CN202813872U - Indirect-cool type semiconductor refrigeration device - Google Patents
Indirect-cool type semiconductor refrigeration device Download PDFInfo
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- CN202813872U CN202813872U CN 201220400078 CN201220400078U CN202813872U CN 202813872 U CN202813872 U CN 202813872U CN 201220400078 CN201220400078 CN 201220400078 CN 201220400078 U CN201220400078 U CN 201220400078U CN 202813872 U CN202813872 U CN 202813872U
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Abstract
The utility model discloses an indirect-cool type semiconductor refrigeration device which comprises a cooling cylinder, a semiconductor chilling plate, a radiating unit and a cooling conduction unit. The cooling conduction unit comprises a cooling conduction heat pipe provided with an evaporation working medium inside, a plurality of cooling conduction pieces, and a refrigerating medium cylinder provided with refrigerating media inside. The cooling conduction pieces are mounted on the outer surface of the cooling conduction heat pipe, and the cooling conduction heat pipe provided with the cooling conduction pieces is arranged in the refrigerating medium cylinder which is arranged in the cooling cylinder. The refrigerating medium cylinder is made of materials which accord with food hygiene and safety requirements. According to the indirect-cool type semiconductor refrigeration device, an indirect cooling conduction mode is adopted, and the problem of freeze of the refrigerating medium is fundamentally solved, so that refrigeration efficiency of a semiconductor refrigeration system is greatly improved. At the same time, cooling conduction of the refrigerating medium cylinder with big diameter is adopted, cooling conduction area is big, all the materials of material quality which accords with requirements for food hygiene are used as the refrigerating medium, and hygiene and safety of water drinking is guaranteed.
Description
Technical field
The utility model relates to field of water fountain, particularly relates to a kind of indirect-cooling semiconductor cooling device.
Background technology
Because traditional used cold-producing medium of compression-type refrigerating system can cause destruction and the greenhouse gases effect of atmospheric ozone layer, so in the water dispenser industry, semiconductor refrigeration system is subject to increasing attention.But there is following subject matter in existing semiconductor cooling device for water dispenser:
(1) adopts medium heat-transfer, the efficient of conducting heat depends on heat transfer area and material thermal conductivity, the area of semiconductor chilling plate is generally very little, so cause the unit are heat transfer density of heating surface material and temperature too high, can't reach the operating mode of semiconductor chilling plate requirement, the efficient degradation of semiconductor refrigerating.Although adopt the material of high thermal conductivity coefficient can improve heat-transfer effect, but because the heat transfer area of heating surface is too little, and the thermal resistance between the radiating surface is still very large, so even strengthened the area of radiating surface, can not reach desirable radiating effect, and cost will increase greatly;
(2) it is cold to adopt medium to pass, common design is that semi-conductive huyashi-chuuka (cold chinese-style noodles) directly is combined (reason that does not adopt stainless steel material is that material thermal conductivity is too low) with the biography cold aluminium block, to pass cold aluminium block directly inserts in the cold courage, by passing cold aluminium block with the cold that semiconductor chilling plate produces, be directly delivered in the water of cold courage.Based on dispel the heat the together same area that is subjected to huyashi-chuuka (cold chinese-style noodles) and the reason of material thermal conductivity, the efficient that aluminium block transmits cold is also very low;
(3) surface of the biography cold aluminium block in the insertion water can freeze, and the longer ice sheet of cooling time can be thicker, causes passing cold efficiency and further reduce, and water temperature can not reach desirable consumption temperature;
(4) drinking water direct owing to aluminium block and that cold courage is interior contacts; aluminium block itself can be separated out the heavy metal ion that is harmful to health; can carry out the oxidation protection processing although add the aluminium block surface; but in fact aluminium block all occurs the heavy corrosion phenomenon in long period of soaking after in the water, so the biography air-cooled structure of present cold courage is not meet hygienic requirements fully.
