CN202678715U - Semiconductor laser liquid refrigerating apparatus - Google Patents
Semiconductor laser liquid refrigerating apparatus Download PDFInfo
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- CN202678715U CN202678715U CN 201220151234 CN201220151234U CN202678715U CN 202678715 U CN202678715 U CN 202678715U CN 201220151234 CN201220151234 CN 201220151234 CN 201220151234 U CN201220151234 U CN 201220151234U CN 202678715 U CN202678715 U CN 202678715U
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- refrigerator
- heat radiation
- semiconductor laser
- matrix
- radiating subassembly
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- Semiconductor Lasers (AREA)
Abstract
The utility model provides a semiconductor laser liquid refrigerating apparatus, which solves the technical problems of low heat radiation efficiency, or large processing difficulty, high production cost and the like existed in the prior art. According to the invention, a weld layer is plated on a flattening surface of a refrigerator matrix of the semiconductor laser liquid refrigerating apparatus, a semiconductor laser chip is sealed on the weld layer; a heat radiation component is provided in the refrigerator matrix; the heat radiation component employs forms of a fin, a rib or a cylinder, a groove or a jaw fixedly connected to the heat radiation component is treated on the inner wall of the refrigerator matrix; or the heat radiation component is an integrated body possessing a substrate, the substrate is fixed on the inner wall of the refrigerator matrix, and a plurality of heat radiation fins, heat radiation ribs or heat radiation columns are arranged on the substrate. The semiconductor laser liquid refrigerating apparatus has the advantages of strong heat radiation capability and low cost, and has adjustable performance, and is convenient for arranging an anticorrosion layer for enhancing the reliability.
Description
Technical field
The utility model belongs to semiconductor laser and makes the field, relates to a kind of semiconductor laser liquid refrigerator, is particularly useful for high power semiconductor lasers.
Background technology
Along with power output, electro-optical efficiency, reliability and the stability of semiconductor laser improves constantly, high power semiconductor lasers is in industry, and the application in medical treatment and the military affairs is more extensive, and the market demand is huge, and development prospect is wide.The performance of laser is except outside the Pass having with chip, also with the heat radiation of laser with encapsulate relevant.In order to improve the reliability and stability of laser, reduce production costs, must the efficient radiator structure of design.In addition, require also that the simple cost of encapsulating structure Design and manufacture is low, radiating efficiency is high.
At present, high power semiconductor lasers has had commercially produced product to occur, and the heat radiation of this class laser mainly contains three kinds of conduction cooling types, common liq refrigeration mode, micro channels liquid refrigeration mode.
The conduction refrigerator mainly by high thermal conductivity metal or other thermal conductivity preferably material carry out heat loss through conduction, the preparation method of this refrigerator is simple, but heat-sinking capability is limited, has restricted the power expansion of laser; In the middle of common liq refrigerator poor refrigerating efficiency, this refrigerator mainly rely on or the through channel of near-thermal source one side dispel the heat, area of dissipation is limited, and its internal cooling medium can not effectively form turbulent flow, convection transfer rate is low; Micro channels liquid refrigerator difficulty of processing is large, manufacturing cost is high, useful life is short.The micro channels liquid refrigerator is by the stacked machine-shaping of which floor very thin copper sheet, and inner microchannel is approximately 300 microns.In manufacture process, need to process accurately every one deck copper sheet, so that the microchannel after stacked forms the strong turbulent flow of heat-sinking capability when liquid flows through.Therefore, the accurate processing of microchannel refrigerator is a difficult point, because the Precision Machining difficulty of microchannel refrigerator is quite large, causes its manufacturing cost very high.And the flowing space of coolant is very narrow and small in the refrigerator of microchannel, easily produces unnecessary Pressure Drop, and air-proof condition is abominable, causes the shortening in useful life of microchannel refrigerator.In addition, in the process of laser works, if when having impurity in the coolant (being generally deionized water), these impurity are easy to be attached on the inwall of microchannel, thereby cause the electrochemical corrosion of microchannel tube wall, may be with the tube wall eating thrown of microchannel refrigerator when serious, both on causing great impact the fail safe of laser, thereby affect the useful life of laser.
