CN202975256U

CN202975256U - Silicon slice prober

Info

Publication number: CN202975256U
Application number: CN 201220698632
Authority: CN
Inventors: 余廷义; 陈文建
Original assignee: SHENZHEN SI SEMICONDUCTORS CO Ltd
Current assignee: SHENZHEN SI SEMICONDUCTORS CO Ltd
Priority date: 2012-12-17
Filing date: 2012-12-17
Publication date: 2013-06-05
Anticipated expiration: 2022-12-17

Abstract

The utility model discloses a silicon slice prober comprising a transmission device, an elastic piece, a fixed portion, an optoelectronic switch and an isolation portion. The transmission device is connected with a silicon slice and transmits the position of the silicon slice. When silicon slice is pressed when being tested, the transmission device enables a movable end of the elastic piece to move so as to enable the isolation portion to move to change a signal output state of the optoelectronic switch, thereby whether the silicon slice is pressed in place or not is expressed. The isolation portion is utilized to change the signal transmission state of the optoelectronic switch, vibration of the elastic piece cannot influence signal output of the optoelectronic switch, and the isolation portion is free of contact with the optoelectronic switch, so that the problem that circuit signal output is influenced by that fact that poor contact and vibration are prone to generation since a conventional elastic piece switch needs to be contacted with a fixed contact point to enable a circuit to be conductive, and accuracy of signal output of the silicon slice prober is guaranteed.

Description

Visit the sheet device

Technical field

The utility model relates to the semiconductor test field, particularly relates to a kind of spy sheet device.

Background technology

Along with the development of electronic technology, the circuit design of electronic product becomes increasingly complex, often need to be with transistorized semiconductor being carried out the performance parameters test in circuit design.Semiconductor element can occur and not contact the phenomenon that puts in place and cause the normal use that mistake is surveyed affects semiconductor element when the semiconductors such as transistor are tested, cause waste.

The traditional elastic sheet switch of general use puts in place as detecting the semiconductor element contact, and the often movement by gearing of traditional elastic sheet switch is with shell fragment jack-up or depress and make circuit turn-on or disconnect and judge whether semiconductor element contacts and put in place.

Traditional elastic sheet switch return after the gearing effect can produce shake often; thereby can produce the undesired signal interfered circuit; thereby and can strike sparks during the contact of shell fragment and contact point and produce oxidative phenomena and cause the effect that contacts between shell fragment and contact point, contact the bad normal operation that affect circuit of understanding.

The utility model content

Based on this, affect the problem of normal operation circuit when being necessary for traditional shell fragment return after shake and generation oxidation, a kind of shell fragment shake and anti-oxidation spy sheet device avoided is provided.

A kind of spy sheet device, survey the position of silicon chip when being used for silicon chip is tested, the gearing that the stiff end that comprise shell fragment, connects described shell fragment is fixed on the fixed part on printed circuit board (PCB) with described shell fragment and transmits described position of silicon wafer and the movable end of described shell fragment is moved, also comprise optoelectronic switch and connect the movable end of described shell fragment and can move with the movable end of described shell fragment the transmitting terminal of the described optoelectronic switch of blocking-up and receiving end between the isolation part of signal transmission.

In embodiment, also comprise the banking pin that limits described shell fragment space therein, described banking pin is positioned at described isolation part with respect to the homonymy of described shell fragment.

In embodiment, described banking pin position is adjustable therein.

In embodiment, described gearing is the transmission flexible cord therein.

In embodiment, described shell fragment and described isolation part are one-body molded therein.

Therein in embodiment, described shell fragment and described isolation part welding or bonding by adhesive.

Therein in embodiment, described fixed part and described shell fragment or with described printed circuit board (PCB) welding or bonding by adhesive.

In embodiment, described isolation part is light tight isolation part therein.

Therein in embodiment, described isolation part is resistance photosensitiveness isolation part or light absorptive isolation part.

In embodiment, described isolation part is resistance photosensitiveness light aluminium sheet or light absorptive black aluminium sheet therein.

