CN202818842U - Portable electronic device - Google Patents
Portable electronic device Download PDFInfo
- Publication number
- CN202818842U CN202818842U CN201220449022.2U CN201220449022U CN202818842U CN 202818842 U CN202818842 U CN 202818842U CN 201220449022 U CN201220449022 U CN 201220449022U CN 202818842 U CN202818842 U CN 202818842U
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- heat
- substrate
- plate
- conducting medium
- printed circuit
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Abstract
The utility model provides a portable electronic device, comprising a stacked first plate base material and a second plate base material. A device is disposed on a first area of a first surface of the first plate base material. A cooling device is coated on a first surface of the second plate base material. The device and the cooling device are connected through a heat-conducting medium. Heat generated when the device is operating is conducted to the cooling device through the heat-conducting medium to dissipate heat.
Description
The application requirement applying date is on 09 01st, 2012, and application number is 201220444017.2, and name is called the priority in first to file of " mancarried electronic aid ", should all embody in this application at the full content of first to file.
Technical field
The utility model belongs to technical field of electronic equipment, relates in particular to a kind of portable electric appts.
Background technology
Present various electronic equipment fast development, small and exquisite property and the portability of electronic equipment also become a kind of widely demand.But the heat dispersion of electronic equipment also is simultaneously a problem that needs consideration.How can allow the electronic equipment more small and exquisite good thermal diffusivity of electronic equipment that can keep again that becomes, be the problem that industry is being inquired into always.
Summary of the invention
In view of this, a purpose of the present utility model provides a kind of electronic equipment, and is not only small and exquisite but also can guarantee good thermal diffusivity.For there is a basic understanding some aspects to the embodiment that discloses, the below has provided simple summary.This summary part is not to comment general, neither determine the key/critical component or describe the protection range of these embodiment.Its sole purpose is to present some concepts with simple form, with this preamble as following detailed description.
In some optional embodiments, described electronic equipment comprises the first plate-like substrate and the second plate-like substrate that stacks; First area at the first surface of described the first plate-like substrate is equipped with a device, is covered with heat abstractor at the first surface of described the second plate-like substrate, described device be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.
For above-mentioned and relevant purpose, one or more embodiment comprise the feature that the back will describe in detail and particularly point out in the claims.Below explanation and accompanying drawing describe some illustrative aspects in detail, and its indication only is some modes in the utilizable variety of way of principle of each embodiment.Other benefit and novel features will consider by reference to the accompanying drawings and become obviously along with following detailed description, and the disclosed embodiments are to comprise being equal to of all these aspects and they.
Figure of description
Fig. 1 is an optional structural representation of electronic equipment;
Fig. 2 a, Fig. 2 b, Fig. 3 a, Fig. 3 b are respectively the schematic diagrames of the optional structure of each base material different surfaces;
Fig. 4 is the schematic diagram of the optional structure of each base material first surface;
Fig. 5 is the schematic diagram that each base material stacks.
Embodiment
The following description and drawings illustrate specific embodiments of the present utility model fully, to enable those skilled in the art to put into practice them.Embodiment only represents possible variation.Unless explicitly call for, otherwise independent assembly and function are optional, and the order of operation can change.The part of some embodiments and feature can be included in or replace part and the feature of other embodiments.The scope of embodiment of the present utility model comprises the gamut of claims, and all obtainable equivalents of claims.
In some optional embodiments, described electronic equipment as shown in Figure 1, described electronic equipment comprises the first plate-like substrate S1 and the second plate-like substrate S2, the first plate-like substrate S1 and the second plate-like substrate S2 stack.
Fig. 2 a and Fig. 2 b illustrate respectively the optional structure on two surfaces of the first plate-like substrate S1; Fig. 3 a and Fig. 3 b illustrate respectively the optional structure on two surfaces of the second plate-like substrate S2.
Here, two boards shape base material surfaces opposite to each other are called separately first surface.In some optional embodiment, when the first plate-like substrate S1 and the second plate-like substrate S2 stacked, two surfaces respect to one another were respectively the surfaces shown in the surface shown in Fig. 2 b and Fig. 3 b.In this case, the surface shown in Fig. 2 b is the first surface of the first plate-like substrate S1, and the surface shown in Fig. 3 b is the first surface of the second plate-like substrate S2.
