CN202808980U - Electroplating assistant plate, and electroplating equipment using same - Google Patents
Electroplating assistant plate, and electroplating equipment using same Download PDFInfo
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- CN202808980U CN202808980U CN 201220429275 CN201220429275U CN202808980U CN 202808980 U CN202808980 U CN 202808980U CN 201220429275 CN201220429275 CN 201220429275 CN 201220429275 U CN201220429275 U CN 201220429275U CN 202808980 U CN202808980 U CN 202808980U
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- electroplating
- electroplated
- anode
- accessory plate
- electroplate liquid
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Abstract
The utility model provides an electroplating assistant plate and electroplating equipment using the electroplating assistant plate, wherein the electroplating equipment (such as a vertical continuous electroplating machine) comprises an electroplate liquid, at least one anode basket and a part to be electroplated, wherein the anode basket and the part to be electroplated are disposed in the electroplate liquid, and is mainly characterized in that an electroplating assistant plate is arranged between the anode basket and the part to be electroplated, at least one side of the electroplating assistant plate is longer than that part to be electroplated, and the electroplating assistant plate is of nonconductive plastic material and comprises a plurality of open pores; in an electroplating process, with the help of the tunnel function formed by the open pores, the electroplating equipment can guide positive ions (such as copper ions) in the electroplate liquid to directly flow to the surface of the nearest part to be electroplated from the anode basket (namely, anode), and guide the positive ions to run straightly so as to fill the open pores, moreover, the redundant positive ions of the part which is larger than the anode basket (namely, anode) of the part to be electroplated cannot enter the open pore in a diagonal manner, and cannot reach the part to be electroplated, thereby forming a shield function; by the adoption of the electroplating equipment, the unevenness of the thickness of the plating of the part to be electroplated is likely to be avoided, and the existing shield plate is not required.
Description
Technical field
The utility model relates to a kind of electroplating device of electroplating accessory plate and using it, establish a plating accessory plate with several perforates between its anode at electroplating device, negative electrode, and under the situation that must not use existing shield, just can make its thickness of coating of plated item of making average, good.
Background technology
Employed electroplating device such as vertical continuous formula electroplating machine in electroplating industry, it is carrying out electroplating activity such as circuit board copper plating, and first requirement is exactly that plated item will have even, good thickness of coating.
What the tradition electroplating activity was used is copper anode, but the meeting of anode made of copper is more and more thinner, and an existing new anode is iridium alloy anode network (insoluble anode) in addition, and its characteristic is to lead to large electric current, flash plate.
See also Fig. 5, shown in Figure 6, for the plating of general electroplating device is configured in rough schematic when carrying out the copper facing operation, it includes an electroplate liquid 90 and is arranged in two anode baskets 91 of electroplate liquid 90 (being the anode of electroplating activity) and a unplated piece 92 (is the negative electrode of electroplating activity, be circuit card in present embodiment unplated piece 92), wherein unplated piece 92 is by anchor clamps 93 clampings, and can rely in addition the drive of drive unit to make unplated piece 92 in 91 movements of anode basket.
Because unplated piece 92 is of a great variety, the size of unplated piece 92 differs, so anode basket 91 (anode) is greater than unplated piece 92 (negative electrode), and so that anode basket 91 (anode), unplated piece 92 (negative electrode) size can't cooperate, thus, unplated piece 92 (negative electrode) middle section is because irrelevant with anode basket 91 (anode) size, so this middle section coating normal (the thick black line on unplated piece 92 surfaces is coating among Fig. 5), and unplated piece 92 is arranged in wherein three sides of electroplate liquid 90, because anode basket 91 (anode) is greater than unplated piece 92 (negative electrode), so this three sides positively charged ion is (such as cupric ion, arrow among the figure namely represents positively charged ion) source many, additional positively charged ion all is attached to this three side, be thick in thickness coating 921 and make this three side produce Thickness Ratio middle section, so whole kind is electroplated structure and can't be made the thickness of coating of plated item even according to this, well.
See also shown in Figure 7, industry is in order to improve the inhomogeneous shortcoming of its thickness of coating of above-mentioned plated item now, so just in unplated piece 92 vicinity one V-arrangement shield 94 is set, to rely on this V-arrangement shield 94 to stop that too much positively charged ion is (such as cupric ion, arrow among the figure namely represents positively charged ion), and avoid unplated piece 92 to produce the inhomogeneous situation (the thick black line on unplated piece 92 surfaces is coating among Fig. 7) of thickness of coating.
Although being set, this V-arrangement shield 94 can avoid the inhomogeneous situation of unplated piece 92 thickness of coating, but this V-arrangement shield 94 is suitably mobile up and down, to cooperate the peripheral position of unplated piece 92, and for V-arrangement shield 94 is moved up and down, driving mechanism and controller thereof must be set in addition again, the member of so electroplating structure is various and complicated, moreover V-arrangement shield 94 moves up and down unavoidably and can make mistakes.
