CN202679902U - Electronic component installation apparatus - Google Patents
Electronic component installation apparatus Download PDFInfo
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- CN202679902U CN202679902U CN 201220257523 CN201220257523U CN202679902U CN 202679902 U CN202679902 U CN 202679902U CN 201220257523 CN201220257523 CN 201220257523 CN 201220257523 U CN201220257523 U CN 201220257523U CN 202679902 U CN202679902 U CN 202679902U
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Abstract
Provided is an electronic component installation apparatus, capable of detecting the connecting state of the substrates before the installation operation and automatically correcting and removing the connection state of the substrates. If a sensor (SC) detects that a front substrate (3A) and a subsequent substrate (3B) are located at a state below the predetermined interval upon a delivering conveyor (2A), the front substrate (3A) is sent to an installation conveyor (2B), with the subsequent substrate (3B) waiting upon the delivering conveyor (2A), thereby removing the substrate connection. In other words, the moving distance (d1) required for transferring the substrate (3A) from the delivering conveyor (2A) to the installation conveyor (2B) is utilized for driving the delivering conveyor (2A), thereby making the substrate (3A) be transferred to the installation conveyor (2B). Then, the subsequent substrate (3B) is made to stay at the delivering conveyor (2A) by stopping the driving of the delivering conveyor (2A).
Description
Technical field
The utility model relate to a kind of on substrate the electronic component mounting apparatus of mounting electronic parts.
Background technology
The electronic component mounting apparatus of mounting electronic parts has the installation conveyer on substrate, and this installation conveyer transmits and positioning baseplate to the installation exercise position that keeps electronic unit to be installed on the component mounter structure of substrate by mounting head.Be fed to the installation conveyer from the conveyer of sending into of the electronic unit of the upstream side device handing-over upstream side by being configured in mounting head.On the electronic unit hookup wire that consists of at such connecting electronic apparatus for mounting component, the substrate of manipulating object is transmitted respectively, and regularly is sent to one by one the installation conveyer of each electronic component mounting apparatus according to the Job execution in this device.
At this moment, can produce following phenomenon owing to transmitting the various main causes such as mistake of action control: can not normally guarantee the mutual interval of a plurality of substrates of transmitting in turn, thereby follow-up substrate approaches excessively followed by the substrate of going ahead of the rest and becomes the substrate connection status.If producing such substrate connects, then be created in normal execution unit installation exercise state infrabasal plate be sent to after the unfavorable condition of operation, therefore known have an in the past electronic component mounting apparatus (referring to Patent Document 1) of the function that connects of such substrate of automatic detection.In the prior art shown in this patent documentation example, the substrate of the substrate standby after installation exercise is finished is sent in the standby operation, detects the townhouse transducer by substrate and detects the situation that a plurality of substrates connect transmission.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2004-71892 communique
But the detection that connects owing to substrate in above-mentioned prior art regularly has following unfavorable condition.That is, in the prior art, because the substrate after installation exercise finished as detected object, can not detect the substrate connection status that produces at the installation conveyer of carrying out installation exercise.Therefore, in the next result who measuring ability occurs can not useful effect of the situation of wanting to detect the not installation base plate that does not carry out installation exercise in advance.In addition, in the prior art, just detect the substrate connection status, therefore also need the disposal of operator's manual working in order to correct and remove the substrate connection status, do not alleviate the countermeasure of operator's homework burden.
The utility model content
Therefore, the purpose of this utility model is to provide a kind of electronic component mounting apparatus, detects the substrate connection status before installation exercise, and can automatically carry out correction and the releasing of substrate connection status.
