CN202817012U - A LED packaging structure using a fluorescent lens - Google Patents
A LED packaging structure using a fluorescent lens Download PDFInfo
- Publication number
- CN202817012U CN202817012U CN201220184536XU CN201220184536U CN202817012U CN 202817012 U CN202817012 U CN 202817012U CN 201220184536X U CN201220184536X U CN 201220184536XU CN 201220184536 U CN201220184536 U CN 201220184536U CN 202817012 U CN202817012 U CN 202817012U
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- China
- Prior art keywords
- lens
- led
- fluorescent
- chip
- support
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model discloses a LED packaging structure using a fluorescent lens. The LED packaging structure using a fluorescent lens comprises a heat sink support, a lens, and a LED chip disposed on the support. Electrodes are disposed on the support and the chip is electrically connected with the electrodes through bonding wires. The chip is directly connected with the lens. Fluorescent powder particles are dispersedly disposed in the lens and the lens is a fluorescent lens. The LED packaging structure using a fluorescent lens is used for packaging a white-light LED. Distributed in the lens, the fluorescent powder achieves large blue light stimulating journey and large area of stimulated luminescence so that luminous efficiency of the LED is effectively increased. In addition, large heat radiating area and low temperature rise of the fluorescent powder increases luminous efficiency, reduces light attenuation, and prolongs service lives of the LED. Further, the little error of the fluorescent powder amount is beneficial to controlling consistency of color temperature and the LED packaging structure using a fluorescent lens has a simple packaging technology.
Description
Technical field
The utility model belongs to LED encapsulation technology field, specifically relates to the integrated LED encapsulating structure of a kind of fluorescent lens.
Background technology
Use blue-light LED chip to add phosphor material powder, can obtain the white light of different-colour or the light of different colours.The spot printing of fluorescent material is one of core technology of LED encapsulation, and the consistency that it is related to light efficiency, colour temperature, color rendering index and the product of LED reaches the shelves rate.Common LED encapsulation generally is to coat the silica gel (or epoxy resin) that is mixed with fluorescent material at the good led chip point of bonding first, covers lens after the curing again, and injecting glue or with material seals such as silica gel.Its fluorescent material is intensive to be arranged on chip nearby, exists heat and concentrates, and junction temperature of chip is high, and light efficiency is low, the shortcomings such as colour temperature drift.The problem of bringing for solving nearly territory fluorescence, recently, remote fluorescence powder technology begins to rise.Main way is: first spot printing does not add the silica gel (or epoxy resin) of fluorescent material on the good chip of bonding, after the curing again spot printing be mixed with the silica gel (or epoxy resin) of fluorescent material, seal again at last.Though this method can improve luminous efficiency, the consistency of colour temperature is difficult to reach requirement.Because the extinction of fluorescent material generates heat, and the heat transfer path of this encapsulating structure is not smooth, the working temperature of fluorescent material is higher, has reduced conversion efficiency, has increased light decay, sometimes also can cause silica gel flavescence blackening in addition.What also have is coated with fluorescent material or mixes fluorescent material during in the lampshade injection moulding at lampshade, and this method can obtain higher luminous efficiency, reduces the temperature of fluorescent material.But technology difficulty is large, and the fluorescent material consumption is large, and manufacturing cost is high.
Summary of the invention
It is high that the technical problems to be solved in the utility model provides a kind of light efficiency, colour temperature high conformity, the LED encapsulating structure of being convenient to make.
For solving the problems of the technologies described above, the utility model comprises heat sink support, lens and is located at led chip on the support, and support is provided with electrode, and chip is electrically connected with electrode by bonding line, its design feature is that described chip and lens directly join, and lens are the silica gel fluorescent powder lens.
Preferably described lens are provided with the with it printing opacity housing of close proximity outward, and described printing opacity housing is connected with support.
The content of more preferably described fluorescent material in lens increases progressively as the bottom surface from the bottom up gradually take plane, chip place.
After adopting said structure, because fluorescent material is distributed in the lens, chip directly contacts with lens, and the stroke of blue-light excited fluorescent material is large, has increased the area of fluorescent material stimulated luminescence, but the luminous efficiency of Effective Raise LED.While fluorescent material scattering device in lens, area of dissipation is large, and the temperature rise of fluorescent material is low, can improve luminous efficiency, reduces light decay, prolongs the life-span of LED.And the lens volume of this encapsulating structure is large, and fluorescent material consumption error is little, is conducive to control the consistency of its colour temperature; The mould envelope of lens has fixing shape and volume, can simplify packaging technology, saves fluorescent material point automatic doubler surface glouer.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further described:
Fig. 1 is the utility model structural representation;
Fig. 2 is the cutaway view that the utility model lens are provided with shell structure outward;
Fig. 3 is the utility model integrated encapsulation structure schematic diagram;
Fig. 4 is the utility model fluorescent material distribution schematic diagram in lens.
