CN202957299U - LED packaging structure - Google Patents

LED packaging structure Download PDF

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Publication number
CN202957299U
CN202957299U CN 201220542321 CN201220542321U CN202957299U CN 202957299 U CN202957299 U CN 202957299U CN 201220542321 CN201220542321 CN 201220542321 CN 201220542321 U CN201220542321 U CN 201220542321U CN 202957299 U CN202957299 U CN 202957299U
Authority
CN
China
Prior art keywords
chip
heat radiation
base
radiation block
packaging structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220542321
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Chinese (zh)
Inventor
陶海霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TONGLING KEHAI PHOTOELECTRIC TECHNOLOGY Co Ltd
Original Assignee
TONGLING KEHAI PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TONGLING KEHAI PHOTOELECTRIC TECHNOLOGY Co Ltd filed Critical TONGLING KEHAI PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority to CN 201220542321 priority Critical patent/CN202957299U/en
Application granted granted Critical
Publication of CN202957299U publication Critical patent/CN202957299U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an LED packaging structure, comprising a base, wherein above the base there is fixedly provided a reflector, the top portion of the reflector is fixedly provided an euphotic layer with fluorescent powder, the center of the base is provided with a mounting groove, inside the mounting groove there is fixedly provided a heat radiation block, the heat radiation block is a trapezoid block, the height of the heat radiation block is higher than the base, above the heat radiation block is equipped with a chip, and the chip is electrically connected with pins together through wires. The LED packaging structure enables the chip to be mounted on the trapezoid heat radiation block, and the height of the trapezoid heat radiation block is higher than the base, such that the LED packaging structure enables the light emitting angle of the chip to be increased, the lighting area to be increased, the transmissivity to be good, and the light to be uniform.

Description

A kind of LED encapsulating structure
Technical field
The utility model relates to the LED technical field, relates in particular to a kind of LED encapsulating structure.
Background technology
At present, the lighting angle of existing lambert's type LED encapsulating structure all between 40 ° ~ 120 °, is only suitable for the product of optically focused such as flashlight, shot-light, Down lamp, flood light etc. in the application of light fixture on the market.But needing the occasion of uniform-illumination, the high power LED device of this class common angle just can't satisfy the needs that light fixture is produced, the most typical light fixture is exactly Panel light, Panel light is very high to the photochromic inhomogeneity requirement of LED, but existing LED encapsulating structure is difficult to satisfy people's requirement because lighting angle is little.There is the bad problem of light transmittance in the LED encapsulation of using at present in addition, causes with regard to there being poor product quality like this and can't one seat be arranged in LED with keen competition market.
The utility model content
The utility model purpose is exactly in order to make up the defective of prior art, to provide a kind of logical photosensitiveness good LED encapsulating structure.
The utility model is achieved through the following technical solutions:
A kind of LED encapsulating structure, include pedestal, the pedestal top is installed with reflection shield, the reflection shield top is fixed with the photic zone with fluorescent material, and the pedestal center has mounting groove, is fixed with radiating block in described mounting groove, described radiating block is trapezoid block, the height of radiating block is higher than pedestal, and the radiating block top is equipped with chip, chip by wire together with pin is electrically connected to.
Described photic zone with fluorescent material is for mixing the fluorescent material sheet glass.
The utility model has the advantages that: the utility model is by being arranged on chip on trapezoidal radiating block, and the height of trapezoidal radiating block makes the lighting angle of chip increase higher than substrate like this, and illuminated area is large, and logical photosensitiveness is good, and light is even.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
As shown in Figure 1, a kind of LED encapsulating structure, include pedestal 1, pedestal 1 top is installed with reflection shield 2, and reflection shield 2 tops are fixed with the photic zone 3 with fluorescent material, pedestal 1 center has mounting groove, be fixed with radiating block 4 in described mounting groove, described radiating block 4 is trapezoid block, and the height of radiating block is higher than pedestal 1, radiating block 4 tops are equipped with chip 5, together with chip 5 is electrically connected to by wire and pin 6.
Described photic zone 3 with fluorescent material is for mixing the fluorescent material sheet glass.

Claims (2)

1. LED encapsulating structure, it is characterized in that: include pedestal, the pedestal top is installed with reflection shield, the reflection shield top is fixed with the photic zone with fluorescent material, and the pedestal center has mounting groove, is fixed with radiating block in described mounting groove, described radiating block is trapezoid block, the height of radiating block is higher than pedestal, and the radiating block top is equipped with chip, chip by wire together with pin is electrically connected to.
2. a kind of LED encapsulating structure according to claim 1 is characterized in that: described photic zone with fluorescent material is for mixing the fluorescent material sheet glass.
CN 201220542321 2012-10-22 2012-10-22 LED packaging structure Expired - Fee Related CN202957299U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220542321 CN202957299U (en) 2012-10-22 2012-10-22 LED packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220542321 CN202957299U (en) 2012-10-22 2012-10-22 LED packaging structure

Publications (1)

Publication Number Publication Date
CN202957299U true CN202957299U (en) 2013-05-29

Family

ID=48462853

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220542321 Expired - Fee Related CN202957299U (en) 2012-10-22 2012-10-22 LED packaging structure

Country Status (1)

Country Link
CN (1) CN202957299U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105070809A (en) * 2015-07-21 2015-11-18 株式会社惠南电机 Light-emitting structure body
CN105633251A (en) * 2014-11-07 2016-06-01 江苏欧密格光电科技股份有限公司 Surface mounted LED lamp of good color rendering
CN109768147A (en) * 2018-12-29 2019-05-17 中山市木林森电子有限公司 LED packaging structure and manufacturing method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105633251A (en) * 2014-11-07 2016-06-01 江苏欧密格光电科技股份有限公司 Surface mounted LED lamp of good color rendering
CN105070809A (en) * 2015-07-21 2015-11-18 株式会社惠南电机 Light-emitting structure body
CN105070809B (en) * 2015-07-21 2018-06-26 株式会社惠南电机 Light emitting structure body
CN109768147A (en) * 2018-12-29 2019-05-17 中山市木林森电子有限公司 LED packaging structure and manufacturing method thereof
CN109768147B (en) * 2018-12-29 2021-06-08 中山市木林森电子有限公司 LED packaging structure and manufacturing method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130529

Termination date: 20131022