The utility model content
The technical problem that the utility model mainly solves provides a kind of indirect-cooling semiconductor cooling device, can fundamentally solve to pass the problem that cold medium freezes, and has greatly improved thus the refrigerating efficiency of semiconductor refrigeration system.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of indirect-cooling semiconductor cooling device is provided, comprises:
One cooling cylinder, inside is marked with heat-absorbing medium;
The semiconductor cooling piece comprises radiating surface and chill surface;
One heat-sink unit is positioned at the radiating surface of described semiconductor chilling plate, and the dissipation of heat that described semiconductor chilling plate produces is at work gone out;
One passes cold unit, is positioned at the refrigeration face of described conductor refrigeration sheet, and the refrigerating capacity that described semiconductor chilling plate is produced at work is transferred to the heat-absorbing medium in the cooling cylinder;
The cold unit of described biography comprises that there is the cold side of body sheet of biography hot and cold tube, some biographies and the inner refrigerating medium cylinder that refrigerating medium is arranged of evaporation working medium inside, the cold side of body sheet of described biography is installed on the outer surface of described biography hot and cold tube, the biography hot and cold tube that passes cold side of body sheet is installed is placed in the refrigerating medium cylinder, described refrigerating medium cylinder is placed in the described cooling cylinder.
In preferred embodiment of the utility model, the refrigeration system that the cold unit of described semiconductor chilling plate, heat-sink unit and biography forms is when work, and described heat-sink unit is upper, and the cold unit of described biography is lower, and described semiconductor chilling plate is vertically placed.
In preferred embodiment of the utility model, described refrigerating medium cylinder adopts the material that meets the food sanitation safe requirement to make.
In preferred embodiment of the utility model, described refrigerating medium cylinder adopts stainless steel to make.
In preferred embodiment of the utility model, the cold side of body sheet of described biography is from top to bottom perpendicular to the outer surface of described biography hot and cold tube.
In preferred embodiment of the utility model, described refrigerating medium is non freezing solution, and the heat-absorbing medium in the described cooling cylinder is drinking water.
In preferred embodiment of the utility model, described heat-sink unit comprises heat-transfer evaporator, radiating fin and cooling fan, described heat-transfer evaporator one end contacts with the radiating surface of described semiconductor chilling plate, and the other end is installed radiating fin, and described cooling fan is positioned at the radiating fin place; Described heat-transfer evaporator is heat pipe evaporator and comprises that there is the heat transfer heat pipe of evaporation working medium inside.
In preferred embodiment of the utility model, described refrigerating plant also comprises temperature detection and refrigeration control circuit, described temperature detection and refrigeration control circuit detect and control the water temperature of drinking in radiating surface temperature, refrigerant temperature and the cooling cylinder of described semiconductor chilling plate, adjust the operating voltage of operating current and the fan of described semiconductor chilling plate.
In preferred embodiment of the utility model, described evaporation working medium is ammonia.
In preferred embodiment of the utility model, described cooling cylinder also is coated with heat-insulation layer outward.
The beneficial effects of the utility model are: the utility model indirect-cooling semiconductor cooling device, adopt the cold pattern that indirectly passes, and fundamentally solved and passed the problem that cold medium freezes, greatly improved thus the refrigerating efficiency of semiconductor refrigeration system; It is cold to adopt simultaneously major diameter refrigerating medium cylinder to pass, and like this because cool transferring area is large, all materials of paddling all adopt the material that meets the food hygiene requirement as passing cold medium, guarantee drinking water hygiene and safety.
Description of drawings
Fig. 1 is the structural representation of the utility model indirect-cooling semiconductor cooling device one preferred embodiment.
The specific embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that protection domain of the present utility model is made more explicit defining.
See also Fig. 1, the utility model embodiment comprises:
A kind of indirect-cooling semiconductor cooling device comprises: cooling cylinder 100, semiconductor chilling plate 200, heat-sink unit 300 and pass cold unit 400.
Described cooling cylinder 100 comprises water inlet pipe 110 and outlet pipe 120, and inside can be marked with drinking water 130; Outer surface is coated with heat-insulation layer 140;
Described semiconductor chilling plate 200 comprises radiating surface and chill surface;
Described heat-sink unit is positioned at the radiating surface of described semiconductor chilling plate 200, and the dissipation of heat that described semiconductor chilling plate 200 produces is at work gone out; Heat-sink unit described in the present embodiment comprises heat-transfer evaporator 310, radiating fin 320 and cooling fan 330, described heat-transfer evaporator 310 1 ends contact with the radiating surface of described semiconductor chilling plate 200, the other end is installed radiating fin 320, and described cooling fan 330 is positioned at radiating fin 320 places; Described heat-transfer evaporator 310 is heat pipe evaporator, comprises that there is the heat transfer heat pipe 311 of evaporation working medium 312 inside.