Above-mentioned spy sheet device comprises gearing, shell fragment, fixed part, optoelectronic switch and isolation part.Shell fragment one end is connected and fixed section's other end and connects the isolation part, fixed part is fixed on shell fragment on printed circuit board (PCB), the isolation part between optoelectronic switch transmitting terminal and receiving end, along with the mobile isolation part of shell fragment can blocking light electric switch transmitting terminal and receiving end between the transmission of signal.The position that gearing connects silicon chip and transmits silicon chip, when silicon chip was tested, silicon chip was pressed, and gearing moves the shell fragment movable end and makes the isolation part move the signal output state that changes optoelectronic switch, puts in place to show whether silicon chip is pressed.When extremely investigating if there is test in when test, whether contact in the time of can judging silicon test by this signal output state of visiting the optoelectronic switch of sheet device and put in place with further investigation.

By using the isolation part to change the transmission state signal of optoelectronic switch, the shake of shell fragment can not affect the signal output of optoelectronic switch, and the isolation part of visiting the sheet device does not contact with optoelectronic switch, avoid traditional elastic sheet switch to contact with fixed contact and made circuit turn-on easily produce loose contact and easily produce the drawback of effect of jitter circuit signal output, guaranteed to visit the accuracy of sheet device signal output.

Description of drawings

Fig. 1 is the structural representation that the utility model is visited sheet device one embodiment;

Fig. 2 is another status architecture schematic diagram embodiment illustrated in fig. 1.

Embodiment

A kind of spy sheet device judges whether silicon chip is pressed when pressing silicon chip and puts in place silicon chip is tested, and the output state of the signal by the judgement optoelectronic switch is surveyed the position of silicon chip.The isolation part does not contact with receiving end with the transmitting terminal of optoelectronic switch, avoided traditional elastic sheet switch need contact circuit to make circuit turn-on or disconnect the drawback that easily shake causes affecting circuit signal output, and thereby the isolation part do not contact with circuit that can not producing can strike sparks when traditional elastic sheet switch contacts with circuit and produces oxidation and cause contacting bad phenomenon, use visit the sheet device judge silicon chip whether press put in place more reliable.The utility model is visited the sheet device and also be can be used for the circuit that other transmission that can pass through photosignal in the partition circuit change circuit signal output.

Below in conjunction with drawings and Examples, the utility model is described in more detail.

Shown in Figure 1, a kind of spy sheet device puts in place for judging whether the silicon chip (not shown) that need to test presses, and comprises shell fragment 210, fixed part 220, isolation part 230, optoelectronic switch 240 and gearing 250.Fixed part 220 connects the stiff end of shell fragment 210, and shell fragment 210 is fixed on the printed circuit board (PCB) (not shown); Isolation part 230 connects the movable end of shell fragments 210, and isolation part 230 is located between the transmitting terminal 242 of optoelectronic switch 240 and receiving end 244 can be with transmitting terminal 242 and the transmission of the signal between receiving end 244 of the mobile blocking light electric switch 240 of the movable end of shell fragment 210; Gearing 250 connects silicon chip, and when silicon chip was pressed, the position of gearing 250 transmission silicon chips was moved the movable end of shell fragment 210, makes shell fragment 210 produce elastic deformation.

With reference to figure 2, for making shell fragment 210, gearing 250 produces elastically-deformable view.Under the effect of gearing 250 along with the movement of shell fragment 210 movable ends, the transmission of signal between the transmitting terminal 242 of the isolation part 230 blocking light electric switches 240 that are connected with shell fragment 210 movable ends and receiving end 244; When silicon test finishes, silicon chip return and when driving gearing 250 return, shell fragment 210 drives isolation part 230 return simultaneously, signal transmission recovery between the transmitting terminal 242 of optoelectronic switch 240 and receiving end 244.When silicon chip is tested, visit the sheet device position of silicon chip monitored, if when extremely need to investigate appears in test, can by this detector monitors whether because of silicon chip not transmission put in place and cause test abnormal.