The technical solution of the utility model 1 relates to a kind of electronic component mounting apparatus, take out electronic unit and be installed on substrate from the parts supply unit, above-mentioned electronic component mounting apparatus is characterised in that, have: the component mounter structure keeps above-mentioned electronic unit to transfer by mounting head and is assembled to aforesaid substrate; Conveyer is installed, aforesaid substrate is sent to the installation exercise position of above-mentioned component mounter structure; Send into conveyer, adjacent with the upstream side of above-mentioned installation conveyer and configure, transmit the aforesaid substrate that receives from the upstream side device and be sent to above-mentioned installation conveyer, and make and wait for the substrate standby of sending into; Substrate connects detecting unit, detects at the above-mentioned substrate of sending into conveyer approaching state below none substrate being arranged and follow-up other substrates being in predetermined space to be connected; And the unit is removed in connection, if detecting aforesaid substrate connects, conveyer is installed and is made above-mentioned other substrates send into standby on the conveyer by only an above-mentioned substrate being sent to, thereby removing aforesaid substrate connects, thereby above-mentioned connection is removed the unit and only is transported to and the required transhipment displacement of conveyer is installed drives and send into conveyer and make this substrate be transported to the installation conveyer from sending into conveyer with an above-mentioned substrate, then by stopping to send into the driving of conveyer, other follow-up substrates are rested on send on the conveyer.
According to the utility model, if detecting at the state of sending into conveyer in advance and follow-up substrate approaches below being in predetermined space is that substrate connects, then conveyer is installed and is made follow-up substrate send into standby on the conveyer by only the substrate of going ahead of the rest being sent to, connect thereby remove aforesaid substrate.Namely, thereby only be transported to and the required transhipment displacement of conveyer is installed drives and send into conveyer and make this substrate be transported to the installation conveyer from sending into conveyer with the substrate of going ahead of the rest, then by the driving that stops to send into conveyer follow-up substrate being rested on sends on the conveyer, before installation exercise, detect thus the substrate connection status, and can automatically carry out correction and the releasing of substrate connection status.
Description of drawings
Fig. 1 is the vertical view of the electronic component mounting apparatus of an execution mode of the present utility model.
Fig. 2 is the structure key diagram of substrate transfer mechanism of the electronic component mounting apparatus of an execution mode of the present utility model.
Fig. 3 represents the block diagram of structure of control system of the electronic component mounting apparatus of an execution mode of the present utility model.
Fig. 4 (a) ~ 4 (c) is the specification figure of the substrate convey method in the electronic component mounting apparatus of an execution mode of the present utility model.
Fig. 5 (a) ~ 5 (c) is the specification figure of the substrate convey method in the electronic component mounting apparatus of an execution mode of the present utility model.
Fig. 6 (a) ~ 6 (c) is the specification figure of the substrate convey method in the electronic component mounting apparatus of an execution mode of the present utility model.
Embodiment
Next with reference to description of drawings execution mode of the present utility model.At first take out the electronic unit such as semiconductor chip with reference to Fig. 1 explanation from the parts supply unit and be installed on the structure of the electronic component mounting apparatus 1 of substrate.In Fig. 1, dispose substrate transfer mechanism 2 in the central authorities of pedestal 1a along directions X (substrate direction of transfer), substrate transfer mechanism 2 constitutes successively configuration and sends into conveyer 2A, conveyer 2B is installed, sends the monomer conveyer of conveyer 2C.
The conveyer 2A that sends into that is arranged in upstream side (figure left side) has to be sent to from the substrate 3 that the upstream side device receives and conveyer 2B is installed and makes the function of waiting for substrate 3 standbies of sending into.Conveyer 2B is installed to have and will be sent to the function of the installation exercise position of component mounter structure described later from the substrate 3 of sending into conveyer 2A reception.In addition, sending conveyer 2C has from conveyer 2B is installed and is received in the installation exercise position and finishes substrate 3 behind the parts installation exercise and the function sent of side device downstream.
Two sides in substrate transfer mechanism 2 dispose parts supply unit 4, and are set side by side with a plurality of tape feeders 5 at each parts supply unit 4.Tape feeder 5 is carried the conveyer belt of holding member by the interval, thus parts are supplied to the take-off location of mounting head of the component mounter structure of following explanation.
Dispose Y- axis platform 6A, 6B at the both ends of pedestal 1a upper surface, and be provided with two X-axis platform 7A, 7B Y- axis platform 6A, 6B are added.By driving Y-axis platform 6A, X-axis platform 7A moves horizontally along Y-direction, and by driving Y-axis platform 6B, X-axis platform 7B moves horizontally along Y-direction.Be separately installed with the mounting head 8 of the multi-type that is consisted of by a plurality of handover assembly head 8a of units and the substrate identification camera 9 that moves with mounting head 8 one at X-axis platform 7A, 7B.