In some optional embodiments, the first plate-like substrate S1 and the second plate-like substrate S2 surface separately all are provided with circuit structure.A device 03 that needs heat radiation is installed in the first area of the first surface of the first plate-like substrate S1, first surface (the namely surface relative with the first surface of the first plate-like substrate) at the second plate-like substrate S2 is covered with metal forming 04, as shown in Figure 4.When the first plate-like substrate S1 and the second plate-like substrate S2 stacked, device 03 and metal forming 04 were between two boards shape base material, and is connected with metal forming and connects by heat-conducting medium in the surface of device 03, as shown in Figure 5.The heat that produces during device 03 work is transmitted to metal forming 04 from the surface of device 03 by heat-conducting medium and dispels the heat.
The described electronic equipment of above-mentioned optional embodiment can carry out a large-scale base material miniaturization processing by stacking a plurality of small substrates, has greatly reduced the area of product, so that product is smaller and more exquisite, portable.In addition, another obvious difference of these optional embodiment and prior art is to help the device on another piece base material to dispel the heat with the metal forming on the base material, and do not have additionally to increase any independent radiating element, thereby can also guarantee that product has good thermal diffusivity in portable realizing that product form is small and exquisite.
In certain embodiments, adopt metal forming as heat abstractor, also can adopt in further embodiments the heat abstractor of other form, for example, a kind of optional scheme is to adopt sheet metal as heat abstractor.Metal forming/the sheet metal that can be used as heat abstractor includes but not limited to Copper Foil/copper sheet, aluminium foil/aluminium flake etc.Along with the development of heat sink material, other material with excellent radiating effect also can be used as heat abstractor and overlays on the base material.
Although above-mentioned optional embodiment is illustrated with two blocks of base materials, those skilled in the art can arrive more base material with the scheme extension of this optional embodiment fully.Stack 3,4 and more base material, also can dispel the heat to the device on the base material with the disclosed thought of above-mentioned optional embodiment fully.
In the practical application, a kind of optional execution mode is, the polylith printed circuit board (PCB) is stacked, and realizes the heat radiation to device.For example, as first plate-like substrate S1 and the second plate-like substrate S2 when with the form of printed circuit board (PCB) occurring of Fig. 1 in Fig. 5, the first printed circuit board (PCB) S1 and the second printed circuit S2 stack, and two printed circuit board surfaces opposite to each other are respectively first surfaces separately.On two printed circuit board, two surfaces respect to one another, be fixed with a device 03 on the first surface of the first printed circuit board (PCB) S1, as shown in Figure 4.Device 03 can be CPU, DSP, flush bonding processor, also can be other high speed device, for example random access memory ram.Relative with the first surface of the first printed circuit board (PCB) S1 is the first surface of the second printed circuit board (PCB) S2.On the first surface of the second printed circuit board (PCB) S2, be covered with large tracts of land Copper Foil 04, as shown in Figure 4.The large tracts of land Copper Foil 04 of S2 is between two printed circuit board that stack, by heat-conducting medium or importing silica gel interface unit 03 and the large tracts of land Copper Foil 04 of paste on device 03 on the first printed circuit board (PCB) S1 and the second printed circuit board (PCB).Wherein, the circuit on large tracts of land Copper Foil 04 and the printed circuit board (PCB) " " end is connected.Heat-conducting medium or the heat conductive silica gel of the heat that produces during device 03 work by paste is transmitted on the large tracts of land Copper Foil 04 and dispels the heat.
The described electronic equipment of above-mentioned optional embodiment can carry out a large-sized print circuit board miniaturization processing by stacking a plurality of miniature printed circuit boards, thereby greatly reduce the area of product, so that product is smaller and more exquisite, portable.In addition, another obvious difference of these optional embodiment and prior art is to help the device on another printed circuit board to dispel the heat with the Copper Foil on the printed circuit board, except printed circuit board (PCB), do not have additionally to increase any independent radiating element, thereby can also guarantee that product has good thermal diffusivity in portable realizing that product form is small and exquisite.
