CN202758928U - Improved LED full-color support structure - Google Patents

Improved LED full-color support structure Download PDF

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Publication number
CN202758928U
CN202758928U CN 201220310578 CN201220310578U CN202758928U CN 202758928 U CN202758928 U CN 202758928U CN 201220310578 CN201220310578 CN 201220310578 CN 201220310578 U CN201220310578 U CN 201220310578U CN 202758928 U CN202758928 U CN 202758928U
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CN
China
Prior art keywords
wafer
led
negative pole
conductive pin
blue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220310578
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Chinese (zh)
Inventor
陈可
王建全
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innoquick Electronics Technology Co., Ltd.
Original Assignee
Sichuan Bonshine Optical Electron Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Bonshine Optical Electron Technology Co Ltd filed Critical Sichuan Bonshine Optical Electron Technology Co Ltd
Priority to CN 201220310578 priority Critical patent/CN202758928U/en
Application granted granted Critical
Publication of CN202758928U publication Critical patent/CN202758928U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an improved LED full-color support structure which comprises a support main body. The support main body is provided with a plurality of hollow portions and an LED individual support is formed in each hollow portion. The LED individual support comprises a cathode conductive pin and three anode conductive pins, wherein the cathode conductive pin, the three anode conductive pins and the support main body are formed as a whole. One end of the cathode conductive pin and one ends of the three anode conductive pins are bent to form a wire-welding platform respectively, and the wire-welding platforms protrude outwardly. The upper surfaces of the wire-welding platform of the cathode conductive pin recesses downwards to form a holding groove, wherein the holding groove can holds a red wafer, a yellow wafer and a blue wafer. The beneficial effects are that: according to the improved LED full-color support structure, the red wafer, the yellow wafer and the blue wafer are integrated and integrated epoxy resin packaging is realized through epoxy resin packaging, so that thermal expansion influences on an LED rubber body are greatly reduced; LED performances of water resistance, moisture resistance, temperature shock resistance are improved; and the light source of LED support is suitable for use in outdoor hostile environments.

