CN202793595U

CN202793595U - Infrared thermal imaging device based on FPGA

Info

Publication number: CN202793595U
Application number: CN 201220408647
Authority: CN
Inventors: 李亮
Original assignee: Chengdu Jetcom Technology Co Ltd
Current assignee: Chengdu Jetcom Technology Co Ltd
Priority date: 2012-08-17
Filing date: 2012-08-17
Publication date: 2013-03-13
Anticipated expiration: 2022-08-17

Abstract

The utility model relates to the thermal imaging technical field and provides an infrared thermal imaging device based on FPGA. The utility model aims to provide a non-refrigeration infrared thermal imaging device frequently applied in portable equipments and characterized by small size and low power dissipation, etc. The infrared thermal imaging device comprises an infrared focal plane array, an analog signal modulating unit and an FPGA processor which are sequentially connected. The infrared thermal imaging device further comprises a Schmidt door connected between the infrared focal plane array and the FPGA processor. The FPGA processor is connected with a one-chip microcomputer, a D/A converter, an SRAM and a system debugging interface. The infrared thermal imaging device also comprises a TEC control unit connected between the infrared focal plane array and the one-chip microcomputer. The infrared thermal imaging device provided by the utility model is applied as a thermal imaging device.

Description

A kind of infrared thermal imaging device based on FPGA

Technical field

The utility model relates to the thermal imaging field, provides OnePlant the infrared thermal imaging device based on FPGA.

Background technology

Infrared imaging mainly is the process of infrared acquisition, but is the process that sightless infrared radiation is converted to visible or measuring-signal by infrared eye.Infrared thermal imaging technique is from originally mechanical scanning mechanism total solids miniaturization electronics self-scanning imaging mechanism up till now.Tradition refrigeration mode infrared detection system optical mechaical scanning mechanical refrigerator is expensive, and equipment volume is huge, the poor shortcomings that waits of performance reliability.In recent years, particularly the development of uncooled ir thermal imaging makes infrared thermal imaging technique expand more wide application.

The utility model content

The purpose of this utility model is to provide the advantages such as a kind of volume is little, low in energy consumption, is applied in a kind of infrared thermal imaging device based on FPGA on the portable set more.

The utility model is by the following technical solutions for achieving the above object:

A kind of infrared thermal imaging device based on FPGA, it is characterized in that: comprise the infrared focal plane array, simulating signal modulating unit, the FPGA processor that are linked in sequence, also comprise the schmidt door that is connected to infrared focal plane array and FPGA, described FPGA processor is connected with single-chip microcomputer, D/A converter, SRAM, system debug interface, also comprises the TEC control module that is connected between infrared focal plane array and the single-chip microcomputer.

Further, described simulating signal modulating unit comprises low-pass filter and A/D converter, and described low-pass filter adopts operational amplifier, and described A/D converter adopts 14 modulus conversion chip AD6644.

Further, the controller of described TEC (thermoelectric (al) cooler) control module adopts the ADN8830 chip.

Further, described single-chip microcomputer adopts the MSP430 chip.

The utlity model has following beneficial effect:

The advantage such as one, a kind of volume of the utility model is little, low in energy consumption can be applicable on the portable set.

Two, the utility model adopts TEC control unit, stablize the parameter that detector is exported, and the working temperature of these devices has been realized accurate control.

Description of drawings

Fig. 1 is the utility model system architecture diagram.

Embodiment

Below in conjunction with accompanying drawing the utility model is described further:

This system is divided into following components

The simulating signal modulating part: its effect is the sensing circuit of tie detector, simultaneously the analog video of output is carried out filtering and processes.Mainly for detector front end digital signal and simulating signal;

TEC (thermoelectric (al) cooler) control module: use single-chip microcomputer to carry out temperature control in conjunction with special driving chip and process, single-chip microcomputer drives chip with simple incremental digital PID control, and temperature variation is controlled within the 10mK.

The structure of FPGA peripherals: the signal rear image way of output of finishing dealing with has two kinds: a kind of signal is exported to display by D/A; Another clock signal sends computing machine to by CY7C68013, can debug.

Debugging interface is set up: building of CY7C68013 circuit, use the high speed communication mode of USB2.0 agreement

(480Mbps), by writing CY7C68013 firmware and FPGA program, realize the communication with PC:

Control section peripherals makes up.Realize simple increment type PID control by single-chip microcomputer MSP430 control ADN8830;

The power management part: the demand according to modules is carried out Power Management Design, wants for analog-and digital-part is different.

Infrared picture data after video display part: FPGA processes is carried out the D/A conversion, with the analog picture signal after the conversion and synthetic full TV PAL-system (or the N system) signal of video carrier stack.

A kind of infrared thermal imaging device based on FPGA, it is characterized in that: comprise the infrared focal plane array, simulating signal modulating unit, the FPGA processor that are linked in sequence, also comprise the schmidt door that is connected to infrared focal plane array and FPGA, described FPGA processor is connected with single-chip microcomputer, D/A converter, SRAM, system debug interface, also comprises the TEC that is connected between infrared focal plane array and single-chip microcomputer unit processed.

Further, described single-chip microcomputer adopts the MSP430 chip, and it is given that MSP430 is responsible for set temperature point, also is responsible for software and realizes increment type PID algorithm.Magnitude of voltage on the given pin of ADN8830 temperature is given by DAC8803, and set point is current magnitude of voltage corresponding to environment temperature point.The measurement of Current Temperatures point realizes that by temperature sensor the temperature sensor model is TMPl00, and it and MSP430 carry out communication by the 12C bus.

Schmidt door: two effects are arranged in system, and one is to be the input signal shaping, makes the edge of the waveform of output voltage become steeper, and another is that pulse signal to numeral carries out filtering, can not make the take over party that misoperation occurs so that disturb.Schmidt door adopts chip SN74LVC3G14.

FPGA processor major function:

(1) image blind element filling algorithm;

(2) image non-uniform is proofreaied and correct:

(3) with the interface section communication of CY7C68013;

(4) the temporary of image realized in SRAM interface section;

(5) give the front end work schedule.

Claims

1. infrared thermal imaging device based on FPGA, it is characterized in that: comprise the infrared focal plane array, simulating signal modulating unit, the FPGA processor that are linked in sequence, also comprise the schmidt door that is connected to infrared focal plane array and FPGA, described FPGA processor is connected with single-chip microcomputer, D/A converter, SRAM, system debug interface, also comprises the TEC control module that is connected between infrared focal plane array and the single-chip microcomputer.

2. a kind of infrared thermal imaging device based on FPGA according to claim 1, it is characterized in that: described simulating signal modulating unit comprises low-pass filter and A/D converter, described low-pass filter adopts operational amplifier, and described A/D converter adopts 14 modulus conversion chip AD6644.

3. a kind of infrared thermal imaging device based on FPGA according to claim 1 is characterized in that: the controller employing ADN8830 chip of described TEC control module.

4. a kind of infrared thermal imaging device based on FPGA according to claim 1 is characterized in that: described single-chip microcomputer employing MSP430 chip.