In some optional embodiments, the first plate-like substrate S1 is with second plate-like substrate S2 is parallel stacks; In other optional embodiments, the first plate-like substrate and the second plate-like substrate also may adopt non-parallel mode to stack.In some optional embodiments, the zone at sheet metal 04 place is corresponding to the first area at device 03 place; In other optional embodiments, the zone at sheet metal 04 place may not be corresponding to the first area.In some optional embodiments, the area of sheet metal 04 is greater than the first area; In other optional embodiments, the area of sheet metal may equal the first area, perhaps less than the first area.In some optional embodiments, adopt heat-conducting medium interface unit 03 and the sheet metal 04 of paste, for example the silicone grease of paste; In other optional embodiments, adopt heat-conducting medium interface unit 03 and the sheet metal 04 of glue or emulsus, include but not limited to gluey silica gel or the silicone grease of emulsus.
Disclosed electronic equipment among some optional embodiment comprises the first plate-like substrate and the second plate-like substrate that stack; First area at the first surface of described the first plate-like substrate is equipped with a device, is covered with heat abstractor at the first surface of described the second plate-like substrate, described device be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.In some optional embodiments, the first surface of described the second plate-like substrate is parallel relative with the first surface of described the first plate-like substrate.In some optional embodiments, described heat abstractor overlays on the zone corresponding to described first area.In some optional embodiments, described device is central processor CPU, or digital signal processor DSP, or flush bonding processor, or random access memory ram.In some optional embodiments, described heat abstractor is metal forming or sheet metal.In some optional embodiments, described metal is copper, or aluminium, or iron.In some optional embodiments, described heat-conducting medium is the heat-conducting medium of paste, the heat-conducting medium of glue or the heat-conducting medium of emulsus.In some optional embodiments, described heat-conducting medium is silicone grease or silica gel.In some optional embodiments, described plate-like substrate is printed circuit board (PCB).In some optional embodiments, the circuit on described heat abstractor and described the second printed circuit board (PCB) " " end is connected.In some optional embodiments, the surface of described device be connected heat abstractor and connect by heat-conducting medium.In some optional embodiments, described electronic equipment also comprises a shell, stacks described the first plate-like substrate and the second plate-like substrate in the inside of described shell.
In some optional embodiments, described electronic equipment comprises the first plate-like substrate and the second plate-like substrate; First area at the first surface of described the first plate-like substrate is equipped with a device, the surface relative at the first surface with described the first plate-like substrate of described the second plate-like substrate is provided with heat abstractor, described device be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises the first plate-like substrate and the second plate-like substrate; First area at the first surface of described the first plate-like substrate is equipped with a device, be provided with heat abstractor on the parallel relative surface of the first surface with described the first plate-like substrate of described the second plate-like substrate, described device be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises the first plate-like substrate and the second plate-like substrate; First area at the first surface of described the first plate-like substrate is equipped with a device, be provided with heat abstractor on the non-parallel relative surface of the first surface with described the first plate-like substrate of described the second plate-like substrate, described device be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises the first plate-like substrate and the second plate-like substrate; First area at the first surface of described the first plate-like substrate is equipped with a device, region division corresponding to described first area on the relative surface of the first surface with described the first plate-like substrate of described the second plate-like substrate has heat abstractor, described device be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises the first plate-like substrate and the second plate-like substrate; First area at the first surface of described the first plate-like substrate is equipped with a device, non-region division corresponding to described first area has heat abstractor on the relative surface of the first surface with described the first plate-like substrate of described the second plate-like substrate, described device be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises the first plate-like substrate and the second plate-like substrate; First area at the first surface of described the first plate-like substrate is equipped with a CPU/DSP/ flush bonding processor, the surface relative at the first surface with described the first plate-like substrate of described the second plate-like substrate is provided with heat abstractor, described CPU/DSP/ flush bonding processor be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described CPU/DSP/ flush bonding processor work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises the first plate-like substrate and the second plate-like substrate; First area at the first surface of described the first plate-like substrate is equipped with a device, the surface relative at the first surface with described the first plate-like substrate of described the second plate-like substrate is provided with sheet metal/metal forming, described device be connected sheet metal/metal forming and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described sheet metal/metal forming by described heat-conducting medium and dispels the heat.