Description

The full-color supporting structure of LED of improvement
[technical field]
The utility model relates to led support, relates in particular to a kind of full-color supporting structure of LED of improvement.
[background technology]
Along with the LED full color display is day by day universal, particularly outdoor display screen with its rich color and round-the-clock broadcast performance, is favored by users deeply.Marketing is more and more deep, and is also more and more higher to the pixel-intensive degree requirement of display screen.Existing outdoor display screen mainly uses oval direct insertion LED as light-emitting component, because direct insertion LED discrete component can only show a kind of color, so red, green, blue 3 LEDs could form a base pixel point, so can't realize the small pixel spacing.Although and traditional adopting surface mounted LED can be realized the small pixel spacing, because plastic shell is different from the thermal coefficient of expansion of epoxy resin, is prone to lamp body and makes moist and cause the existing picture that lost efficacy, thereby can only in indoor environment, use.
[summary of the invention]
The purpose of this utility model is effectively to overcome the deficiency of above-mentioned technology, provides a kind of three kinds of color wafers of red, green, blue are integrated, and uses the epoxy resin integral packaging, the full-color supporting structure of the LED of waterproof and dampproof improvement.
The technical solution of the utility model is achieved in that the full-color supporting structure of a kind of LED of improvement, it comprises rack body, described rack body is provided with a plurality of hollow-out parts, in each hollow-out parts, be formed with one red wafer can be installed, the LED monomer frame of yellow wafer and blue wafer, its improvement is: described LED monomer frame comprises and the integrated negative pole conductive pin of rack body and three anodal conductive pins, described negative pole conductive pin has one and is used for and described red wafer, the negative pole link that yellow wafer and blue wafer connect and one and the negative pole stiff end that connects as one of described rack body, described three anodal conductive pins have respectively an anode connection terminal that is connected with described red wafer or yellow wafer or blue wafer and one and the anodal stiff end that links into an integrated entity of described rack body;
The negative pole link of described negative pole conductive pin and the anode connection terminal of three anodal conductive pins form respectively a bonding wire platform protruding upward through bending, and the upper surface of the bonding wire platform of described negative pole conductive pin is recessed to form an accommodating groove that can hold red wafer, yellow wafer and three wafers of blue wafer downwards.
Bonding wire platform corresponding on described three anodal conductive pins is electrically connected with described red wafer, yellow wafer and blue wafer respectively by gold thread.
Described LED monomer frame is " protruding " type structure.
Described accommodating groove is bowl structure.
Described rack body and LED monomer seating face have silver coating.
Than led support of the prior art, the beneficial effects of the utility model are: the utility model is with red, green, blue three primary colors wafer integrates, soon red, green, blue three primary colors wafer is electrically connected on the negative pole conductive pin simultaneously, again with three anodal pins of correspondence respectively with red, green, blue three primary colors wafer is connected to form and independently drives separately the loop, realize the epoxy resin integrative packaging by epoxy encapsulation again, thereby the impact of LED colloid expanded by heating is greatly reduced, promoted the LED waterproof, moistureproof, the resisting temperature impact property, so that the light source of this led support can be applicable to use in the outdoor rugged environment, has good waterproof, moisture effect.
[description of drawings]
Fig. 1 is the front view of the full-color supporting structure of LED of the utility model improvement
Fig. 2 is the vertical view of the full-color supporting structure of LED of the utility model improvement
Fig. 3 is the structural representation of single led monomer frame in the utility model
Fig. 4 is the left view of single led monomer frame in the utility model
Among the figure: rack body 1; LED monomer frame 2; Anodal conductive pin 21(22,24); Anodal stiff end 211(221,241); Bonding wire platform 212(222,232,242); Accommodating groove 243; Negative pole conductive pin 23; Negative pole stiff end 231.
[embodiment]
The utility model will be further described below in conjunction with drawings and Examples.
Referring to figs. 1 through shown in Figure 4, the full-color supporting structure of LED of the improvement that the utility model discloses, it comprises rack body 1, described rack body 1 is provided with a plurality of hollow-out parts 3, in each hollow-out parts 3, be formed with one red wafer can be installed, the LED monomer frame 2 of yellow wafer and blue wafer, described rack body 1 has a plurality of LED monomer framves 2,10 LED monomer framves 2 for example, each LED monomer frame 2 comprises and described rack body 1 an integrated negative pole conductive pin 23 and three anodal conductive pins 21,22,24, namely set firmly four conductive pins at rack body 1, described negative pole conductive pin 23 have one with described red wafer, the negative pole link of the connection of yellow wafer and blue wafer and one and the negative pole stiff end 231 that connects as one of described rack body 1, described three anodal conductive pins 21,22,24 have respectively one with the anode connection terminal that is connected of described red wafer or yellow wafer or blue wafer and one and the anodal stiff end 211 that links into an integrated entity of described rack body, 221,241.
Or with reference to shown in Figure 3, the negative pole link of described negative pole conductive pin 23 and three anodal conductive pins 21,22,24 anode connection terminal forms respectively a bonding wire platform 212 protruding upward through bending, 222,232,242, wherein bonding wire platform 232 surface areas of negative pole conductive pin 23 are larger, other three anodal conductive pins 21,22,24 bonding wire platform 212,222,242 surface areas are less, and these three anodal conductive pins 21,22,24 bonding wire platform 212,222,242 be distributed in respectively negative pole conductive pin 23 bonding wire platform 232 around, better, bonding wire platform 232 upper surfaces of negative pole conductive pin 23 and three anodal conductive pins 21,22,24 bonding wire platform 212,222,242 upper surfaces are positioned at same plane (being defined as the first plane), the negative pole stiff end 231 of negative pole conductive pin 23 and three anodal conductive pins 21,22,24 anodal stiff end 211,221,241 are positioned at same plane (being defined as the second plane), and the first plane is higher than the first plane and forms bonding wire platform 212 protruding upward with this, 222,232,242; In addition, the upper surface of the bonding wire platform 232 of described negative pole conductive pin 23 is recessed to form an accommodating groove 233 that can hold red wafer, yellow wafer and three wafers of blue wafer downwards, the negative pole link that is negative pole conductive pin 23 forms a Lam-cup structure, better, described accommodating groove 233 is bowl structure, be used for red wafer, yellow wafer and three wafers of blue wafer are installed, in addition, described LED monomer frame 2 is " protruding " type (referring to Fig. 4) from the side.
The utility model led support is one-body molded by cold punching technology, and the surface of rack body 1 and LED monomer frame 2 has silver coating; During concrete the application, the red wafer of accommodating groove 243 interior installations (electric connection), yellow wafer and three wafers of blue wafer at the negative pole link of negative pole conductive pin 23, again bonding wire platform 212,222 corresponding on described three anodal conductive pins 21,22,24,242 is electrically connected with described red wafer, yellow wafer and blue wafer respectively by gold thread, with this three wafers are formed and independently drive the loop, at last by packing colloid (epoxy resin) integral type encapsulated moulding.
To sum up, the utility model is with red, green, blue three primary colors wafer integrates, soon red, green, blue three primary colors wafer is electrically connected on the negative pole conductive pin 23 simultaneously, again with three anodal pins of correspondence respectively with red, green, blue three primary colors wafer is connected to form and independently drives separately the loop, realize the epoxy resin integrative packaging by epoxy encapsulation again, thereby the impact of LED colloid expanded by heating is greatly reduced, promoted the LED waterproof, moistureproof, the resisting temperature impact property, so that the light source of this led support can be applicable to use in the outdoor rugged environment, has good waterproof, moisture effect.
Described above only is preferred embodiment of the present utility model, and above-mentioned specific embodiment is not to restriction of the present utility model.In technological thought category of the present utility model, various distortion and modification can appear, and the retouching that all those of ordinary skill in the art make according to above description, revise or be equal to replacement, all belong to the scope that the utility model is protected.