Make shell fragment 210 directly to contact with circuit by isolation part 230 and the effect of optoelectronic switch 240 and can change the circuit signal output state, avoided needing the direct contact circuit of shell fragment could change the circuit signal output state in traditional spy sheet device, produce the phenomenons such as sparking, oxidation when the direct contact circuit of shell fragment can cause shell fragment and contact the contact contact, affect the contact of circuit; Traditional spy sheet device can produce shake when the shell fragment return, shake also can cause shell fragment to produce the phenomenons such as sparking, oxidation with contacting the contact, affects the stability of circuit signal output.The above-mentioned not connecting circuit of shell fragment 210 of should visiting in the sheet device even produce the signal output that shake also can not affect circuit when shell fragment 210 return, guarantees the Stability and veracity of circuit output signal.

Concrete, above-mentioned gearing 250 can be the transmission flexible cord, and the transmission flexible cord is arranged at silicon chip surface, when silicon chip is carried out pressing operation, the transmission flexible cord moves with the change of position of silicon wafer and the change of the position of silicon chip is sent to shell fragment 210, and makes shell fragment 210 produce elastic deformations.In other embodiment, above-mentioned gearing 250 also can be other and has the device that reaches effect same.

The general super thin metal that adopts of above-mentioned shell fragment 210 is made, and has elasticity, produces under external force recoverable elastic deformation, is the important component part of general switch.

Above-mentioned fixed part 220 generally is fixed in corresponding position on the printed circuit board (PCB) (not shown), fixed part 220 passes through welding or bonding by adhesive with printed circuit board (PCB), fixed part 220 passes through welding or bonding by adhesive with shell fragment 210, by adhesive and described printed circuit board (PCB) or shell fragment 210 is bonding can when needed fixed part 220 be removed or carry out the position and change, facilitate circuit design and can repeatedly use by a printed circuit board (PCB), saving cost.

Concrete, above-mentioned isolation part 230 and shell fragment 210 welding or bonding by adhesive.General, to receiving end 244, isolation part 230 is light tight material to optoelectronic switch 240 transmitting terminals 242, guarantees to intercept infrared signal, the transmission of blocking-up transmitting

terminal

242 and 244 signals of receiving end by the emission infrared light.The transmission of infrared signal can be blocked in isolation part 230 by the mode of reflects infrared light or absorption infrared light, concrete, isolation part 230 can be good bright aluminium sheet or the good black aluminium sheet of photo absorption performance of resistance optical property.

With reference to figure 2, moving upward under the silicon chip effect when transmission flexible cord 250 makes shell fragment 210 produce deformation upwards, and isolation part 230 stops transmitting terminal 242 and the receiving end 244 of optoelectronic switch 240.Isolation part 230 is during for the good bright aluminium sheet of resistance optical property, can with the infrared signal reflection of transmitting terminal 242 emissions of optoelectronic switch 240, cause the receiving end 244 of optoelectronic switch 240 can't receive signal, the signal Transmission; Isolation part 230 is when inhaling well behaved black aluminium sheet, the infrared signal that the transmitting terminal 242 of optoelectronic switch 240 is launched all can be absorbed to cause the receiving end 244 of optoelectronic switch 240 can't receive signal the signal Transmission.

Above-mentioned isolation part 230 also can be one-body molded with shell fragment 210, guarantee isolation part 230 and the steadiness that shell fragment 210 is connected, avoid because of between isolation part 230 and shell fragment 210 because being connected the signal output state that causes built on the sand changing optoelectronic switch 240, affecting the problem that spy sheet device works.

With reference to figure 2, above-mentioned gearing 250 can be the transmission flexible cord, the transmission flexible cord is fixed on silicon chip, by the circuit setting, move drive transmission flexible cord by the control silicon chip when needed and make shell fragment 210 produce elastic deformations, change the transmission state signal of optoelectronic switch 240.In other embodiment, gearing 250 also can be to have same function and can make shell fragment 210 produce corresponding elastically-deformable devices.