Wherein, the metal that has an excellent radiating effect all is applicable to include but not limited to copper, iron or aluminium etc. in each embodiment.
In some optional embodiments, described electronic equipment comprises the first plate-like substrate and the second plate-like substrate; First area at the first surface of described the first plate-like substrate is equipped with a device, the surface relative at the first surface with described the first plate-like substrate of described the second plate-like substrate is provided with heat abstractor, described device be connected heat abstractor and connect by the paste heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by the paste heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises the first printed circuit board (PCB) and the second printed circuit board (PCB); First area at the first surface of described the first printed circuit board (PCB) is equipped with a device, the surface relative at the first surface with described the first printed circuit board (PCB) of described the second printed circuit board (PCB) is provided with heat abstractor, described device be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises the first plate-like substrate and the second plate-like substrate; First area at the first surface of described the first plate-like substrate is equipped with a device, the surface relative at the first surface with described the first plate-like substrate of described the second plate-like substrate is provided with heat abstractor, described device be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises a shell, in described enclosure the first printed circuit board (PCB) and the second printed circuit board (PCB) is arranged; First area at the first surface of described the first printed circuit board (PCB) is fixed with a processor, the surface relative at the first surface with described the first printed circuit board (PCB) of described the second printed circuit board (PCB) is provided with Copper Foil, the circuit on Copper Foil and the printed circuit board (PCB) " " end is connected.The surface of described processor be connected Copper Foil and connect by heat-conducting medium; The heat that produces during described processor work is transmitted to described Copper Foil by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises a shell, in described enclosure the first printed circuit board (PCB) and the second printed circuit board (PCB) is arranged; First area at the first surface of described the first printed circuit board (PCB) is fixed with a processor, be provided with Copper Foil on the parallel relative surface of the first surface with described the first printed circuit board (PCB) of described the second printed circuit board (PCB), described processor be connected Copper Foil and connect by heat-conducting medium; The heat that produces during described processor work is transmitted to described Copper Foil by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises a shell, in described enclosure the first printed circuit board (PCB) and the second printed circuit board (PCB) is arranged; First area at the first surface of described the first printed circuit board (PCB) is fixed with a processor, be provided with Copper Foil on the non-parallel relative surface of the first surface with described the first printed circuit board (PCB) of described the second printed circuit board (PCB), described processor be connected Copper Foil and connect by heat-conducting medium; The heat that produces during described processor work is transmitted to described Copper Foil by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises a shell, in described enclosure the first printed circuit board (PCB) and the second printed circuit board (PCB) is arranged; First area at the first surface of described the first printed circuit board (PCB) is fixed with a processor, region division corresponding to described first area on the relative surface of the first surface with described the first printed circuit board (PCB) of described the second printed circuit board (PCB) has Copper Foil, described processor be connected Copper Foil and connect by heat-conducting medium; The heat that produces during described processor work is transmitted to described Copper Foil by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises a shell, in described enclosure the first printed circuit board (PCB) and the second printed circuit board (PCB) is arranged; First area at the first surface of described the first printed circuit board (PCB) is fixed with a processor, non-region division corresponding to described first area has Copper Foil on the relative surface of the first surface with described the first printed circuit board (PCB) of described the second printed circuit board (PCB), described processor be connected Copper Foil and connect by heat-conducting medium; The heat that produces during described processor work is transmitted to described Copper Foil by described heat-conducting medium and dispels the heat.
In some optional embodiments, described electronic equipment comprises a shell, in described enclosure the first printed circuit board (PCB) and the second printed circuit board (PCB) is arranged; First area at the first surface of described the first printed circuit board (PCB) is fixed with a processor, the surface relative at the first surface with described the first printed circuit board (PCB) of described the second printed circuit board (PCB) is provided with copper sheet, described processor be connected copper sheet and connect by the paste heat-conducting medium; The heat that produces during described processor work is transmitted to described copper sheet by the paste heat-conducting medium and dispels the heat.
