CN202617591U

CN202617591U - Injection molding shielding cover

Info

Publication number: CN202617591U
Application number: CN 201120454176
Authority: CN
Inventors: 龚鹏
Original assignee: Huawei Device Co Ltd
Current assignee: Huawei Device Co Ltd
Priority date: 2011-11-16
Filing date: 2011-11-16
Publication date: 2012-12-19
Anticipated expiration: 2021-11-16

Abstract

Embodiments of the utility model disclose an injection molding shielding cover which is used to protect a circuit component bared on a printed circuit board (PCB). The shielding cover in the embodiments of the utility model is characterized in that: the shielding cover comprises an injection molding support body and a conducting layer; the injection molding support body covers out of an exposed surface of the circuit component and there is no gap between the injection molding support body and the circuit component, and the injection molding support body is used to protect the circuit component; the conducting layer covers an external surface of the injection molding support body and there is no gap between the conducting layer and the injection molding support body.

Description

A kind of injection moulding radome

Technical field

The utility model relates to communication technical field, relates in particular to a kind of injection moulding radome.

Background technology

Radome is circuit shielding and the guard method of generally adopting in the circuit design; Its major function is to printed circuit board (PCB; Printed Circuit Board) circuit of specific region and the external world carry out electromagnetic shielding; Prevent external interference, and stop electromagnetic radiation that internal circuit produces etc. to disturb outside other circuit, have the functions such as protection, auxiliary heat dissipation of physical circuit simultaneously concurrently.

The main electric conducting materials such as metal, conductive plastics that adopt of existing radome technology, machine-shaping in advance adopts welding, mode such as bonding to combine shielding and the protection of formation to circuit with PCB in the PCB circuit fabrication later stage.Radome and had the space necessarily be full of air between the protective circuit, and because the manufacturing processing technic problem, most of radomes do not seal fully.

In the prior art; Because radome does not directly contact with internal circuit, the caloric requirement that produces during internal circuit work is carried out heat exchange through PCB with inner air and radome, and efficient is lower aspect the circuit heat radiation; Simultaneously; Can not stop the infringement to circuit-line and element such as external humidification, corrosive gas, and owing to can not form the physical support to internal circuit element, thereby can't guarantee the structural stability of PCB.

The utility model content

The utility model embodiment provides a kind of injection moulding radome, in order to protective circuit is formed exposed circuit element on electromagnetic shielding and the protection pcb board.

The injection moulding radome that the utility model provides comprises: injection moulding supporter, conductive layer; Said injection moulding supporter covers on outside the exposed surface of circuit element, and and each exposed surface of said circuit element between tight, be used to protect said circuit element; Said conductive layer covers the outer surface of said injection moulding supporter, and and said injection moulding supporter between tight.

Can find out that from above technical scheme the utility model embodiment has the following advantages: the injection moulding supporter covers on outside the exposed surface of circuit element, and and each exposed surface of this circuit element between tight; Be used to protect this circuit element, conductive layer covers the outer surface of this injection moulding supporter, and and the injection moulding supporter between tight; With the injection moulding supporter composition radome of combining closely, whole injection moulding radome forms the circuit of being protected and the good thermal conductor between the extraneous air environment, the formation electromagnetic shielding; Has higher heat transfer efficiency; Help circuit heat radiation, injection moulding radome and circuit element are combined closely, antidetonation and shock proof ability that can the intensifier circuit element; Combining closely of injection moulding radome and circuit element forms certain seal, prevents the infringement of outside adverse circumstances to physical circuit.

Description of drawings

Fig. 1 is a sketch map in the cross section of the injection moulding radome among the utility model embodiment;

Fig. 2 is another sketch map in the cross section of the injection moulding radome among the utility model embodiment;

Fig. 3 is the PCB vertical view among the utility model embodiment.

Embodiment

The utility model embodiment provides a kind of injection moulding radome, makes the injection moulding supporter in the PCB specific region, and constitutes whole injection moulding radome of combining closely with PCB and circuit element at injection molding body surface formation conductive layer.Be used to protect circuit elements device or circuit module on the pcb board; So that whole injection moulding radome forms good thermal conductor; Help the circuit heat radiation, and intensifier circuit anti-vibration and shock proof ability, of the infringement of outside adverse circumstances prevented to physical circuit; Go up the good combination and the electric connection of radome pad through conductive layer and PCB, form by the electromagnetic shielding of protective circuit.Below be elaborated.

See also Fig. 1, one embodiment comprises of the injection moulding radome during the utility model is implemented:

Injection moulding supporter 101, conductive layer 102;

Wherein, injection moulding supporter 101 covers on outside the exposed surface of circuit element 103, and and each exposed surface of circuit element 103 between tight, be used to protect this circuit element 103;

Understandable, in 6 surfaces of circuit element 103, remove the surface of combining closely with pcb board; Remaining 5 surfaces are exposed surface; Injection moulding supporter 101 covers on outside these 5 exposed surfaces, and tight between 5 exposed surfaces forms a confined space outside circuit element 103 therewith.

Conductive layer 102 covers the outer surface of injection moulding supporter 101, and and injection moulding supporter 101 between tight, be used to keep the satisfactory electrical conductivity of injection moulding radome.

Among the utility model embodiment, the injection moulding supporter covers on outside the exposed surface of circuit element, and and each exposed surface of this circuit element between tight; Be used to protect this circuit element; Conductive layer covers the outer surface of this injection moulding supporter, and and the injection moulding supporter between tight, with the injection moulding supporter composition radome of combining closely; Circuit element that whole injection moulding radome formation is protected and the good thermal conductor between the extraneous air environment; Form electromagnetic shielding, have higher heat transfer efficiency, help the circuit heat radiation; Injection moulding radome and circuit element are combined closely, antidetonation and shock proof ability that can the intensifier circuit element; Combining closely of injection moulding radome and circuit element forms certain seal, prevents the infringement of adverse circumstances such as external humidification air, corrosive gas, liquid to physical circuit.

For ease of understanding, below with another embodiment detailed introduce the injection moulding radome among the utility model embodiment, see also Fig. 2, another embodiment of the injection moulding radome in the utility model comprises:

Injection moulding supporter 201, conductive layer 202;

Wherein, injection moulding supporter 201 covers on outside the exposed surface of circuit element 203, and and each exposed surface of circuit element 203 between tight; Injection moulding supporter 201 has certain rigidity; Be used for protective circuit element 203, the material of injection moulding supporter can be for having plastic insulated non-metal, or; Has plastic insulated non-metal mixture/bond; Or, having the metal and the non-metal mixture/bond of plastic insulation, bond is meant the multilayer material structure of combining closely with hierarchy.

Need to prove that the profile of injection moulding supporter 201 can be regular, also can specifically set, do not do concrete qualification here according to practical application.

In the present embodiment; Through the injection moulding processing technology; On by protective circuit element 203, form the injection molding body supporter 201 of combining closely with circuit element 203, and around injection moulding supporter 201, will expose the radome welding disking area, injection moulding supporter 201 is connected with the resistance welding zone territory 205 of PCB204; And and tight between the resistance welding zone territory 205, combine closely.

Conductive layer 202 covers the outer surface of injection moulding supporter 201, and and injection moulding supporter 201 between tight, the material of conductive layer can be metal, or has the metal and the non-metal mixture/bond of conductivity, or has the nonmetal of conductivity.

PCB204 is last, around by protective circuit element 203, reserves the radome welding disking area, and this welding disking area can be the closed area, can not be the closed area also, and this welding disking area is used for connecting conductive layer 202.

For ease of understanding the structure of PCB; See also Fig. 3; Fig. 3 is the PCB vertical view, and the radome welding disking area of the dash area on PCB for reserving also is that PCB goes up the earthed conductor zone that resistance unsolder window exposes; Be used for connecting conductive layer, the circuit element among Fig. 3 on the PCB is the claimed circuit element of needs injection moulding radome.

In the present embodiment, the top layer of PCB204 resistance unsolder window contacts with conductive layer 202 and partly is coated with the conductive surface of ground connection attribute, makes conductive layer 202 and this conductive surface realize good being electrically connected, thereby possesses the electro-magnetic screen function to protective circuit.

Conductive layer 202 is connected with the welding disking area of PCB204 through brushing, pasting electric conducting material or injection molding way generates, and and this welding disking area between tight, combine closely and good electrical.

Among the utility model embodiment, the injection moulding supporter covers on outside the exposed surface of circuit element, and and each exposed surface of this circuit element between tight; Be used to protect this circuit element, conductive layer covers the outer surface of this injection moulding supporter, and and the injection moulding supporter between tight; With the injection moulding supporter composition radome of combining closely, through selecting suitable injected plastics material and conductive, injection moulding radome and PCB and circuit element are combined closely and are formed the integral body with certain rigidity; Can play the effect that circuit chip combines with PCB of reinforcing, the ability of intensifier circuit anti-vibration and impact, whole injection moulding radome forms the good thermal conductor between circuit chip and the extraneous air environment; Has higher heat transfer efficiency; Be beneficial to the circuit heat radiation,, and form a integral body with certain seal owing to combining closely of injection moulding radome and PCB and circuit element; Can prevent of the infringement of outer adverse circumstances to the PCB physical circuit; The top layer of the PCB204 resistance unsolder window part that contacts with the conductive layer of injection moulding radome is coated with the conductive surface of ground connection attribute, makes conductive layer and good being electrically connected of this conductive surface realization, and formation is to by the electromagnetic shielding of protective circuit.

More than a kind of injection moulding radome that the utility model provided has been carried out detailed introduction; For those skilled in the art; Thought according to the utility model embodiment; The part that on embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the utility model.

Claims

1. an injection moulding radome is characterized in that, comprising:

The injection moulding supporter, conductive layer;

Said injection moulding supporter covers on outside the exposed surface of circuit element, and and each exposed surface of said circuit element between tight, be used to protect said circuit element;

Said conductive layer covers the outer surface of said injection moulding supporter, and and said injection moulding supporter between tight.

2. injection moulding radome according to claim 1 is characterized in that,

Said injection moulding supporter has rigidity.

3. injection moulding radome according to claim 1 and 2 is characterized in that,

Said injection moulding supporter is connected with the resistance welding zone territory of printing board PCB, and and said resistance welding zone territory between tight.

4. injection moulding radome according to claim 3 is characterized in that,

Said conductive layer is connected with the welding disking area of said PCB, and and said welding disking area between tight.

5. injection moulding radome according to claim 4 is characterized in that,

Said conductive layer is through brushing or the injection molding way generation.