The function of described heat-sink unit is that the heat that the radiating surface of semiconductor chilling plate 200 produces is passed to heat-transfer evaporator 310 and radiating fin 320 fast, and carries out heat exchange with air.Heat transfer heat pipe 311 inside are filled with the evaporation working medium 312 such as ammonia or other natural refrigerant, evaporation and condensation cycle process by evaporation working medium 312, finish the efficient transmission of heat, cooling fan 330 is preferably centrifugal blower the heat on radiating fin 320 surfaces is sent in the air.
The cold unit 400 of described biography is positioned at the refrigeration face of described conductor refrigeration sheet 200, and the refrigerating capacity that described semiconductor chilling plate 200 is produced at work is transferred to the drinking water 130 in the cooling cylinder 100.The cold unit 400 of described biography comprises that there is the cold side of body sheet 420 of biography hot and cold tube 410, some biographies and the inner refrigerating medium cylinder 430 that refrigerating medium 431 is arranged of evaporation working medium 411 inside, the cold side of body sheet 420 of described biography is installed on the outer surface of described biography hot and cold tube 410, the biography hot and cold tube 410 that passes cold side of body sheet 420 is installed is placed in the refrigerating medium cylinder 430, described refrigerating medium cylinder is placed in the described cooling cylinder 100; Described refrigerating medium cylinder 430 adopts the material that meets the food sanitation safe requirement to make, and preferably adopts stainless steel to make.
The function of the cold unit 400 of described biography is that the cold that the chill surface of cooling piece produces is passed to hot and cold tube 410 and the cold side of body sheet 420 of biography fast, and carries out heat exchange with refrigerating medium 431.The cold side of body sheet 420 of biography on the biography hot and cold tube 410 is preferably vertically arranged up and down, can guarantee all even thermal convection current circulations that does not affect cooling fluid of temperature of top and bottom.The inside that passes hot and cold tube 410 is filled with the evaporation working medium 411 such as ammonia or other natural refrigerant, by evaporation and the condensation cycle process of cold-producing medium, finishes the efficient transmission of cold.
Preferably the refrigeration system of described semiconductor chilling plate 200, heat-sink unit and biography cold unit 400 formation is when work, and described heat-sink unit is upper, and the cold unit 400 of described biography is lower, and described semiconductor chilling plate 200 is vertically placed.
The utility model indirect-cooling semiconductor cooling device has the following advantages:
(1) owing to adopted two heat-pipe refrigerating system, is higher than the generic media heat transfer system in heat radiation and the heat transfer efficiency that passes cold both direction;
(2) because two heat-pipe refrigerating system has adopted vertically arranged general layout, so that the direction of the direction of cold-producing medium evaporation and condensation and thermal convection current is in full accord, it is best that evaporation and condensation effect reach;
(3) because the heat pipe cool transferring device adopts is the vertical side of body chip garden tube radiator of arranging, so that the thermal convection current of cooling fluid is faster and efficient is higher in the heat exchanging process;
(4) owing to adopted the cold pattern of indirect biography, and with non freezing solution as cooling fluid, avoided the ice formation issues under the low-temperature condition, can obtain more faster refrigeration and lower water temperature.
(5) since with cooling piece hot-face temperature, coolant temperature and cooling cylinder water temperature as regulating parameter so that the operating efficiency of refrigeration system is higher, obtain simultaneously the effect of economize on electricity.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (10)
1. an indirect-cooling semiconductor cooling device is characterized in that, comprising:
One cooling cylinder, inside is marked with heat-absorbing medium;
The semiconductor cooling piece comprises radiating surface and chill surface;
One heat-sink unit is positioned at the radiating surface of described semiconductor chilling plate, and the dissipation of heat that described semiconductor chilling plate produces is at work gone out;
One passes cold unit, is positioned at the refrigeration face of described conductor refrigeration sheet, and the refrigerating capacity that described semiconductor chilling plate is produced at work is transferred to the heat-absorbing medium in the cooling cylinder;
The cold unit of described biography comprises that there is the cold side of body sheet of biography hot and cold tube, some biographies and the inner refrigerating medium cylinder that refrigerating medium is arranged of evaporation working medium inside, the cold side of body sheet of described biography is installed on the outer surface of described biography hot and cold tube, the biography hot and cold tube that passes cold side of body sheet is installed is placed in the refrigerating medium cylinder, described refrigerating medium cylinder is placed in the described cooling cylinder.