In above-mentioned detailed description, various features are combined in the single embodiment together, to simplify the disclosure.This open method should be interpreted as reflecting such intention, that is, and the more feature of feature that the embodiment of theme required for protection need to clearly be stated in each claim.On the contrary, as appending claims reflected, the utility model was in the state that lacks than whole features of disclosed single embodiment.Therefore, appending claims clearly is merged in the detailed description hereby, and wherein every claim is alone as the independent preferred embodiment of the utility model.Certainly, all possible combination of describing parts in order to describe above-described embodiment is impossible, but those of ordinary skills should be realized that each embodiment can do further combinations and permutations.Therefore, the embodiment that describes herein is intended to contain all the such changes, modifications and variations in the protection range that falls into appended claims.In addition, using any one term "or" in claims and specification is to represent " non-exclusionism or ".
Claims (12)
1. an electronic equipment is characterized in that, comprises the first plate-like substrate and the second plate-like substrate that stack; First area at the first surface of described the first plate-like substrate is equipped with a device, is covered with heat abstractor at the first surface of described the second plate-like substrate, described device be connected heat abstractor and connect by heat-conducting medium; The heat that produces during described device work is transmitted to described heat abstractor by described heat-conducting medium and dispels the heat.
2. electronic equipment as claimed in claim 1 is characterized in that, the first surface of described the second plate-like substrate is parallel relative with the first surface of described the first plate-like substrate.
3. electronic equipment as claimed in claim 1 is characterized in that, described heat abstractor overlays on the zone corresponding to described first area.
4. such as claim 1,2 or 3 described electronic equipments, it is characterized in that described device is central processor CPU, or digital signal processor DSP, or flush bonding processor, or random access memory ram.
5. such as claim 1 or 2 or 3 described electronic equipments, it is characterized in that described heat abstractor is metal forming or sheet metal.
6. electronic equipment as claimed in claim 5 is characterized in that, described metal is copper, or aluminium, or iron.
7. such as claim 1,2 or 3 described electronic equipments, it is characterized in that described heat-conducting medium is the heat-conducting medium of paste, the heat-conducting medium of glue or the heat-conducting medium of emulsus.
8. such as claim 1,2 or 3 described electronic equipments, it is characterized in that described heat-conducting medium is silicone grease or silica gel.
9. such as claim 1,2 or 3 described electronic equipments, it is characterized in that described plate-like substrate is printed circuit board (PCB).
10. electronic equipment as claimed in claim 9 is characterized in that, the circuit on described heat abstractor and described the second printed circuit board (PCB) " " end is connected.
11. such as claim 1,2 or 3 described electronic equipments, it is characterized in that, the surface of described device be connected heat abstractor and connect by heat-conducting medium.
12. such as claim 1,2 or 3 described electronic equipments, it is characterized in that, also comprise a shell, stack described the first plate-like substrate and the second plate-like substrate in the inside of described shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220449022.2U CN202818842U (en) | 2012-09-01 | 2012-09-05 | Portable electronic device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220444017.2 | 2012-09-01 | ||
| CN201220444017 | 2012-09-01 | ||
| CN201220449022.2U CN202818842U (en) | 2012-09-01 | 2012-09-05 | Portable electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202818842U true CN202818842U (en) | 2013-03-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220449022.2U Expired - Lifetime CN202818842U (en) | 2012-09-01 | 2012-09-05 | Portable electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202818842U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103914116A (en) * | 2014-03-10 | 2014-07-09 | 联想(北京)有限公司 | Electronic device |
-
2012
- 2012-09-05 CN CN201220449022.2U patent/CN202818842U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103914116A (en) * | 2014-03-10 | 2014-07-09 | 联想(北京)有限公司 | Electronic device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: 510000 room 1601-1611, room 1701-1711, No. 25, Huizhi Third Road, Nancun Town, Panyu District, Guangzhou City, Guangdong Province Patentee after: Guangdong new shoreline Technology Co.,Ltd. Address before: 100084, 16 floor, building A, building 8, Tsinghua Science Park, No. 1, Zhongguancun East Road, Haidian District, Beijing Patentee before: GUANGDONG NUFRONT COMPUTER SYSTEM CHIP Co.,Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130320 |