The utility model content
The utility model provides a kind of semiconductor laser liquid refrigerator, and radiating efficiency that prior art exists is low or difficulty of processing large to solve, production cost is than the high-technology problem.
The purpose of this utility model is achieved through the following technical solutions:
A kind of preparation method who is applied to the liquid chiller of semiconductor laser may further comprise the steps:
(1) perforate mouth above the refrigerator matrix is offered cavity via this aperture in the refrigerator matrix; Distolateral wall at the refrigerator matrix is offered inlet, offers liquid outlet on the other end sidewall, and water inlet and delivery port are communicated with described cavity;
(2) will radiating subassembly be fixedly mounted in the described cavity via described hole, form the liquid cooling passage; The structural design of radiating subassembly is according to being: increasing heat radiation area as far as possible, and so that described liquid cooling passage has mulitpath, strengthen the turbulivity (this structural design can be based on known fluid for radiating heat theoretical and with reference to radiator structure common in the other field) of coolant;
The aperture sealing of (3) refrigerator matrix top being offered.
Above-mentioned radiating subassembly can adopt the form of fin, rib or cylinder, and step (1) is offered in the process of cavity inwall at the refrigerator matrix and processed groove or deck with the radiating subassembly secure fit.Be intended to realize as far as possible increasing heat radiation area, and so that described liquid cooling passage has mulitpath, strengthen the turbulivity of coolant.
Perhaps above-mentioned radiating subassembly also can be the integral piece with substrate, adopts die casting or one-shot forming technique production; Be laid with a plurality of radiating fins, vent rib or thermal column in the substrate, step (2) directly is fixed in substrate the inwall of refrigerator matrix.Be intended to realize as far as possible increasing heat radiation area, and so that described liquid cooling passage has mulitpath, strengthen the turbulivity of coolant.
In the above-mentioned steps (3) aperture being sealed is that cover plate is installed in the position, aperture, perhaps adopts jam welding concordant with the aperture or bonding so that refrigerator matrix shell is smooth.
After step (2) is installed radiating subassembly, preferably whole liquid cooling passage is added anticorrosion coating.Like this, even there are some impurity in the cooling agent that uses, also still can guarantee the work of normally dispelling the heat for a long time.
Above-mentioned refrigerator matrix selection copper-nickel alloy, gold, silver, pottery, diamond or diamond carbon/carbon-copper composite material.
Above-mentioned refrigerator matrix preferably adopts rectangular block shape, cylindric or oval column.
The utility model---the semiconductor laser refrigerating plant that preparation method's production of process as above-mentioned liquid chiller obtains, its special character is: the flat surface at the refrigerator matrix of semiconductor laser refrigerating plant is coated with weld layer, and semiconductor laser chip is packaged on the weld layer; The inside of refrigerator matrix is provided with radiating subassembly;
Described radiating subassembly adopts the form of fin, rib or cylinder, is processed with groove or deck with the radiating subassembly secure fit at the inwall of refrigerator matrix;
Perhaps described radiating subassembly is the integral piece with substrate, and the inwall of refrigerator matrix is fixed in substrate, is laid with a plurality of radiating fins, vent rib or thermal column in the substrate.
Be provided with anticorrosion coating on the surface of radiating subassembly and the inwall of refrigerator matrix.
The refrigerator matrix is take rectangular block shape, cylindric or oval column as good.
The utlity model has following beneficial effect:
(1) heat-sinking capability is strong.The utility model uses the fluid course of heat radiating fin structure formation, has greatly increased the area of dissipation of liquid chiller, in refrigerator base cavity inside the water route is divided into multipath stream current, has strengthened the turbulivity of coolant, thereby strengthens the refrigeration of refrigerator.