So, electroplate now industry in order to produce average, the good plated item of thickness of coating, there is no at present perfect electroplating device.
Therefore, the theory that the utility model people product-based is constantly brought forth new ideas and improved is in line with the practical experience of being engaged in for many years product design, exploitation, and actively with great concentration research and development thinking, and the actual design experiment via has many times caused generation of the present utility model.
Summary of the invention
The purpose of this utility model providing a kind of being applied to electroplate structure, can make average, the good plating accessory plate of its thickness of coating of plated item of making.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of plating accessory plate is applied to electroplate structure, and it is characterized in that: its material is nonconducting plastic material, and has several perforates, and this perforate is used for the positively charged ion of guiding electroplate liquid.
This perforate is arranged in number row's shapes, and adjacent row's the perforate shape that becomes to stagger distributes.
Compared with prior art, the beneficial effect that the utlity model has is: this perforate is for the positively charged ion in the guiding electroplate liquid, and so that can't enter perforate with oblique greater than the additional positively charged ion of the anode basket (being anode) of unplated piece part institute, and can't arrive unplated piece, block effect with formation, can avoid the unplated piece thickness of coating unequal.
Another purpose of the present utility model is providing a kind of average, good electroplating device of its thickness of coating of plated item of making that makes.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of electroplating device is characterized in that, comprising:
One electroplate liquid;
At least one anode basket is arranged in electroplate liquid, and it is anodal to be connected in an electric current;
One unplated piece is arranged in electroplate liquid, and is connected in an electric current negative pole;
It is characterized in that: be provided with one between this anode basket, the unplated piece and electroplate accessory plate, this electroplates at least one side length of accessory plate greater than unplated piece, and the material of this plating accessory plate is nonconducting plastic material, and has several perforates.
This perforate is arranged in number row's shapes, and adjacent row's the perforate shape that becomes to stagger distributes.
This plating accessory plate is fixed on the set fastener of a jet pipe.
Compared with prior art, the beneficial effect that the utlity model has is: in electroplating process, the tunneling that relies on perforate to form, the positively charged ion that can guide in the electroplate liquid straightly flows to nearest unplated piece surface by anode basket (being anode), and can guide positively charged ion keeps straight on and takes in perforate, the positively charged ion that produces greater than the anode basket (being anode) of unplated piece part in addition just can't enter perforate with oblique, and can't arrive unplated piece, block effect with formation, can avoid the unplated piece thickness of coating unequal, and must not use existing shield.
Description of drawings
Fig. 1 is the stereographic map that the utility model is electroplated accessory plate;
Fig. 2 is the side-view of the utility model electroplating device;
Fig. 3 is the top view of the plating tank of the utility model electroplating device;
Fig. 4, Fig. 4 A are that the utility model electroplating device can make the average use embodiment synoptic diagram of unplated piece thickness of coating and local enlarged diagram thereof;
Fig. 5 is that the plating of existing electroplating device is configured in the rough schematic when carrying out the copper facing operation;
Fig. 6 is the produced uneven rough schematic of its thickness of coating of unplated piece of plating structure of existing electroplating device;
Fig. 7 is the use embodiment synoptic diagram that the plating structure of existing electroplating device is equipped with a V-arrangement shield.
Description of reference numerals: 1-electroplating device; 10-electroplates accessory plate; The 11-perforate; The 20-board; The 30-plating tank; The 31-electroplate liquid; 40-anode basket; The 50-unplated piece; The 60-anchor clamps; The 70-drive unit; The 80-jet pipe; The 81-fastener; The 90-electroplate liquid; 91-anode basket; The 92-unplated piece; 921-is than thickness coating; The 93-anchor clamps; 94-V shape shield.
Embodiment
See also shown in Figure 1ly, the utility model is electroplated accessory plate 10 and be can be applicable to electroplate structure, is nonconducting plastic material, and has several perforates 11, and this perforate 11 is for the positively charged ion (such as cupric ion) in the guiding electroplate liquid.
This perforate 11 can be arranged in number row's shapes, and adjacent row's perforate 11 shape that can become to stagger distributes.
See also Fig. 2, shown in Figure 3, the utility model electroplating device 1 can be a vertical continuous formula electroplating machine, can carry out electroplating activity such as circuit board copper plating, and this electroplating device 1 has a board 20, and board 20 is provided with the plating tank 30 that an electroplate liquid 31 is housed in; In the number anode baskets 40 coating material such as copper ball are housed and are arranged in two row's shapes and be positioned at electroplate liquid 31, and be connected in the positive pole of an electroplating current; And a unplated piece 50 is positioned at electroplate liquid 31 such as circuit card, and be connected in the negative pole of an electroplating current, this unplated piece 50 is by anchor clamps 60 clampings, and these anchor clamps 60 can be driven by a drive unit 70 of being located at board 20, and then unplated piece 50 is entered between two row's anode baskets 40 and suitably mobile.