Thereby move horizontally by Y-axis platform 6A, X-axis platform 7A, Y-axis platform 6B, X-axis platform 7B being made up respectively drive mounting head 8, the suction nozzle (not shown) of transferring assembly head 8a by the unit of being installed on picks up electronic unit from each parts supply unit 4, is installed on the substrate 3 that is located in substrate transfer mechanism 2.Y-axis platform 6A, X-axis platform 7A, Y-axis platform 6B, X-axis platform 7B and mounting head 8 constitute by mounting head 8 and keep electronic unit to transfer the component mounter structure 13 (with reference to Fig. 3) that is assembled to substrate 3.
Take and identification substrate 3 at substrate 3 mobile substrate identification cameras 9 with mounting head 8.In addition, 2 path disposes component identification camera 10 from parts supply unit 4 to substrate transfer mechanism.When the mounting head 8 of having taken out electronic unit from parts supply unit 4 moves to the substrate 3 that is located in erecting bed, by the electronic unit that is kept by suction nozzle is moved along directions X above component identification camera 10, component identification camera 10 is taken and is mounted 8 parts that keep.
And, by recognition device (not shown) shooting results is carried out identifying processing, be in the position that is mounted the parts in 8 state that keep and the kind that identifies parts thereby identify.Suction nozzle maintaining part 11 is held the suction nozzle of a plurality of kinds with predetermined gesture, enter suction nozzle maintaining part 11 by mounting head 8 and carry out the suction nozzle switching motion, thereby in mounting head 8 with corresponding and carry out the suction nozzle exchange as the kind of the parts of object.
With reference to the structure of sending into conveyer 2A, installation conveyer 2B in following respectively figure explanation substrate transfer mechanism 2 and from sending into conveyer 2A to the substrate convey method that conveyer 2B transmission substrate is installed.As shown in Figure 2, send into conveyer 2A, a pair of transmission track 21A, 21B that conveyer 2B has respectively configured in parallel are installed, and dispose conveyer 22 in the inner face side of transmission track 21A, 21B along the substrate direction of transfer.The a pair of belt wheel 26 that conveyer 22 configures at the both ends of transmission track 21A, 21B sets up conveyer belt, and the driving pulley 25 driven and round movements of installing via each conveyor drive motor 23A, 23B.Thus, the substrate 3 that supports both ends by conveyer 22 is transmitted along transmission track 21A, 21B.
Be set with the installation exercise position of component mounter structure 13 at installation conveyer 2B, in this installation exercise position configuration substrate base support portion 27 arranged.Substrate base support portion 27 constitutes by the end supporting member 29 of elevating mechanism 28 liftings driving from lower face side supporting substrate 3.If the substrate of mounting object 3 is sent to the installation exercise position, then end supporting member 29 rises by elevating mechanism 28, from the lower surface of following supporting substrate 3.
Illustrate and send into conveyer 2A, the transducer that substrate that conveyer 2B configures detects usefulness is installed.Dispose successively transducer SA, SB, SC, SD from upstream side sending into conveyer 2A, and conveyer 2B is installed disposes transducer SE, SF, SG, SH from upstream side equally.As the kind of transducer as used herein, so long as can detect the transducer that has or not substrate in the precalculated position, no matter be to detect optical axis detects substrate surface along the vertical direction configuration mode, still detecting optical axis detects substrate side surfaces along horizontal direction configuration mode all can, and as the optical detection mode, Sun-shading type, reflection-type all can.
At first, the function of sending into these transducers among the conveyer 2A is described.The transducer SA that upstream extremity configures detects and is fed to the substrate 3 of sending into conveyer 2A.In addition, the transducer SD that configures of downstream detects the situation that substrate 3 has arrived the downstream of sending into conveyer 2A.Transducer SB, SC are in the present embodiment for detection of to have or not substrate 3 in advance be that substrate is connected with state approaching below follow-up other substrates 3 are in predetermined space sending into conveyer 2A.
Namely, at the leading section of a substrate 3 of going ahead of the rest by the detected timing of transducer SD, if be positioned at from transducer SD upstream side separate the transducer that substrate greater than the interval of the length of this substrate 3 detects usefulness and detect substrate, then be judged as: detected substrate is not substrate 3, but is in and substrate 3 other follow-up substrates 3 with state approaching below the predetermined space in advance.At this, transducer SB, transducer SC are respectively applied to distinguish corresponding situation with large substrate, the small-sized substrate of substrate 3 in the substrate length classification benchmark of predesignating as object.