(2) cost is low.The utility model refrigerator basal body structure is easy to machining, and cost of manufacture is low.The refrigerator matrix can be directly with the preparation of standard machinery processing method, and fin also can be used the type of squeezing or die casting or one-shot forming technique production according to its shape, and is lower than the refrigerator cost of normal operation wire cutting technology, is suitable for mass production.
(3) has adjustable.Can be according to the heat radiation requirement in the utility model, select the shape of fin to be installed on the fluid passage in the refrigerator matrix, for example, require can to select to only have when low the structure of a small amount of fin such as heat radiation; Heat radiation can select to have the structure of multi-disc fin when having relatively high expectations, convenient to structure reasonable utilization and to the management and control of cost.
(4) be convenient to arrange corrosion-resistant coating to improve reliability.Therefore compare with general microchannel, the water route size of this refrigerator is large, and can add anticorrosion coating, has greatly reduced the risk of the blocked or heavy corrosion in water route, and reliability improves.
Description of drawings
Fig. 1 is preparation method's schematic diagram of the utility model refrigerator.
Fig. 2 is the profile of offering refrigerator behind the fluid passage.
Fig. 3, Fig. 4, Fig. 5, Fig. 6 are the radiating subassembly of the different structure form of the utility model employing.
Wherein, 1 is the refrigerator matrix; 2 is the aperture; 3 is fluid passage; 4 is water inlet; 5 is radiating subassembly; 6 is cover plate; 7 is the liquid chiller finished product.
Embodiment
Below in conjunction with accompanying drawing the utility model is done and to be described in further detail:
As shown in Figure 1, refrigerator matrix 1 of the present utility model adopts the block base substrate that carries out grinding through to primary flat, at first above refrigerator, offer aperture 2,2 empty the refrigerator matrix and arrange in inside fluid passage 3 from the aperture, distolateral wall at the refrigerator matrix is offered inlet, offer liquid outlet on the other end sidewall, and water inlet and delivery port are communicated with fluid passage.At last 2 positions, aperture being offered in refrigerator matrix 1 top seals, the mode of sealing is cover plate 6 to be installed or cover plate 6 is welded on 2 positions, aperture, make the refrigerator matrix 3 that cover plate 6 is installed see from the outside it is a complete integral body, thereby be convenient to arrange weld layer semiconductor laser chip is installed.
The material of refrigerator matrix 1 is high thermal conductivity materials, can be metal, such as copper, gold, silver, also can be diamond or diamond carbon/carbon-copper composite material, also can be pottery.
Fluid passage and radiating subassembly are suitable, if that is: radiating subassembly 5 adopts the form of fins, then fluid passage 3 is the grooves that cooperate with each fin, on the fit that each fin can be installed in; If radiating subassembly 5 adopts the form of bar shape, then fluid passage 3 is the grooves that cooperate with the main body shape; While radiating subassembly 5 is individual integral body also, and just the substrate at radiating subassembly 5 is provided with fin or other radiator structures, and the substrate of fluid passage 3 and radiating subassembly 5 cooperates so.
The position that is communicated with the intake-outlet of fluid passage on refrigerator matrix 1 sidewall can be set according to technological requirement.
Radiating subassembly 5 of the present utility model can be designed to the various structures form according to the heat radiation needs, and shown in 3, radiating subassembly adopts fin configuration, is to be become by a plurality of bar shaped sheet fins set that are parallel to each other; Fig. 4, radiating subassembly are a plurality of columns; Fig. 5 radiator has pedestal, and the fin that increases heat radiation is set at pedestal; Fig. 6 radiating subassembly has pedestal, and the column structure that increases heat radiation is set at pedestal.
In actual applications, fin of the present utility model also can slightly make improvements, the structure that is conducive to dispel the heat as fin being made into ring-type etc.
In order to prevent the corrosion of water stream channel, the inwall of fluid passage 3 is equipped with anticorrosion coating, and this mode at water route plating corrosion-resistant material has improved the resistance to corrosion of cooling system greatly.
