CN202622205U - Diode lead chip compacting device - Google Patents
Diode lead chip compacting device Download PDFInfo
- Publication number
- CN202622205U CN202622205U CN 201220128247 CN201220128247U CN202622205U CN 202622205 U CN202622205 U CN 202622205U CN 201220128247 CN201220128247 CN 201220128247 CN 201220128247 U CN201220128247 U CN 201220128247U CN 202622205 U CN202622205 U CN 202622205U
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- China
- Prior art keywords
- anchor plate
- support
- kit
- diode lead
- pressing plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a diode lead chip compacting device. The diode lead chip compacting device comprises a base plate, a support frame, a pressing plate component, an air cylinder and a control air cylinder, wherein the base plate is used for placing a graphite disc and is provided with positioning holes used to fix the graphite disc, the support frame is connected with the base plate and used for installing all components, the pressing plate component is arranged on the support frame, can move up and down along the support frame and is used for compacting the graphite disc, the air cylinder is connected with the pressing plate component, is installed on the support frame, and enables the pressing plate component to move towards the base plate through air pressure so that the graphite disc and a lead are compacted, and the control air cylinder is connected with the support frame and used for uplifting the pressing plate component. The diode lead chip compacting device compacts the graphite disc and the lead for one-shot molding, avoids the defects that contact is incompact, and a welding face has air holes, is insufficient in tension and is broken easily in a traditional welding method.
Description
Technical field
The utility model relates to compaction apparatus, is meant a kind of diode lead chip compaction apparatus especially.
Background technology
Diode is claimed crystal diode again, is called for short diode, in addition, also has early stage vacuum electronic diode; It is a kind of electronic device with unidirectional conductive electric current.Diode lead-in wire occurs easily and contacts leakiness with the weld tabs chip in welding process, and the solder side that causes has pore, direct fracture that pulling force is not enough, easily broken, serious, and this has seriously influenced the welding rate of good of product.
The utility model content
The utility model proposes a kind of diode lead chip compaction apparatus, has solved diode and the unreal problem of chips welding in the prior art.
The technical scheme of the utility model is achieved in that
A kind of diode lead chip compaction apparatus comprises:
Be used to place the base plate of graphite plate, said base plate is provided with the locating hole of anchor stone disc;
Be connected with said base plate, be used to install the support of each parts;
Be arranged on the said support, can move up and down, be used for the Anchor plate kit of compacted graphite dish along said support;
Be connected with said Anchor plate kit, be installed on the said support, thereby make said Anchor plate kit to the cylinder of said base plate motion graphite plate and lead-in wire compacting through air pressure;
Be connected with said support, be used to lift the control cylinder of said Anchor plate kit.
Further, also comprise: be used to detect said Anchor plate kit compacting position Detection device, be installed on the said Anchor plate kit.Be arranged in the said checkout gear, be used to make the overrun control of delaying time and lifting after the said Anchor plate kit compacting.Be arranged between said Anchor plate kit and the said support carriage that is used to connect said Anchor plate kit and support, said Anchor plate kit is slided along said support.Be arranged on the said Anchor plate kit, be used to regulate the regulator that said cylinder produces pressure.
Further, said Anchor plate kit comprises: first pressing plate and second pressing plate that are provided with up and down, said first pressing plate is connected through spring with second pressing plate.Said second pressing plate is provided with the rubber slab of the length error that is used to prevent to go between.Said rubber slab thickness is specially 1-5mm.Said checkout gear is arranged between said first pressing plate and second pressing plate.Said cylinder is specially two bar cylinders.
The utility model technical scheme is through said Anchor plate kit and said base plate; With compaction moulding of graphite plate and lead-in wire; Avoided diode in traditional welding process; Lead-in wire occurs easily and contacts leakiness with the weld tabs chip, the solder side that causes has pore, problems such as direct fracture that pulling force is not enough, easily broken, serious.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiment of the utility model, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of diode lead chip of the utility model compaction apparatus;
The specific embodiment
To combine the accompanying drawing among the utility model embodiment below, the technical scheme among the utility model embodiment is carried out clear, intactly description, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 1, a kind of diode lead chip compaction apparatus comprises:
Be used to place the base plate 1 of graphite plate, said base plate 1 is provided with the locating hole of anchor stone disc;
Be connected with said base plate 1, be used to install the support 2 of each parts;
Be arranged on the said support 2, can move up and down, be used for the Anchor plate kit of compacted graphite dish along said support 2;
Be connected with said Anchor plate kit, be installed on the said support 2, thereby make said Anchor plate kit to the cylinder 5 of said base plate 1 motion graphite plate and lead-in wire compacting through air pressure;
Be connected with said support 2, be used to lift the control cylinder 6 of said Anchor plate kit.
Graphite plate is put into said base plate 1, graphite plate is fixed on the said base plate 1, lead-in wire is installed on the said Anchor plate kit through said locating hole; Exert pressure through 5 pairs of said Anchor plate kits of said cylinder, make said Anchor plate kit, make said Anchor plate kit and 1 compacting of said base plate along said support 2 axial downward movement; After confirming said Anchor plate kit compacting, start said control cylinder 6, said Anchor plate kit is lifted; Take out graphite plate, accomplish once connection diode.
Support described in the present embodiment 2 is connected with said Anchor plate kit, said base plate 1, said cylinder 5, said control cylinder 6, and these parts all are installed on the said support 2.
Further, also comprise: be used to detect said Anchor plate kit compacting position Detection device, be installed on the said Anchor plate kit.Be arranged in the said checkout gear, be used to make the overrun control of delaying time and lifting after the said Anchor plate kit compacting.Be arranged between said Anchor plate kit and the said support 2 carriage that is used to connect said Anchor plate kit and support 2, said Anchor plate kit is slided along said support 2.Be arranged on the said Anchor plate kit, be used to regulate the regulator that said cylinder 5 produces pressure.
Also be provided with said overrun control on the said Anchor plate kit, said overrun control is connected with said checkout gear, after said checkout gear detects said Anchor plate kit and 1 compacting of said base plate; Said overrun control starts; Control said Anchor plate kit and lift the time, be preferably 2 seconds in the present embodiment, just make said Anchor plate kit and 1 compacting of affiliated base plate after; After 2 seconds,, said Anchor plate kit is lifted by said control air pump starting said control air pump.Said regulator is arranged on the said Anchor plate kit, can adjust said cylinder 5 to said Anchor plate kit applied pressure through said regulator.
Support described in the present embodiment 2 is connected with said carriage, said base plate 1, said cylinder 5, said control cylinder 6, and these parts all are installed on the said support 2.
Said Anchor plate kit can be for directly being connected with said support 2; Added said carriage in the present embodiment again; Said carriage is connected with said Anchor plate kit; And be installed on the said support 2, can reduce the frictional force of said Anchor plate kit when said support 2 axially-movables through said carriage, increase the service life of said Anchor plate kit and said support 2.
Further, said Anchor plate kit comprises: first pressing plate 3 and second pressing plate 4 that are provided with up and down, said first pressing plate 3 is connected through spring with second pressing plate 4.Said second pressing plate 4 is provided with the rubber slab of the length error that is used to prevent to go between.Said rubber slab thickness is specially-mm.Said checkout gear is arranged between said first pressing plate 3 and second pressing plate 4.Said cylinder 5 is specially two bar cylinders 5.
Said Anchor plate kit is divided into said first pressing plate 3 and said second pressing plate 4 in the present embodiment; And said first pressing plate 3 causes damage for fear of first pressing plate 3 described in the compacting process and second pressing plate 4 because of reasons such as collisions with second pressing plate 4 when being connected; So adopt spring to connect, and, on said second pressing plate 4, also be provided with said rubber slab in order to prevent the length error that goes between; And the thickness of said rubber slab is preferably 2mm for best in the present embodiment with 1-5mm.Said checkout gear is arranged between said first pressing plate 3 and said second pressing plate 4 in the present embodiment.
