CN202902918U - Water-cooling heat-dissipating device for semiconductor power generation system using temperature differences - Google Patents
Water-cooling heat-dissipating device for semiconductor power generation system using temperature differences Download PDFInfo
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- CN202902918U CN202902918U CN 201220619267 CN201220619267U CN202902918U CN 202902918 U CN202902918 U CN 202902918U CN 201220619267 CN201220619267 CN 201220619267 CN 201220619267 U CN201220619267 U CN 201220619267U CN 202902918 U CN202902918 U CN 202902918U
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- shower nozzle
- annular trough
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Abstract
The utility model discloses a water-cooling heat-dissipating device for a semiconductor power generation system using temperature differences. In the prior art, the phenomenon that a constant and continuous power generation effect cannot be maintained exists. According to the water-cooling heat-dissipating device, the inside of an annular trough is hollow, the annular trough is assembled on the outer wall of a rotary barrel, and an annular opening is formed in the middle position of the surface of an outer ring of the annular trough. A spray head is arranged above the annular opening of the annular trough and extends into the annular opening. A water connection port of the spray head is connected with a water pump through a water pipe and a spiral heat dissipation water pipe. The water pump is inserted into a water tank through an arc-shaped guide pipe. The water tank is located under the annular trough, and the upper end of the water tank is open. When the rotary barrel rolls to drive the annular trough to roll, the annular trough and the spray head do not touch each other. An annular groove is formed in the middle part of the outer surface of an inner ring of the annular trough. The water-cooling heat-dissipating device for the semiconductor power generation system using the temperature differences is simple in structure, low in manufacturing cost, stable and reliable in operation, environmental friendly, free of pollution and convenient to maintain.
Description
Technical field
The utility model belongs to the cooling device in thermoelectric conversion field, is specifically related to a kind of water-cooling heat radiating device of semiconductor temperature difference power generating system.
Background technology
The semiconductor temperature differential generating technology is a kind of environmental protection generation technology that directly heat energy is converted into electric energy based on Seebeck effect (namely two kinds of semi-conductive abutting ends are placed high temperature, the other end that is in low temperature environment just can obtain electromotive force E).It can rationally utilize low grade heat energy, and such as geothermal energy, solar energy and industrial exhaust heat used heat etc. by thermoelectric material, is converted into electric energy with heat energy.Different from the main flow generation mode, it is without the discharging of discarded object, and noiseless is safe and reliable stable, is the recycling to heat energy.
The efficient of semiconductor temperature differential generating is relevant with the temperature difference and the radiating mode thereof on the performance of semiconductor thermoelectric module, semiconductor cold-hot two sides.Experiment shows: (1) power output increases with the temperature difference, and the temperature difference is larger, and this trend is obvious, and the temperature difference reaches peak power output also will reach maximum; (2) under identical hot-side temperature condition, the rising of cold junction temperature will cause reducing of power output, and in the situation that the temperature difference is identical, cold junction temperature is lower, and its power output is larger.At present, one of thermo-electric generation key issue that need to solve is exactly the heat dissipation problem of cold junction.Generally speaking, heat energy can rise cold junction temperature by the heat conduction, thereby cause the cold and hot two sides temperature difference to descend, affect generating efficiency, good radiating mode can make the temperature kept stable of module cold junction, therefore select suitable heat abstractor, reduce as much as possible cold junction temperature and just become one of main method that improves generating efficiency.
The thermo-electric generation product of more maturation has abroad been arranged at present, many relevant application studies have also been arranged.But the domestic research of carrying out aspect thermo-electric generation also is in the starting stage, also has larger gap with external, and in the research and comparison shortcoming of semiconductor thermo-electric generation apparatus comprehensive Design and application facet, therefore studying thermo-electric generation has very real meaning.
Along with the research and development of high performance semi-conductor thermoelectric material, the semiconductor temperature differential generating technology will be used widely at other field.How to design an effective heat abstractor, make the cold and hot two sides of semi-conductor thermoelectric material keep the higher and stable temperature difference, to reach the stable generating effect that continues, make the aspects such as system moves reliably and with long-term, be that semiconductor temperature differential generating transforms the technical barrier that needs to be resolved hurrily to practical application.What in the market high-temperature explosion-proof converter utilized that waste heat carries out thermo-electric generation also is not a lot, and difficulty is how to keep the temperature difference on the cold and hot two sides of thermo-electric generation sheet.Because under the industrial environment, the cold junction of semiconductor temperature difference sheet is very fast by hot side or heat heating that hot environment passed to, makes the temperature of cold junction rise the constant lasting generating effect that therefore can't keep.