See also Fig. 2, Fig. 3, shown in Figure 4, the utility model electroplating device 1 main anode basket 40,50 of unplated pieces of being characterised in that is provided with the utility model plating accessory plate 10, electroplate accessory plate 10 and can be fixed on the set fastener 81 of a jet pipe 80, and should electroplate accessory plate 10 at least one side length greater than unplated piece 50, electroplate accessory plate 10 downside length greater than unplated piece 50 in present embodiment; In the electroplating activity process, when unplated piece 50 driven devices 70 drive and enter between two row's anode baskets 40, the tunneling that the perforate that relies on the utility model to electroplate accessory plate 10 forms, can guide positively charged ion in the electroplate liquid 31 (such as cupric ion, arrow among Fig. 4 namely represents positively charged ion) straightly flow to nearest unplated piece 50 surfaces (the thick black line on unplated piece 50 surfaces is coating among Fig. 4) by anode basket 40, and can guide positively charged ion keeps straight on and takes in perforate 11, the positively charged ion that produces greater than anode basket 40 parts (asking for an interview the following part of dotted line among Fig. 4) of unplated piece 50 in addition just can't enter perforate 11 with oblique, and can't arrive unplated piece 50, block effect with formation, accordingly, can avoid the uneven situation of unplated piece 50 thickness of coating.
According to actual test, experiment, the utility model is electroplated the thickness of accessory plate 10 take 6 ~ 10mm as good; And the aperture of the perforate 11 of the utility model plating accessory plate 10 is take 2 ~ 5mm as good; And the utility model is electroplated the distance of 11 of adjacent apertures of accessory plate 10 take 0.3 ~ 0.5mm as good, and electroplates accessory plate 10 and make the magnitude setting of perforate 11 the more the better under unit surface.
Arrow among Fig. 2 represents electroplate liquid 31 and can enter jet pipe 80 and gone out by its jet flow, and electroplate liquid 31 can circulate, reflux, and has the effect of the new liquid of circulation.
Comprehensively the above uses plating accessory plate of the present utility model and electroplating device, can produce average, the good plated item of thickness of coating, and must not use existing shield.
More than explanation is just illustrative for the utility model; and nonrestrictive, those of ordinary skills understand, in the situation that does not break away from the spirit and scope that claim limits; can make many modifications, variation or equivalence, but all will fall within the protection domain of the present utility model.
Claims (5)
1. electroplate accessory plate for one kind, be applied to electroplate structure, it is characterized in that: its material is nonconducting plastic material, and has several perforates, and this perforate is used for the positively charged ion of guiding electroplate liquid.
2. plating accessory plate according to claim 1 is characterized in that: this perforate is arranged in number row shapes, and adjacent row's the perforate shape that becomes to stagger distributes.
3. an electroplating device is characterized in that, comprising:
One electroplate liquid;
At least one anode basket is arranged in electroplate liquid, and it is anodal to be connected in an electric current;
One unplated piece is arranged in electroplate liquid, and is connected in an electric current negative pole;
It is characterized in that: be provided with one between this anode basket, the unplated piece and electroplate accessory plate, this electroplates at least one side length of accessory plate greater than unplated piece, and the material of this plating accessory plate is nonconducting plastic material, and has several perforates.
4. electroplating device according to claim 3 is characterized in that: this perforate is arranged in number row shapes, and adjacent row's the perforate shape that becomes to stagger distributes.
5. electroplating device according to claim 3, it is characterized in that: this plating accessory plate is fixed on the set fastener of a jet pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201220429275 CN202808980U (en) | 2012-08-27 | 2012-08-27 | Electroplating assistant plate, and electroplating equipment using same |
Applications Claiming Priority (1)
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CN 201220429275 CN202808980U (en) | 2012-08-27 | 2012-08-27 | Electroplating assistant plate, and electroplating equipment using same |
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CN202808980U true CN202808980U (en) | 2013-03-20 |
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CN 201220429275 Expired - Fee Related CN202808980U (en) | 2012-08-27 | 2012-08-27 | Electroplating assistant plate, and electroplating equipment using same |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103628120A (en) * | 2012-08-27 | 2014-03-12 | 郭明宏 | Electroplating assisting plate, and electroplating apparatus using it |
-
2012
- 2012-08-27 CN CN 201220429275 patent/CN202808980U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103628120A (en) * | 2012-08-27 | 2014-03-12 | 郭明宏 | Electroplating assisting plate, and electroplating apparatus using it |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20140827 |
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EXPY | Termination of patent right or utility model |