In the present embodiment transducer SC, transducer SB with respectively from transducer SD upstream the side mode that only separates above-mentioned connection acknowledgement interval D1, D2 configure.At this, connect acknowledgement interval D 1, D2 based on setting as the substrate length of the substrate 3 of object, connect acknowledgement interval D1 and be set as length greater than small-sized substrate, and connect acknowledgement interval D2 and be set as length greater than large substrate.
By setting such connection acknowledgement interval D1, D2, in the situation that substrate 3 normal separately transmission detect the timing of the leading section of substrate 3 at transducer SD, transducer SC, transducer SB do not detect substrate, are judged as thus without substrate to connect in advance.In contrast, in the situation that the state that the substrate 3 of going ahead of the rest and follow-up substrate 3 approach below with predetermined space is transmitted, detect the timing of the leading section of substrate 3 in advance at transducer SD, transducer SC, transducer SB detect follow-up substrate 3, are judged as thus to be in the substrate connection status.
That is, transducer SD becomes in the first substrate detecting sensor of sending into a conveyer 2A detection substrate 3 in advance.In addition, transducer SB, transducer SC become: with from this first substrate detecting sensor upstream side only separate based on as the substrate length of the substrate 3 of object and the second substrate detecting sensor that the mode of the connection acknowledgement interval D1, the D2 that set configures.And, detect in the first substrate detecting sensor under the state of a substrate 3 in advance, have or not other follow-up substrates 3 by the detection of second substrate detecting sensor, connect thereby detect substrate.
Next the function of the transducer among the conveyer 2B is installed in explanation.The transducer SE that upstream extremity configures detects and is fed to the substrate 3 that conveyer 2B is installed.In addition, the transducer SH that configures of downstream detects as the substrate 3 after the mounting object and has arrived the situation that the downstream of conveyer 2B is installed.Transducer SF, SG detect the substrate 3 that is sent to the installation exercise position.At this, the leading section by transducer SF detects substrate 3 navigates to the installation exercise position with substrate 3.In addition, it is arbitrarily that the configuration that substrate among the conveyer 2B detects the transducer of usefulness is installed, also can be corresponding with locate mode and suitably append or omit transducer.
Next the structure of the control system of electronic component mounting apparatus 1 is described with reference to Fig. 3.In addition, only be defined as Fig. 1, structure shown in Figure 2 in the scope of this explanation, record and narrate as main body with transmit the related content of action from sending into conveyer 2A to the substrate that conveyer 2B is installed.In Fig. 3, control part 30 is for having the arithmetic processing section of cpu function, based on various programs and the data that storage part 31 is stored, and the each several part of control electronic component mounting apparatus 1 and carry out operation action and the calculation process of installing for parts.At this, control part 30 comprises that the substrate as the inter-process function with discrete function connects the Check processing 30a of section, transhipment displacement operational part 30b, connects and remove handling part 30c, and storage part 31 stores substrate length data 31a, transfer rate data 31b for these calculation process.Substrate length data 31a is for representing the data as the length of the substrate 3 of manipulating object according to each substrate kind, transfer rate data 31b sends into conveyer 2A, the data of the substrate transfer rate among the conveyer 2B are installed for expression.
It is that substrate testing result and the second substrate detecting sensor of transducer SD is the substrate testing result of transducer SB or transducer SC based on sending into first substrate detecting sensor that conveyer 2A configures that substrate connects the Check processing 30a of section, checks the processing that aforesaid substrate connects.Connect in the situation that detect aforesaid substrate, in order to remove this substrate connection status, the substrate length data 31a that transhipment displacement operational part 30b stores based on storage part 31 carries out the processing of computing displacement, this displacement is for being in a substrate of going ahead of the rest 3 that detects the state of leading section by transducer SD and being transported to the required transhipment displacement of conveyer 2B is installed from sending into conveyer 2A sending into conveyer 2A, i.e. the required displacement of movement that only can transmit the state of this substrate 3 by the conveyer 22 that conveyer 2B is installed until install that the actuating force of the conveyer 22 of conveyer 2B catches substrate 3 conscientiously.