The main radiating mode of cold junction has natural convection air, Forced Air Convection and water circulation to cool off three kinds at present.The natural convection air effect is too poor, only uses under the specific occasion; Forced Air Convection refers to take away the heat of module cold junction by air-flow in semiconductor module cold junction finned; Water-cooling heat radiating system refers to take away by cooling water tank the heat of thermo-electric conversion module cold junction, and hydrologic cycle cooling system generally is comprised of thermal energy converter, water circulation system, water tank and water pump.
Because the unit thermal capacitance of water is large than gas, so water-cooled has a better cooling effect than air-cooled, studies show that the water-cooled coefficient of heat transfer than the large 100-1000 of natural air cooled heat radiation doubly.And adopt water-cooling radiating structure can adapt to the working environment of converter complexity, simple in structure, assembling easily, production efficiency is high, be easy to safeguard, and the seal of converter is good, its outer surface can't impact to the converter internal-response liquid such as water, therefore adopts the scheme of water-cooling heat radiating device.
Summary of the invention
The utility model has proposed a kind of water-cooling heat radiating device of semiconductor temperature difference power generating system for the deficiencies in the prior art.
The water-cooling heat radiating device of the utility model semiconductor temperature difference power generating system comprises shower nozzle, annular water tank, spiral heat dissipation water pipe, water pump, water tank and curved catheter.The annular water tank boring, on the outer wall that is assemblied in rotary barrel, the outer ring surface intermediate open position of annular water tank has annular opening.Shower nozzle be arranged on annular water tank annular opening directly over, and stretch in the annular opening, the inner surface with annular opening and annular water tank does not contact.The water inlet of shower nozzle is connected with an end of spiral heat dissipation water pipe by water pipe, the other end of spiral heat dissipation water pipe is connected with water pump, water pump inserts water tank to water tank bottom by curved catheter, water tank be positioned at annular water tank under, the water tank upper end is open, and shower nozzle, spiral heat dissipation water pipe, water pump adopt rigid support to fix, and keeps relative position to fix, rotary barrel rolls when driving the annular water tank rolling, and annular water tank and shower nozzle do not touch mutually.The mid portion of the interior ring outer surface of annular water tank is provided with annular groove, so that form an area of space between the bucket wall of annular water tank and rotating cylinder, the height of annular groove is the height of fin and the stack of thermo-electric generation sheet.
The beneficial effects of the utility model: simple in structure, cost of manufacture is cheap, and stable and reliable operation is environment friendly and pollution-free, and is convenient to care and maintenance.
Description of drawings
Fig. 1 is system of the present utility model three-dimensional structure diagram;
Fig. 2 is axial vertical sectional view of the present utility model;
Fig. 3 is side sectional view of the present utility model;
Fig. 4 is the partial enlarged drawing of side sectional view of the present utility model;
Fig. 5 is the cutaway view of water tank of the present utility model.
The specific embodiment
Hereinafter, specifically describe with reference to the accompanying drawings the mode of the present utility model that realizes.
To shown in Figure 5, the water-cooling heat radiating device of the utility model semiconductor temperature difference power generating system comprises shower nozzle 1, annular water tank 2, spiral heat dissipation water pipe 3, water pump 4, water tank 5 and curved catheter 7 such as Fig. 1.Annular water tank 2 borings, on the outer wall that is assemblied in rotary barrel 6, the outer ring surface intermediate open position of annular water tank 2 has annular opening.Shower nozzle 1 be arranged on annular water tank 2 annular opening directly over, and stretch in the annular opening, do not contact with the inner surface of annular opening with annular water tank 2.The water inlet of shower nozzle 1 is connected with an end of spiral heat dissipation water pipe 3 by water pipe, the other end of spiral heat dissipation water pipe 3 is connected with water pump 4, water pump 4 inserts water tank 5 to water tank 5 bottoms by curved catheter 7, water tank 5 be positioned at annular water tank 2 under, water tank 5 upper ends are open, and shower nozzle 1, spiral heat dissipation water pipe 3, water pump 4 adopt rigid support to fix, and keep relative position to fix, rotary barrel 6 rolls when driving annular water tank 2 rolling, and annular water tank 2 and shower nozzle 1 do not touch mutually.The mid portion of the interior ring outer surface of annular water tank 2 is provided with annular groove 8, so that form an area of space between the bucket wall of annular water tank and rotating cylinder, the height of annular groove 8 is the height of fin and the stack of thermo-electric generation sheet.