2. indirect-cooling semiconductor cooling device according to claim 1, it is characterized in that the refrigeration system that the cold unit of described semiconductor chilling plate, heat-sink unit and biography forms is when work, described heat-sink unit is upper, the cold unit of described biography is lower, and described semiconductor chilling plate is vertically placed.
3. indirect-cooling semiconductor cooling device according to claim 1 is characterized in that, described refrigerating medium cylinder adopts the material that meets the food sanitation safe requirement to make.
4. indirect-cooling semiconductor cooling device according to claim 3 is characterized in that, described refrigerating medium cylinder adopts stainless steel to make.
5. indirect-cooling semiconductor cooling device according to claim 1 is characterized in that, the cold side of body sheet of described biography is from top to bottom perpendicular to the outer surface of described biography hot and cold tube.
6. indirect-cooling semiconductor cooling device according to claim 1 is characterized in that, described refrigerating medium is non freezing solution, and the heat-absorbing medium in the described cooling cylinder is drinking water.
7. indirect-cooling semiconductor cooling device according to claim 1, it is characterized in that, described heat-sink unit comprises heat-transfer evaporator, radiating fin and cooling fan, described heat-transfer evaporator one end contacts with the radiating surface of described semiconductor chilling plate, the other end is installed radiating fin, and described cooling fan is positioned at the radiating fin place; Described heat-transfer evaporator is heat pipe evaporator and comprises that there is the heat transfer heat pipe of evaporation working medium inside.
8. indirect-cooling semiconductor cooling device according to claim 1, it is characterized in that, described refrigerating plant also comprises temperature detection and refrigeration control circuit, described temperature detection and refrigeration control circuit detect and control the water temperature of drinking in radiating surface temperature, refrigerant temperature and the cooling cylinder of described semiconductor chilling plate, adjust the operating voltage of operating current and the fan of described semiconductor chilling plate.
9. indirect-cooling semiconductor cooling device according to claim 1 is characterized in that, described evaporation working medium is ammonia.
10. indirect-cooling semiconductor cooling device according to claim 1 is characterized in that, described cooling cylinder also is coated with heat-insulation layer outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220400078 CN202813872U (en) | 2012-08-14 | 2012-08-14 | Indirect-cool type semiconductor refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220400078 CN202813872U (en) | 2012-08-14 | 2012-08-14 | Indirect-cool type semiconductor refrigeration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202813872U true CN202813872U (en) | 2013-03-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220400078 Withdrawn - After Issue CN202813872U (en) | 2012-08-14 | 2012-08-14 | Indirect-cool type semiconductor refrigeration device |
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| Country | Link |
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| CN (1) | CN202813872U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102818394A (en) * | 2012-08-14 | 2012-12-12 | 苏州华爱电子有限公司 | Indirect cooling semiconductor refrigerating device |
| CN103335453A (en) * | 2013-04-19 | 2013-10-02 | 廖森林 | Large environment-friendly integrated heat pump system |
-
2012
- 2012-08-14 CN CN 201220400078 patent/CN202813872U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102818394A (en) * | 2012-08-14 | 2012-12-12 | 苏州华爱电子有限公司 | Indirect cooling semiconductor refrigerating device |
| CN102818394B (en) * | 2012-08-14 | 2015-12-09 | 苏州华爱电子有限公司 | Indirect-cooling semiconductor cooling device |
| CN103335453A (en) * | 2013-04-19 | 2013-10-02 | 廖森林 | Large environment-friendly integrated heat pump system |
| CN103335453B (en) * | 2013-04-19 | 2015-04-22 | 廖森林 | Large environment-friendly integrated heat pump system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130320 Effective date of abandoning: 20151209 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |