CN202719576U - System for quick heat dissipation of light emitting diode (LED) lamp - Google Patents
System for quick heat dissipation of light emitting diode (LED) lamp Download PDFInfo
- Publication number
- CN202719576U CN202719576U CN2012203881888U CN201220388188U CN202719576U CN 202719576 U CN202719576 U CN 202719576U CN 2012203881888 U CN2012203881888 U CN 2012203881888U CN 201220388188 U CN201220388188 U CN 201220388188U CN 202719576 U CN202719576 U CN 202719576U
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- Prior art keywords
- heating column
- led
- substrate
- quick heat
- lamp
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a system for quick heat dissipation of a light emitting diode (LED) lamp. The system comprises a mounting seat, wherein an LED chip is arranged on the mounting seat, and a heat conduction column is arranged on one end, far from the LED chip, of the mounting seat. The heat conduction column is connected with a heat dissipation sheet, and a semi-circular pervious hood is connected with the heat conduction column. The LED chip is arranged in the pervious hood. The system is simple in structure, and heat generated from the chip can be effectively emitted out through close contact of the heat dissipation sheet, and safety of internal elements is guaranteed. The service life of the LED lamp is prolonged, and use cost is reduced.
Description
Technical field
The utility model relates to system, especially relates to for the system that the LED lamp is carried out quick heat radiating.
Background technology
Semiconductor wafer is comprised of two parts, and a part is P-type semiconductor, occupies an leading position in its hole, the inside, and the other end is N-type semiconductor, mainly is electronics here.But when these two kinds of semiconductors couple together, just form a P-N knot between them.When electric current acted on this wafer by wire, electronics will be pushed to the P district, and then electronics will send energy with the form of photon, the luminous principle of LED that Here it is with hole-recombination in the P district.The basic structure of LED is an electroluminescent semi-conducting material, places on the leaded shelf, then uses epoxy sealing all around, plays the effect of protection internal core, so the anti-seismic performance of LED is good.One end of wafer is attached on the support, and an end is negative pole, and the other end connects the positive pole of power supply, makes whole wafer by epoxy encapsulation.The LED fluorescent lamp is take of fine quality, durable, energy-conservation as main feature, and the crevice projection angle adjustable range is large, and the brightness of 15W is equivalent to common 40W fluorescent lamp.High temperature resistance, moistureproof and waterproof, anticreep.Use voltage has: 110V, 220V are optional, the optional glass of outer cover or PC material.Lamp holder is the same with common fluorescent lamp.
The LED fluorescent lamp adopts up-to-date led light source technology, and digitisation appearance design, economize on electricity are up to more than 70%, and the LED fluorescent lamp light intensity of 12W is equivalent to the fluorescent tube (be used for ballast and starter, the real power consumption of the fluorescent lamp of 36W is 42W to 44W) of 40W.The LED fluorescent lifetime is more than 10 times of common fluorescent tube, and is almost non-maintaining, need not often change fluorescent tube, ballast, starter.The semi-conductor electricity light source of environmental protection, light is soft, and spectroscopic pure is conducive to user's sight protectio and healthy.The cold light source of 6000K is to visually refrigerant impression of people, and the differences of illumination intensities design of hommization more helps to concentrate on, raising the efficiency, when the LED lamp carries out work, mainly is to be luminous energy with electric energy conversion, the portion of energy heating is wherein arranged, during long-term the use, easily produce high temperature, distributing of heat is untimely, other elements are caused damage, traditional cooling system is because its radiator structure is unstable, and heat is inhomogeneous, causes electric elements unstable.
The utility model content
The purpose of this utility model is to overcome the shortcoming and defect of above-mentioned prior art, be provided for the LED lamp is carried out the system of quick heat radiating, this system architecture is simple, the close contact of fin, the dissipation of heat that can effectively chip be produced is gone out, guarantee the safety of inner member, prolonged the service life of LED lamp, reduced use cost.
The purpose of this utility model is achieved through the following technical solutions: the system that is used for the LED lamp is carried out quick heat radiating, comprise mount pad, be provided with led chip on the described mount pad, mount pad is provided with heating column away from an end of led chip, heating column is connected with fin, heating column is connected with the diffuser of semicircular in shape, and led chip is arranged on diffuser inside.
Further, described heating column is connected with gripper shoe, and after heating column passed gripper shoe, its two ends were arranged on the outside of gripper shoe, the Surface Contact of diffuser and gripper shoe.
Further, be provided with substrate between described heating column and the fin, and substrate is connected with fin with heating column respectively.
Further, be provided with groove on the described fin, the bottom of substrate is arranged in the groove, and contacts with the inside of groove.
Further, adopt heat-conducting glue to connect between described substrate and the heating column, and heat-conducting glue is connected respectively with heating column with substrate.
Further, described substrate adopts aluminum to make.