Connect in the situation that detect aforesaid substrate, connect releasing handling part 30c and only send into conveyer 2A with above-mentioned transhipment displacement driving, a substrate 3 only will going ahead of the rest is sent to installs conveyer 2B, and make other follow-up substrates 3 send into standby on the conveyer 2A, carry out thus the control processing that connects for removing substrate.In addition, show transhipment displacement operational part 30b comes computing transhipment displacement based on substrate length example at this, but also can substrate length data 31a and transhipment displacement is pre-stored in storage part 31 as substrate data.
Mechanism's drive division 32 is controlled by control part 30, thereby drives sending into conveyer 2A, conveyer 2B being installed of component parts installing mechanism 13, substrate transfer mechanism 2.Thus, be performed with substrate transmission action, the parts installation action of substrate 3 as object.The shooting results of identifying processing section 33 pairs of substrate identification camera 9, component identification camera 10 carries out identifying processing.Thus, be sent to the installation exercise position that conveyer 2B is installed substrate 3 location recognition and be mounted a location recognition of 8 electronic units that keep.Recognition result is communicated to control part 30, when control part 30 control assembly installing mechanism 13, carries out position correction with reference to this recognition result.Substrate test section 34 detects the processing that has or not substrate 3 in the precalculated position of sending into conveyer 2A, installation conveyer 2B based on the output of each transducer of transducer SA ~ SH.The substrate of the substrate connection Check processing 30a of section connects detection to carry out based on the substrate testing result of substrate test section 34.
In said structure, transducer SD, transducer SB or transducer SC, substrate test section 34 and substrate connect the Check processing 30a of section and constitute substrate and connect detecting unit, detect sending into conveyer 2A to have or not substrate 3 in advance to be connected with the substrate near state below follow-up other substrates 3 are in predetermined space.That is, this substrate connects detecting unit and comprises: be transducer SD in the first substrate detecting sensor of sending into conveyer 2A and detect a substrate 3 in advance; And with from transducer SD upstream side only separate the substrate length of the substrate length data 31a that is stored based on storage part 31 and second substrate detecting sensor (transducer SB or transducer SC) that the mode of the connection acknowledgement interval (D1 or D2) set configures, substrate connects the Check processing 30a of section and detects under the state of a substrate 3 in the first substrate detecting sensor in advance, have or not other follow-up substrates by the detection of second substrate detecting sensor, connect thereby can detect substrate.
In addition, connect to remove handling part 30c and send into conveyer 2A, conveyer 2B is installed constitutes to connect and remove the unit, if detecting substrate connects, then this connection releasing unit is sent to by a substrate 3 only will going ahead of the rest and conveyer 2B is installed and makes other follow-up substrates 3 send into standby on the conveyer 2A, connects thereby remove substrate.And, this substrate lifting unit only is transported to and the required transhipment displacement of conveyer 2B is installed drives and send into conveyer 2A from sending into conveyer 2A with the substrate 3 of going ahead of the rest, this substrate of going ahead of the rest 3 is transported to conveyer 2B is installed, send on the conveyer 2A thereby then by the driving that stops to send into conveyer 2A other follow-up substrates 3 are rested on.
Next with reference to Fig. 4 (a) ~ 4 (c), Fig. 5 (a) ~ 5 (c) concrete instance that substrate is sent to the substrate convey method that conveyer 2B is installed in electronic component mounting apparatus 1 from sending into conveyer 2A is described.At this, a substrate 3 of going ahead of the rest is designated as substrate 3A, other follow-up substrates 3 are designated as substrate 3B, thereby distinguish both.In addition, conveyor drive motor 23A, 23B among the conveyer 2B and the expression of conveyer 22 in Fig. 4 (a) ~ 4 (c), Fig. 5 (a) ~ 5 (c), have been omitted and have sent into conveyer 2A, installed.
At first, Fig. 4 (a) expression substrate 3A and follow-up substrate 3B in advance is sent to the state of sending into conveyer 2A with the connection status that is not provided with appropriate intervals from upstream side (arrow a).Because connecting, such substrate produces the unfavorable condition that follow-up substrate 3B sends downstream in the installation exercise machine is carried out, therefore must try one's best the stage of morning is detected this state and corrects and remove.Therefore, in the present embodiment, by having or not substrate this position to detect from the transducer SD that downstream was configured that the sends into conveyer 2A transducer SC that upstream side only separates with mode as the substrate length L 1 corresponding connection acknowledgement interval D1 that sets of the substrate 3 of object configures, connect the Check processing 30a of section based on this testing result by substrate and judge and have or not substrate to connect.
