bank Limited by Share Ltd. Pledgor: SHANDONG KAIYUAN ELECTRONIC Co.,Ltd. Registration number: 2018980000099 |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130605 |