Embodiment
With reference to accompanying drawing, this fluorescent lens LED encapsulating structure comprises heat sink support 1, and support 1 is provided with electrode 5, and the blue-light LED chip 2 that is fixed on the support 1 is electrically connected with electrode 5 by bonding line 3.Chip 2 directly joins with lens 4, and lens 4 are silica-gel lens, and lens 4 interior dispersions are provided with YAG fluorescent material 7 particles, and fluorescent material and lens 4 are wholely set, and make lens integral body become the silica gel fluorescent powder lens.By Fig. 2 and embodiment shown in Figure 3, the outer with it printing opacity housings 6 of close proximity that are provided with of lens 4, housing 6 be circle or square, and printing opacity housing 6 is connected with support 1, and lens 4 can housing 6 directly be cured shaping for mould.In embodiment illustrated in fig. 4, its fluorescent material 7 is in lens 4 interior non-even distributions, and its content is the distribution that increases progressively gradually from the bottom up as the bottom surface take plane, chip 2 place.
The making of the utility model fluorescent lens: in proportion silica gel and fluorescent material are mixed, in the vacuum defoamation mixer, stir and deaeration, deaeration glue is injected the die cavity of support to be sealed, insert in the baking oven after having annotated, be heating and curing by condition of cure.Support and guarantees that support level places up during curing.For regulating the distribution of fluorescent material in the lens, can adopt low sedimentation technique or centrifugal pre-sedimentation technique.
Claims (2)
1. fluorescent lens LED encapsulating structure, comprise heat sink support (1), lens (4) and be located at led chip (2) on the support (1), support (1) is provided with electrode (5), chip (2) is electrically connected with electrode (5) by bonding line (3), it is characterized in that described chip (2) and lens (4) directly join, lens (4) are the silica gel fluorescent powder lens.
2. according to fluorescent lens LED encapsulating structure claimed in claim 1, it is characterized in that being provided with the with it printing opacity housing (6) of close proximity outside the described lens (4), described printing opacity housing (6) is connected with support (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220184536XU CN202817012U (en) | 2012-04-27 | 2012-04-27 | A LED packaging structure using a fluorescent lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220184536XU CN202817012U (en) | 2012-04-27 | 2012-04-27 | A LED packaging structure using a fluorescent lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202817012U true CN202817012U (en) | 2013-03-20 |
Family
ID=47875841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220184536XU Expired - Lifetime CN202817012U (en) | 2012-04-27 | 2012-04-27 | A LED packaging structure using a fluorescent lens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202817012U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363357A (en) * | 2013-07-17 | 2013-10-23 | 晶科电子（广州）有限公司 | LED light source with well heat dissipation effect |
| CN104916760A (en) * | 2015-05-08 | 2015-09-16 | 李峰 | Die cavity type adhesive film making method and adhesive film made by same |
| WO2018176890A1 (en) * | 2017-03-31 | 2018-10-04 | 华南理工大学 | Quantum dot led backlight device, and manufacturing method thereof |
-
2012
- 2012-04-27 CN CN201220184536XU patent/CN202817012U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363357A (en) * | 2013-07-17 | 2013-10-23 | 晶科电子（广州）有限公司 | LED light source with well heat dissipation effect |
| CN104916760A (en) * | 2015-05-08 | 2015-09-16 | 李峰 | Die cavity type adhesive film making method and adhesive film made by same |
| WO2016179723A1 (en) * | 2015-05-08 | 2016-11-17 | 李峰 | Adhesive film mould cavity manufacturing method and adhesive bill manufactured thereby |
| JP2017526549A (en) * | 2015-05-08 | 2017-09-14 | 李峰 | Mold cavity type manufacturing method of adhesive film and the manufactured adhesive film |
| WO2018176890A1 (en) * | 2017-03-31 | 2018-10-04 | 华南理工大学 | Quantum dot led backlight device, and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A LED packaging structure using a fluorescent lens Effective date of registration: 20160630 Granted publication date: 20130320 Pledgee: Changle Shandong rural commercial bank Limited by Share Ltd Pledgor: Shandong Kaiyuan Electronics Co., Ltd. Registration number: 2016980000089 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170620 Granted publication date: 20130320 Pledgee: Changle Shandong rural commercial bank Limited by Share Ltd Pledgor: Shandong Kaiyuan Electronics Co., Ltd. Registration number: 2016980000089 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A LED packaging structure using a fluorescent lens Effective date of registration: 20170717 Granted publication date: 20130320 Pledgee: Changle Shandong rural commercial bank Limited by Share Ltd Pledgor: Shandong Kaiyuan Electronics Co., Ltd. Registration number: 2017980000306 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20180801 Granted publication date: 20130320 Pledgee: Changle Shandong rural commercial bank Limited by Share Ltd Pledgor: Shandong Kaiyuan Electronics Co., Ltd. Registration number: 2017980000306 |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130320 |