Namely, shown in Fig. 4 (b), detect the timing of the leading section of substrate 3A at transducer SD, detect substrate by transducer SC, is connected (substrate connection detection operation) thereby detect at the substrate of sending into the state that conveyer 2A approaches below having or not substrate 3A and follow-up other substrates 3B being in predetermined space.In the example shown here, detect substrate 3B by transducer SC, thereby detect the situation that substrate 3A and substrate 3B are in connection status.
And, connect if detect substrate, send into conveyer 2A, conveyer 2B is installed by connecting releasing handling part 30c control, only substrate 3A is sent to conveyer 2B is installed, and make substrate 3B send into standby on the conveyer 2A, remove thus substrate and connect (connect and remove operation).Namely, in connecting the releasing operation, shown in Fig. 4 (c), only be transported to and the required transhipment displacement d1 of conveyer 2B is installed drives and send into conveyer 2A from sending into conveyer 2A with the substrate 3A of substrate length L 1, thereby this substrate 3A is transported to conveyer 2B (arrow b) is installed.Thus, substrate 3A is in the actuating force of the conveyer 22 by conveyer 2B is installed and the state that can transmit.
Next shown in Fig. 5 (a), thereby the driving that continues to install conveyer 2B is sent to installation exercise position (arrow c) with substrate 3A, and stops to send into the driving of conveyer 2A.Thus, follow-up other substrates 3B rests on and sends on the conveyer 2A.Afterwards, shown in Fig. 5 (b), conveyer 2B transmission substrate 3A (arrow d) is installed, by the detected position of transducer SG the driving that conveyer 2B is installed is stopped at leading section, substrate 3A carries out position alignment with respect to substrate base support portion 27., sending on the conveyer 2A, the position that detects the leading section of substrate 3B at transducer SD stops driving that to send into conveyer 2A thereupon, thereby makes substrate 3B send into standby on the conveyer 2A.And, if finished installation exercise in the installation exercise position, thereby then the substrate 3A of drive installation conveyer 2B after with the end of job downstream side send (arrow e), thereby and drive and send into conveyer 2A and substrate 3B in the standby is transported to conveyer 2B (arrow f) is installed.
Fig. 6 (a) ~ 6 (c) expression is the example of the situation of large substrate as the substrate of object.The substrate 3A that Fig. 6 (a) expression is gone ahead of the rest and follow-up substrate 3B are sent to the state of sending into conveyer 2A with the connection status that is not provided with suitable interval from upstream side.In this case, identical with the example shown in Fig. 4 (a) ~ 4 (c), by with from the transducer SD that downstream was configured that sends into conveyer 2A upstream side only separate the transducer SB that configures with mode as the substrate length L 2 corresponding connection acknowledgement interval D2 that set of the substrate 3 of object, detect in this position and have or not substrate, connect the Check processing 30a of section based on this testing result by substrate and judge and have or not substrate to connect.
Namely, shown in Fig. 6 (b), detect the timing of the leading section of substrate 3A at transducer SD, detect substrate by transducer SB, is connected (substrate connection detection operation) thereby detect at the substrate of sending into the state that conveyer 2A approaches below having or not substrate 3A and follow-up other substrates 3B being in predetermined space.In the example shown here, detect substrate 3B by transducer SB, thereby detect the situation that substrate 3A and substrate 3B are in connection status.
And, connect if detect substrate, then send into conveyer 2A, conveyer 2B is installed by connecting releasing handling part 30c control, only substrate 3A is sent to conveyer 2B is installed, and make substrate 3B send into standby on the conveyer 2A, remove thus substrate and connect (connect and remove operation).Namely, in connecting the releasing operation, shown in Fig. 6 (c), only be transported to and the required transhipment displacement d2 of conveyer 2B is installed drives and send into conveyer 2A from sending into conveyer 2A with the substrate 3A of substrate length L 2, thereby this substrate 3A is transported to conveyer 2B is installed.Thus, substrate 3A is in the actuating force of the conveyer 22 by conveyer 2B is installed and the state that can transmit.After this, identical with the example shown in Fig. 5 (a) ~ 5 (c).