In sum, the beneficial effects of the utility model are: this system architecture is simple, the close contact of fin, and the dissipation of heat that can effectively chip be produced is gone out, and has guaranteed the safety of inner member, has prolonged the service life of LED lamp, has reduced use cost.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Mark and corresponding parts title in the accompanying drawing: 1-diffuser; 2-led chip; 3-mount pad; 4-heating column; 5-heat-conducting glue; 6-fin; 7-groove; 8-substrate; 9-gripper shoe.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but embodiment of the present utility model is not limited only to this.
Embodiment:
As shown in Figure 1, be used for the LED lamp is carried out the system of quick heat radiating, comprise mount pad 3, be provided with led chip 2 on the described mount pad 3, mount pad 3 is provided with heating column 4 away from an end of led chip 2, heating column 4 is connected with fin 6, and heating column 4 is connected with the diffuser 1 of semicircular in shape, and led chip 2 is arranged on diffuser 1 inside.After led chip 2 energisings, emit light and heat, light distributes by diffuser 1, and heat absorbs by heating column 4 and transmits.
Described heating column 4 is connected with gripper shoe 9, and after heating column 4 passed gripper shoe 9, its two ends were arranged on the outside of gripper shoe 9, the Surface Contact of diffuser 1 and gripper shoe 9.Gripper shoe 9 plays a part fixed support.
Be provided with substrate 8 between described heating column 4 and the fin 6, and substrate 8 is connected with fin with heating column 4 respectively and is connected.Substrate 8 is accelerated the efficient that heat transmits as the heat referral of heating column 4.
Be provided with groove 7 on the described fin 6, the bottom of substrate 8 is arranged in the groove 7, and contacts with the inside of groove 7.Substrate 8 is arranged in the groove 7, can be so that the contact area of substrate 8 and fin 6 increase, and radiating efficiency is higher.
Adopt heat-conducting glue 5 to connect between described substrate 8 and the heating column 4, and heat-conducting glue 5 is connected respectively and is connected with heating column with substrate 8.Heat-conducting glue 5 not only can fixing base and heating column 4, substrate 8 and heating column 4 is connected to overall structure, and can with the heat transmission, so that the heat on the heating column 4 can transmit fast continuously and stably, the dissipation of heat on the heating column 4 be gone out.
Described substrate 8 adopts aluminum to make.The thermal conductivity of aluminum is good, and substrate 8 adopts aluminum, can fast the heat that absorbs at heating column 4 be delivered in the fin 6, guarantees that the temperature of whole system can fast reducing.
Take aforesaid way, just can realize preferably the utility model.
Claims (6)
1. be used for the LED lamp is carried out the system of quick heat radiating, it is characterized in that: comprise mount pad (3), be provided with led chip (2) on the described mount pad (3), mount pad (3) is provided with heating column (4) away from an end of led chip (2), heating column (4) is connected with fin (6), heating column (4) is connected with the diffuser (1) of semicircular in shape, and led chip (2) is arranged on diffuser (1) inside.
2. the system for the LED lamp being carried out quick heat radiating according to claim 1, it is characterized in that: described heating column (4) is connected with gripper shoe (9), and after heating column (4) passes gripper shoe (9), its two ends are arranged on the outside of gripper shoe (9), the Surface Contact of diffuser (1) and gripper shoe (9).
3. the system for the LED lamp being carried out quick heat radiating according to claim 2 is characterized in that: be provided with substrate (8) between described heating column (4) and the fin (6), and substrate (8) is connected 6 with heating column (4) with fin respectively) be connected.
4. the system for the LED lamp being carried out quick heat radiating according to claim 3, it is characterized in that: be provided with groove (7) on the described fin (6), the bottom of substrate (8) is arranged in the groove (7), and contacts with the inside of groove (7).
5. the system for the LED lamp being carried out quick heat radiating according to claim 3, it is characterized in that: adopt heat-conducting glue (5) to connect between described substrate (8) and the heating column (4), and heat-conducting glue (5) is connected 4 with substrate (8) with heating column respectively) be connected.
6. the system for the LED lamp being carried out quick heat radiating according to claim 3 is characterized in that: described substrate (8) adopts aluminum to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203881888U CN202719576U (en) | 2012-08-07 | 2012-08-07 | System for quick heat dissipation of light emitting diode (LED) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203881888U CN202719576U (en) | 2012-08-07 | 2012-08-07 | System for quick heat dissipation of light emitting diode (LED) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202719576U true CN202719576U (en) | 2013-02-06 |
Family
ID=47621399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012203881888U Expired - Fee Related CN202719576U (en) | 2012-08-07 | 2012-08-07 | System for quick heat dissipation of light emitting diode (LED) lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202719576U (en) |
-
2012
- 2012-08-07 CN CN2012203881888U patent/CN202719576U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130206 Termination date: 20130807 |