Further, with reference to figure 2, this spy sheet device also comprises banking pin 260, and banking pin 260 is positioned at isolation part 230 with respect to a side of shell fragment 210.

Shell fragment 210 is general to be adopted and has flexible metal material and makes, and the long-term use of shell fragment 210 may affect restorable ability after its deformation, and the 210 excessive deformation of generation also can affect the recovery capability of shell fragment 210 if gearing 250 makes shell fragment.When visiting the use of sheet device, if shell fragment 210 is restorative bad, make shell fragment 210 also thereupon after return at gearing 250 along with the silicon chip return, may produce the isolation part 230 still transmitting terminal 242 of blocking light electric switch 240 and the phenomenon of the transmission of the signal between receiving end 244.By banking pin 260 is set, after gearing 250 returns, even shell fragment 210 restorabilities are bad, shell fragment 210 also can drive isolation part 230 returns that are attached thereto under the effect of banking pin 260, makes optoelectronic switch 240 restoring signal transmission.

banking pin 260 can also limit the space of shell fragment 210, when shell fragment 210 produces deformation under the effect of gearing 250, banking pin 260 affect the deformation track of shell fragment 210 but do not affect the transmitting terminal 242 of isolation part 230 blocking light electric switches 240 and receiving end 244 between the transmission of signal, when gearing 250 returns, when shell fragment 210 is also followed return, by design and installation shell fragment 210, the position of isolation part 230 and optoelectronic switch 240, the transmitting terminal 242 of assurance isolation part 230 and optoelectronic switch 240 and receiving end 244 are in scope enough far away, the shake that shell fragment 210 produces generally can not cause isolation part 230 to affect the signal output state of optoelectronic switch 240, when even shell fragment 210 produces larger shake, effect by banking pin 260, the jitter range of restriction shell fragment 210 is not in isolation part 230 affects the signal output state scope of optoelectronic switch 240, guarantee that further optoelectronic switch 240 signal outputs are not subjected to the impact of shell fragment 210 shakes.

Above-mentioned banking pin 260 positions are adjustable, carry out the setting of diverse location according to the material difference of shell fragment 210, and the signal output state of assurance optoelectronic switch 240 is not subjected to the impact of shell fragment 210 shakes.

The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.Should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.

Claims

1. visit the sheet device for one kind, survey the position of silicon chip when being used for silicon chip is tested, the gearing that the stiff end that comprise shell fragment, connects described shell fragment is fixed on the fixed part on printed circuit board (PCB) with described shell fragment and transmits described position of silicon wafer and the movable end of described shell fragment is moved, it is characterized in that, also comprise optoelectronic switch and connect the movable end of described shell fragment and can move with the movable end of described shell fragment the isolation part of signal transmission between the blocking-up transmitting terminal of described optoelectronic switch and receiving end.

2. spy sheet device according to claim 1, is characterized in that, also comprises the banking pin that limits described shell fragment space, and described banking pin is positioned at described isolation part with respect to the homonymy of described shell fragment.

3. spy sheet device according to claim 2, is characterized in that, described banking pin position is adjustable.

4. spy sheet device according to claim 1, is characterized in that, described gearing is the transmission flexible cord.

5. spy sheet device according to claim 1, is characterized in that, described shell fragment and described isolation part are one-body molded.

6. spy sheet device according to claim 1, is characterized in that, described shell fragment and described isolation part welding or bonding by adhesive.

7. spy sheet device according to claim 1, is characterized in that, described fixed part and described shell fragment or with described printed circuit board (PCB) welding or bonding by adhesive.

8. spy sheet device according to claim 1, is characterized in that, described isolation part is light tight isolation part.

9. spy sheet device according to claim 8, is characterized in that, described isolation part is resistance photosensitiveness isolation part or light absorptive isolation part.

10. spy sheet device according to claim 9, is characterized in that, described isolation part is resistance photosensitiveness light aluminium sheet or light absorptive black aluminium sheet.