As described above, in the substrate convey method in the electronic component mounting apparatus shown in the present embodiment, sending into conveyer 2A in advance and the substrate of the state that follow-up substrate 3A, 3B approaches below being in predetermined space connects if detect, then only the substrate 3A that goes ahead of the rest is sent to and conveyer 2B is installed and makes follow-up substrate 3B send into conveyer 2A standby, connect thereby remove substrate.Namely, thereby only be transported to and the required transhipment displacement of conveyer 2B is installed drives and send into conveyer 2A and this substrate 3A is transported to conveyer 2B is installed from sending into conveyer 2A with substrate 3A, then by stopping to send into the driving of conveyer 2A, thereby being rested on, follow-up substrate 3B sends into conveyer 2A.Thus, before installation exercise, detect the substrate connection status, and do not need the disposal of operator's manual working, can automatically carry out correction and the releasing of substrate connection status.
Utilizability on the industry
Electronic component mounting apparatus of the present utility model has the effect that detects the substrate connection status and can automatically carry out correction and the releasing of substrate connection status before installation exercise, the electronic unit installing area that is installed on substrate taking out electronic unit from the parts supply unit is useful.
Claims (2)
1. an electronic component mounting apparatus takes out electronic unit and is installed on substrate from the parts supply unit, and above-mentioned electronic component mounting apparatus is characterised in that to have:
The component mounter structure keeps above-mentioned electronic unit to transfer by mounting head and is assembled to aforesaid substrate;
Conveyer is installed, aforesaid substrate is sent to the installation exercise position of above-mentioned component mounter structure;
Send into conveyer, adjacent with the upstream side of above-mentioned installation conveyer and configure, transmit the aforesaid substrate that receives from the upstream side device and be sent to above-mentioned installation conveyer, and make and wait for the substrate standby of sending into;
Substrate connects detecting unit, detects at the above-mentioned substrate of sending into conveyer approaching state below none substrate being arranged and follow-up other substrates being in predetermined space to be connected; And
Connect and remove the unit, connect if detect aforesaid substrate, conveyer is installed and is made above-mentioned other substrates send into standby on the conveyer by only an above-mentioned substrate being sent to, connect thereby remove aforesaid substrate,
Thereby above-mentioned connection is removed the unit and only is transported to and the required transhipment displacement of conveyer is installed drives and send into conveyer and make this substrate be transported to the installation conveyer from sending into conveyer with an above-mentioned substrate, then by stopping to send into the driving of conveyer, other follow-up substrates are rested on send on the conveyer.
2. electronic component mounting apparatus according to claim 1 is characterized in that, aforesaid substrate connects detecting unit and is included in the above-mentioned first substrate detecting sensor that detects an above-mentioned substrate on the conveyer of sending into; Be connected from this first substrate detecting sensor upstream side only separate the second substrate detecting sensor that the mode of the connection acknowledgement interval of setting based on aforesaid substrate length configures, detect under the state of a substrate in above-mentioned first substrate detecting sensor, have or not above-mentioned other substrates by above-mentioned second substrate detecting sensor detection, connect thereby detect aforesaid substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011123122A JP2012253113A (en) | 2011-06-01 | 2011-06-01 | Electronic part mounting device and board feeding method for electronic part mounting device |
| JP2011-123122 | 2011-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202679902U true CN202679902U (en) | 2013-01-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220257523 Expired - Fee Related CN202679902U (en) | 2011-06-01 | 2012-06-01 | Electronic component installation apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2012253113A (en) |
| CN (1) | CN202679902U (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4109034B2 (en) * | 2002-08-07 | 2008-06-25 | 松下電器産業株式会社 | Board transfer device for component mounter |
| JP5059362B2 (en) * | 2006-09-01 | 2012-10-24 | Ｊｕｋｉ株式会社 | Component mounting equipment |
-
2011
- 2011-06-01 JP JP2011123122A patent/JP2012253113A/en active Pending
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2012
- 2012-06-01 CN CN 201220257523 patent/CN202679902U/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| JP2012253113A (en) | 2012-12-20 |
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