The action of whole system: be transported in the spiral heat dissipation water pipe 3 by arc suction nozzle 7 by the water of water pump 4 with water tank 5 bottoms, through spiral heat dissipation water pipe 3 water is further sprayed by the inner surface of shower nozzle 1 to annular water tank 2 after the cooling, reduce the temperature of annular groove 8 internal difference in temperature generating sheet.Water after the sprinkling is owing to the two side direction bottom diffluence of Action of Gravity Field along annular water tank 2 inner surfaces, the water that flows into annular water tank 2 bottoms falls back in the water tank 5, carry out heat exchange with water in the water tank and carry out preliminary cooling, water is drawn back water to circulate again by water pump 4 again annular water tank 2 is sprayed, and constantly gives the huyashi-chuuka (cold chinese-style noodles) cooling of thermo-electric generation sheet.Use the spiral heat dissipation water pipe between water pump and shower nozzle, the spiral heat dissipation water pipe adopts helical structure, can effectively reduce the temperature of recirculated water.
Claims (1)
1. the water-cooling heat radiating device of semiconductor temperature difference power generating system, comprise shower nozzle, annular water tank, the spiral heat dissipation water pipe, water pump, water tank and curved catheter, it is characterized in that: the annular water tank boring, on the outer wall that is assemblied in rotary barrel, the outer ring surface intermediate open position of annular water tank has annular opening, shower nozzle be arranged on annular water tank annular opening directly over, and stretch in the annular opening, the inner surface with annular opening and annular water tank does not contact, the water inlet of shower nozzle is connected with an end of spiral heat dissipation water pipe by water pipe, the other end of spiral heat dissipation water pipe is connected with water pump, water pump inserts water tank to water tank bottom by curved catheter, water tank be positioned at annular water tank under, the water tank upper end is open, shower nozzle, the spiral heat dissipation water pipe, water pump adopts rigid support to fix, keep relative position to fix, rotary barrel rolls when driving the annular water tank rolling, annular water tank and shower nozzle do not touch mutually, the mid portion of the interior ring outer surface of annular water tank is provided with annular groove, so that form an area of space between the bucket wall of annular water tank and rotating cylinder, the height of annular groove is the height of fin and the stack of thermo-electric generation sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220619267 CN202902918U (en) | 2012-11-21 | 2012-11-21 | Water-cooling heat-dissipating device for semiconductor power generation system using temperature differences |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220619267 CN202902918U (en) | 2012-11-21 | 2012-11-21 | Water-cooling heat-dissipating device for semiconductor power generation system using temperature differences |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202902918U true CN202902918U (en) | 2013-04-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220619267 Withdrawn - After Issue CN202902918U (en) | 2012-11-21 | 2012-11-21 | Water-cooling heat-dissipating device for semiconductor power generation system using temperature differences |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202902918U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102944124A (en) * | 2012-11-21 | 2013-02-27 | 杭州电子科技大学 | Water-cooling heat-dissipating device of semiconductor temperature differential power generation system |
-
2012
- 2012-11-21 CN CN 201220619267 patent/CN202902918U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102944124A (en) * | 2012-11-21 | 2013-02-27 | 杭州电子科技大学 | Water-cooling heat-dissipating device of semiconductor temperature differential power generation system |
| CN102944124B (en) * | 2012-11-21 | 2015-05-13 | 杭州电子科技大学 | Water-cooling heat-dissipating device of semiconductor temperature differential power generation system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130424 Effective date of abandoning: 20150513 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20130424 Effective date of abandoning: 20150513 |
|
| RGAV | Abandon patent right to avoid regrant |