CN202799548U - Heat conducting structure - Google Patents
Heat conducting structure Download PDFInfo
- Publication number
- CN202799548U CN202799548U CN 201220493200 CN201220493200U CN202799548U CN 202799548 U CN202799548 U CN 202799548U CN 201220493200 CN201220493200 CN 201220493200 CN 201220493200 U CN201220493200 U CN 201220493200U CN 202799548 U CN202799548 U CN 202799548U
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- Prior art keywords
- conductive structure
- evaporation section
- heat pipe
- caulking groove
- heat
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Abstract
A heat conducting structure comprises a heat pipe and a pressed part, wherein the heat pipe comprises an evaporation section and a condensation section stretching from the evaporation section. The pressed part is provided with an embedding groove, at least one material escaping hole is arranged in the embedding groove, and the evaporation section is embedded in the embedding groove and covers the material escaping hole. Redundant deformation metal materials are accommodated through the material escaping hole and the evaporation section of the heat pipe is guaranteed to be a flat panel at the embedding groove opening.
Description
Technical field
The utility model is relevant for conductive structure, and particularly a kind of its rolled-up stock has the conductive structure of slug hole.
Background technology
Heat pipe in the conductive structure is the normal element that uses in the electronic installation heat radiation, and its main material is a metal tube, a wherein end in contact pyrotoxin of metal tube, and the other end generally can be provided with radiating fin.Metal tube removes the heat energy that pyrotoxin produces by an end in contact heating source on it, the other end of thermal energy transfer to metal tube is dissipated into outside the electronic installation by fin again.
Known conductive structure can be suppressed heat pipe on pyrotoxin with a pressing block, to increase the heat conduction efficiency between heat pipe and the pyrotoxin.Generally can be provided with groove on the pressing block, heat pipe is extruded and is forced in the pressing block groove, then repairs the one side of heat pipe distortion again, makes smooth contact-making surface of itself and the surface formation of pressing block, make whereby contact-making surface and pyrotoxin fit tightly, but also can extend the endotherm area of heat pipe simultaneously.
Heat pipe is extruded in the process that is forced into, and unnecessary deformable metal tube material can the stress relation and cause the out-of-flatness of can caving in of the contact-making surface of heat pipe and pyrotoxin, just can make it smooth so must will there be follow-up secondary operations to repair, thereby the increase processing cost.
The utility model content
The purpose of this utility model is to provide a kind of conductive structure, and its structure is so that heat pipe can consist of a smooth heat-absorbent surface when being forced into the rolled-up stock caulking groove.
For reaching above-mentioned purpose, the utility model provides a kind of conductive structure, and it comprises a heat pipe and a rolled-up stock.Heat pipe comprises a condensation segment of an evaporation section and the extension of spontaneous evaporation section.Rolled-up stock has a caulking groove, has at least one slug hole in the caulking groove, and evaporation section is forced in caulking groove and hides slug hole.
Preferably, aforesaid conductive structure, its rolled-up stock comprises a metal plate, and metal plate bends and the formation caulking groove.
Preferably, aforesaid conductive structure, its slug hole runs through metal plate.
Preferably, aforesaid conductive structure, its rolled-up stock comprise a fixing feet of extending from metal plate.
Preferably, aforesaid conductive structure, its metal plate comprises a heat-absorbent surface, and caulking groove is opened on heat-absorbent surface.
Preferably, aforesaid conductive structure, the evaporation section of its heat pipe continue mutually with heat-absorbent surface and are a plane.
Preferably, aforesaid conductive structure, the some of its heat pipe section is absorbed in slug hole.
Preferably, aforesaid conductive structure more comprises a fins group, and the condensation segment of heat pipe is arranged in fins group.
Preferably, aforesaid conductive structure more comprises a glue-line, and this glue-line folder is sincere between this evaporation section and this caulking groove.
Therefore conductive structure of the present utility model as long as time processing can obtain smooth heat-absorbent surface, has effectively improved the irregular shortcoming of known technology embedded surface by the accommodating deformable metal tube material that is extruded of the slug hole in the metal plate caulking groove.
Again, conductive structure of the present utility model more comprises a glue-line, and the glue-line folder is sincere between evaporation section and caulking groove, allows evaporation section and caulking groove see through glue-line and is bonded together, and makes the combination of evaporation section and caulking groove more firm, reaches the assembling steadiness of strengthening conductive structure.