Claims (5)

1. the full-color supporting structure of the LED of an improvement, it comprises rack body, described rack body is provided with a plurality of hollow-out parts, in each hollow-out parts, be formed with one red wafer can be installed, the LED monomer frame of yellow wafer and blue wafer, it is characterized in that: described LED monomer frame comprises and the integrated negative pole conductive pin of rack body and three anodal conductive pins, described negative pole conductive pin has one and is used for and described red wafer, the negative pole link that yellow wafer and blue wafer connect and one and the negative pole stiff end that connects as one of described rack body, described three anodal conductive pins have respectively an anode connection terminal that is connected with described red wafer or yellow wafer or blue wafer and one and the anodal stiff end that links into an integrated entity of described rack body;
The negative pole link of described negative pole conductive pin and the anode connection terminal of three anodal conductive pins form respectively a bonding wire platform protruding upward through bending, and the upper surface of the bonding wire platform of described negative pole conductive pin is recessed to form an accommodating groove that can hold red wafer, yellow wafer and three wafers of blue wafer downwards.
2. the full-color supporting structure of the LED of improvement according to claim 1 is characterized in that: bonding wire platform corresponding on described three anodal conductive pins is electrically connected with described red wafer, yellow wafer and blue wafer respectively by gold thread.
3. the full-color supporting structure of the LED of improvement according to claim 1, it is characterized in that: described LED monomer frame is " protruding " type structure.
4. the full-color supporting structure of the LED of improvement according to claim 1, it is characterized in that: described accommodating groove is bowl structure.
5. the full-color supporting structure of the LED of improvement according to claim 1, it is characterized in that: described rack body and LED monomer seating face have silver coating.
CN 201220310578 2012-06-29 2012-06-29 Improved LED full-color support structure Expired - Fee Related CN202758928U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220310578 CN202758928U (en) 2012-06-29 2012-06-29 Improved LED full-color support structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220310578 CN202758928U (en) 2012-06-29 2012-06-29 Improved LED full-color support structure

Publications (1)

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CN202758928U true CN202758928U (en) 2013-02-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107726062A (en) * 2017-11-17 2018-02-23 江门劳士国际电气有限公司 A kind of direct insertion LED

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107726062A (en) * 2017-11-17 2018-02-23 江门劳士国际电气有限公司 A kind of direct insertion LED

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160511

Address after: 629000 South Road, airport, Suining economic and Technological Development Zone, Suining, Sichuan

Patentee after: Innoquick Electronics Technology Co., Ltd.

Address before: Tak Road 629000 in Sichuan province Suining City Economic Development Zone

Patentee before: Sichuan Bonshine Optical Electron Technology Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130227

Termination date: 20170629

CF01 Termination of patent right due to non-payment of annual fee