Before the work of said diode lead chip compaction apparatus begins, graphite plate is put into said base plate 1, through said locating hole graphite plate is fixed on the said base plate 1; Lead-in wire is installed on the said rubber slab, and in order better said Anchor plate kit to be exerted pressure, said cylinder 5 is specially two bar cylinders 5; Exert pressure through 5 pairs of said Anchor plate kits of said cylinder; Said Anchor plate kit is moved downward along said support 2, and after said Anchor plate kit and 1 compacting of said base plate, said checkout gear detects the position of said Anchor plate kit; And with this feedback information to said overrun control; Said overrun control starts behind the feedback information of said checkout gear obtaining, and said control cylinder 6 time-delays were started after 2 seconds, after said control cylinder 6 starts said Anchor plate kit is lifted; The graphite plate that taking-up presses is accomplished once the connection to diode.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; All within the spirit and principle of the utility model, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection domain of the utility model.
Claims (10)
1. a diode lead chip compaction apparatus is characterized in that, comprising:
Be used to place the base plate of graphite plate, said base plate is provided with the locating hole of anchor stone disc;
Be connected with said base plate, be used to install the support of each parts;
Be arranged on the said support, can move up and down, be used for the Anchor plate kit of compacted graphite dish along said support;
Be connected with said Anchor plate kit, be installed on the said support, thereby make said Anchor plate kit to the cylinder of said base plate motion graphite plate and lead-in wire compacting through air pressure;
Be connected with said support, be used to lift the control cylinder of said Anchor plate kit.
2. diode lead chip compaction apparatus according to claim 1 is characterized in that, also comprises: be used to detect said Anchor plate kit compacting position Detection device, be installed on the said Anchor plate kit.
3. like the said diode lead chip of claim 2 compaction apparatus, it is characterized in that, also comprise: be arranged in the said checkout gear, be used to make the overrun control of delaying time and lifting after the said Anchor plate kit compacting.
4. like the said diode lead chip of claim 3 compaction apparatus; It is characterized in that; Also comprise: be arranged between said Anchor plate kit and the said support carriage that is used to connect said Anchor plate kit and support, said Anchor plate kit is slided along said support.
5. like the said diode lead chip of claim 4 compaction apparatus, it is characterized in that, also comprise: be arranged on the said Anchor plate kit, be used to regulate the regulator that said cylinder produces pressure.
6. like any said diode lead chip compaction apparatus of claim 1 to 5, it is characterized in that said Anchor plate kit comprises: first pressing plate and second pressing plate that are provided with up and down, said first pressing plate is connected through spring with second pressing plate.
7. like the said diode lead chip of claim 6 compaction apparatus, it is characterized in that said second pressing plate is provided with the rubber slab of the length error that is used to prevent to go between.
8. like the said diode lead chip of claim 7 compaction apparatus, it is characterized in that said rubber slab thickness is specially 1-5mm.
9. like the said diode lead chip of claim 8 compaction apparatus, it is characterized in that said checkout gear is arranged between said first pressing plate and second pressing plate.
10. like the said diode lead chip of claim 9 compaction apparatus, it is characterized in that said cylinder is specially two bar cylinders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220128247 CN202622205U (en) | 2012-03-30 | 2012-03-30 | Diode lead chip compacting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220128247 CN202622205U (en) | 2012-03-30 | 2012-03-30 | Diode lead chip compacting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202622205U true CN202622205U (en) | 2012-12-26 |
Family
ID=47375448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220128247 Expired - Fee Related CN202622205U (en) | 2012-03-30 | 2012-03-30 | Diode lead chip compacting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202622205U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191063A (en) * | 2014-09-01 | 2014-12-10 | 徐州汉通电子科技有限公司 | Improved welding mold for welding semiconductor power module |
| CN105108417A (en) * | 2015-09-17 | 2015-12-02 | 贵州雅光电子科技股份有限公司 | Diode burn-in mold and using method thereof |
-
2012
- 2012-03-30 CN CN 201220128247 patent/CN202622205U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191063A (en) * | 2014-09-01 | 2014-12-10 | 徐州汉通电子科技有限公司 | Improved welding mold for welding semiconductor power module |
| CN104191063B (en) * | 2014-09-01 | 2016-04-27 | 徐州汉通电子科技有限公司 | A kind of weldering mould of welding semi-conductor power module of improvement |
| CN105108417A (en) * | 2015-09-17 | 2015-12-02 | 贵州雅光电子科技股份有限公司 | Diode burn-in mold and using method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20150330 |
|
| EXPY | Termination of patent right or utility model |