Description of drawings
Fig. 1 is the schematic perspective view of the conductive structure of the utility model the first embodiment;
Fig. 2 is the schematic diagram of rolled-up stock in the conductive structure of the utility model the first embodiment;
Fig. 3 A is the cutaway view of heat pipe and caulking groove in the conductive structure of the utility model the first embodiment;
Fig. 3 B is the cutaway view (embedding) of heat pipe and caulking groove in the conductive structure of the utility model the first embodiment;
Fig. 4 is the operating state cutaway view of the conductive structure of the utility model the first embodiment;
Fig. 5 is the schematic perspective view of the conductive structure of the utility model the second embodiment;
Fig. 6 is the generalized section of the radiator structure conductive structure of the utility model the 3rd embodiment.
Wherein, Reference numeral:
Embodiment
Consult Fig. 1 and Fig. 2, the first embodiment of the present utility model provides a kind of conductive structure, be used for the heat-generating electronic elements that is positioned on the circuit board 10 is dispelled the heat, wherein heat-generating electronic elements can be a computing wafer 20 (for example CPU wafer or demonstration wafer).In present embodiment, conductive structure of the present utility model comprises a heat pipe 100, a rolled-up stock 200 and a fins group 300.
Rolled-up stock 200 is suppressed and close contact computing wafer 20 for heat pipe 100 being fixed on the circuit board 10 and with evaporation section 110, the fixing feet 220 that rolled-up stock 200 comprises a metal plate 210 and extends from metal plate 210.
Consult Fig. 1 and Fig. 2, metal plate 210 is that preferably copper becomes, but the utility model is not limited to copper, and it also can be made for aluminium or the higher metal of other heat conduction numbers, the wherein one side of metal plate 210 is heat-absorbent surface 201, and heat-absorbent surface 201 is used for contact computing wafer 20.Metal plate 210 bending and consist of a caulking groove 211, and the opening of caulking groove 211 is positioned on the heat-absorbent surface 201, and in present embodiment, caulking groove 211 is rectangular groove preferably, but the utility model is not limited to rectangle, and it also can be the groove of other shapes.Offer a slug hole 212 in the caulking groove 211, slug hole 212 preferably is opened in the bottom of caulking groove 211, and slug hole 212 is the perforation that runs through metal plate 210 in present embodiment, but it also can be the blind hole that opening is positioned at caulking groove 211 inboards.
Rolled-up stock 200 preferably includes four fixing feet 220 (but the utility model does not limit the number of fixing feet 220) in present embodiment, those fixing feet 220 are riveted on metal plate 210, but fixing feet 220 also can be connected in metal plate 210 (for example welding or one-body molded, the utility model is not limited to this) by other means.The latter end of each fixing feet 220 offers an interlocking hole 221, whereby conductive structure of the present utility model is locked in circuit board 10 and so that the evaporation section 110 close contact computing wafers 20 of contact heat pipe 100.
Consult Fig. 2 to Fig. 4, the caliber of heat pipe 100 preferably is slightly less than the width of caulking groove 211, and the evaporation section 110 of heat pipe 100 is arranged in the caulking groove 211 and hides at least a portion of slug hole 212.Evaporation section 110 is inserted and is provided a pressure extrusion evaporation section 110 to make it be out of shape to meet the shape of caulking groove 211 inwalls to evaporation section 110 again behind the caulking groove 211 and be embedded at caulking groove 211.And the evaporation section 110 of extrusion is absorbed in the slug hole 212 because of the part metal material, whereby so that evaporation section 110 is presented a burnishing surface, therefore conductive structure of the present utility model fits tightly with computing wafer 20 by the evaporation section 110 of heat pipe 100, reaches good thermal conduction effect.
Fins group 300 is comprised of a plurality of metal fins 310 that are arranged in parallel, and the condensation segment 120 of heat pipe 100 passes fins group 300 and is connected in series those metal fins 310.Seeing through metal fins 310 is dissipated into the heat energy autocondensation section 120 in the heat pipe 100 in the surrounding air.