Preparation method based on the utility model liquid chiller, plate weld layer at the liquid chiller 7 for preparing, go up layer by layer the encapsulated semiconductor chip of laser in welding again, the heat that thermal source produces during semiconductor laser chip work is transmitted on the refrigerator fin vertically downward by heat conducting mode, dispels the heat by radiating subassembly.The specific works mode is: coolant enters fluid passage 3 by the water inlet on refrigerator matrix 1 wall, in fluid passage, form turbulent flow and shunted by radiating subassembly, the heat that chip of laser produces is transmitted on the radiating subassembly, and by current in the radiating subassembly heat is in time taken away, current flow out through delivery port.Like this, semiconductor laser chip is transmitted to heat on the liquid chiller medium that is cooled and takes away.Because the existence of radiating subassembly, area of dissipation increases greatly, thereby produces good refrigeration.
The utility model can design according to the radiating requirements of semiconductor laser the preparation liquid chiller.Can satisfy for encapsulating the arbitrarily liquid chiller of a bar bar.
In sum, preparation method of the present utility model is simple, be easy to machining, and cost of manufacture is low.For example the refrigerator matrix can be directly with the preparation of standard machinery processing method, and can realize on the refrigerator matrix auxiliary process such as thread mill drilling; If radiating fin assembly and deck can be with die casting or one-shot forming technique productions according to its shape, refrigerator cost than normal operation wire cutting technology is lower, be suitable for mass production, certainly, sample can use the wire cutting technology preparation equally, and its first type surface can be machined directly to uses needed flatness and roughness; The assembling of refrigerator matrix can be used welding procedure according to concrete applicable cases, and technique for sticking etc. are once finished.If high to the refrigerator surface requirements, also can directly carry out the secondary operations such as grinding to primary flat in the rear secondary of refrigerator matrix assembling, also can add anticorrosion coating in overall architecture.
Claims (3)
1. semiconductor laser liquid refrigerator is characterized in that: the flat surface at the refrigerator matrix of semiconductor laser liquid refrigerator is coated with weld layer, and semiconductor laser chip is packaged on the weld layer; The inside of refrigerator matrix is provided with radiating subassembly;
Described radiating subassembly adopts the form of fin, rib or cylinder, is processed with groove or deck with the radiating subassembly secure fit at the inwall of refrigerator matrix;
Perhaps described radiating subassembly is the integral piece with substrate, and the inwall of refrigerator matrix is fixed in substrate, is laid with a plurality of radiating fins, vent rib or thermal column in the substrate.
2. semiconductor laser liquid refrigerator according to claim 1 is characterized in that: be provided with anticorrosion coating on the surface of radiating subassembly and the inwall of refrigerator matrix.
3. semiconductor laser liquid refrigerator according to claim 2, it is characterized in that: the refrigerator matrix is rectangular block shape, cylindric or oval column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220151234 CN202678715U (en) | 2012-04-11 | 2012-04-11 | Semiconductor laser liquid refrigerating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220151234 CN202678715U (en) | 2012-04-11 | 2012-04-11 | Semiconductor laser liquid refrigerating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202678715U true CN202678715U (en) | 2013-01-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220151234 Expired - Fee Related CN202678715U (en) | 2012-04-11 | 2012-04-11 | Semiconductor laser liquid refrigerating apparatus |
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| Country | Link |
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| CN (1) | CN202678715U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111752078A (en) * | 2019-03-29 | 2020-10-09 | 中强光电股份有限公司 | Heat dissipation module and projection device |
-
2012
- 2012-04-11 CN CN 201220151234 patent/CN202678715U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111752078A (en) * | 2019-03-29 | 2020-10-09 | 中强光电股份有限公司 | Heat dissipation module and projection device |
| US11194238B2 (en) | 2019-03-29 | 2021-12-07 | Coretronic Corporation | Heat dissipation module and projection apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130116 Termination date: 20180411 |