Consult Fig. 5, the second embodiment of the present utility model provides a kind of conductive structure, is used for the heat-generating electronic elements that is positioned on the circuit board 10 is dispelled the heat, and what wherein heat-generating electronic elements was better is a computing wafer 20.In present embodiment, conductive structure of the present utility model comprises a heat pipe 100, a rolled-up stock 200 and a fins group 300.Heat pipe 100, pressed parts 200 and fin assembly 300 Cal structure and links between roughly as the foregoing first embodiment, the similarities here no longer tired.Present embodiment and the first embodiment difference are, run through in the caulking groove 211 and offer two slug holes 212, when the embedded length of evaporation section 110 is longer, can by a plurality of slug holes 212 being set to disperse the metal material of distortion, so that embedding the deflection of each part of caulking groove 211, evaporation section 110 be able to even distribution.The utility model does not limit the number that arranges of slug hole 212, and the evaporation section 110 that therefore also can look heat pipe 100 embeds the increasing of deflection of caulking grooves 211 and slug hole 212 more than two is set.
The deformable metal material that the accommodating heat pipe of slug hole 212 in the caulking groove 211 of conductive structure of the present utility model by metal plate 210 100 is unnecessary causes the evaporation section 110 of heat pipe 100 can be the depression out-of-flatness to avoid unnecessary deformable metal material.Therefore as long as time processing can obtain the burnishing surface of the evaporation section 110 of heat pipe 100, do not need to carry out follow-up finishing process such as known technology, the utility model has effectively improved the shortcoming of known technology again.
Consult Fig. 6, the 3rd embodiment of the present utility model, conductive structure of the present utility model more comprises a glue-line 400, glue-line 400 can be laid in the outer peripheral edges of evaporation section 110 or the inner peripheral of caulking groove 211, and make glue-line 400 folders sincere between evaporation section 110 and caulking groove 211, allow evaporation section 110 and caulking groove 211 see through glue-line 400 and be bonded together, make the combination of evaporation section 110 and caulking groove 211 more firm, reach the assembling steadiness of strengthening conductive structure.
The above only is preferred embodiment of the present utility model, and non-in order to limit claim of the present utility model, other use the equivalence of patent spirit of the present utility model to change, and all should all belong to claim of the present utility model.
Claims (9)
1. a conductive structure is characterized in that, comprises:
One heat pipe, a condensation segment that comprises an evaporation section and extend from this evaporation section; And
One rolled-up stock has a caulking groove, offers at least one slug hole in this caulking groove, and the some of this evaporation section of this heat pipe is embedded in this caulking groove and to should slug hole.
2. conductive structure as claimed in claim 1 is characterized in that, this rolled-up stock comprises a metal plate, this metal plate bending and consist of this caulking groove.
3. conductive structure as claimed in claim 2 is characterized in that, this slug hole runs through this metal plate.
4. conductive structure as claimed in claim 2 is characterized in that, this rolled-up stock comprises a fixing feet of extending from this metal plate.
5. conductive structure as claimed in claim 1 is characterized in that, a part of metal material of this evaporation section is absorbed in this slug hole.
6. conductive structure as claimed in claim 2 is characterized in that, this metal plate comprises a heat-absorbent surface, and this caulking groove is opened on this heat-absorbent surface.
7. conductive structure as claimed in claim 5 is characterized in that, this evaporation section of this heat pipe continues mutually with this metal plate heat-absorbent surface and is a plane.
8. conductive structure as claimed in claim 1 is characterized in that, more comprises a fins group, and this condensation segment of this heat pipe is arranged in this fins group.
9. conductive structure as claimed in claim 1 is characterized in that, more comprises a glue-line, and this glue-line folder is sincere between this evaporation section and this caulking groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220493200 CN202799548U (en) | 2012-09-25 | 2012-09-25 | Heat conducting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220493200 CN202799548U (en) | 2012-09-25 | 2012-09-25 | Heat conducting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202799548U true CN202799548U (en) | 2013-03-13 |
Family
ID=47826710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220493200 Expired - Fee Related CN202799548U (en) | 2012-09-25 | 2012-09-25 | Heat conducting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202799548U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104717870A (en) * | 2013-12-12 | 2015-06-17 | 奇鋐科技股份有限公司 | Heat dissipation module combined structure |
| CN106550583A (en) * | 2015-09-16 | 2017-03-29 | 宏碁股份有限公司 | Heat radiation module |
-
2012
- 2012-09-25 CN CN 201220493200 patent/CN202799548U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104717870A (en) * | 2013-12-12 | 2015-06-17 | 奇鋐科技股份有限公司 | Heat dissipation module combined structure |
| CN106550583A (en) * | 2015-09-16 | 2017-03-29 | 宏碁股份有限公司 | Heat radiation module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20150925 |
|
| EXPY | Termination of patent right or utility model |