CN202558932U - Rapid heat dissipation and dust removal device for plate PECVD discharge position - Google Patents
Rapid heat dissipation and dust removal device for plate PECVD discharge position Download PDFInfo
- Publication number
- CN202558932U CN202558932U CN2012202524417U CN201220252441U CN202558932U CN 202558932 U CN202558932 U CN 202558932U CN 2012202524417 U CN2012202524417 U CN 2012202524417U CN 201220252441 U CN201220252441 U CN 201220252441U CN 202558932 U CN202558932 U CN 202558932U
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- fan
- heat radiating
- fans
- quick heat
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Abstract
The utility model discloses a rapid heat dissipation and dust removal device for a plate PECVD discharge position. Fans are mounted on the buffer platform of the discharge position to blow air to a coated silicon wafer, so as to rapidly dissipate heat and remove silicon nitride dust on the upper surface of the silicon wafer. In the rapid heat dissipation and dust removal device disclosed by the utility model, the fans are mounted on the buffer platform of the discharge position to blow air to the coated silicon wafer, so as to rapidly dissipate heat and remove silicon nitride dust on the upper surface of the silicon wafer, and the number of fans and the horizontal direction of fans in each group are corresponding one by one to those of the silicon wafers carried by a graphite frame, to realize uniform and sufficient heat dissipation and complete dust removal; and the fans form an angle of about 30 degrees with the buffer platform, to completely remove dust.
Description
Technical field
The utility model relates to board-like PECVD.
Background technology
In the prior art, there are following two problems in board-like PECVD: the one, and the silicon chip upper surface adheres to the silicon nitride dust easily, causes thick point of printing or disconnected deleting.The 2nd, the silicon chip natural heat dissipation is slower, influences the product efficiency of conversion.
The utility model content
The utility model technical problem to be solved just provides material level quick heat radiating and cleaning apparatus under a kind of board-like PECVD, avoids the silicon chip upper surface to adhere to the silicon nitride dust, accelerates the silicon chip heat radiation simultaneously.
For solving the problems of the technologies described above; The utility model adopts following technical scheme: material level quick heat radiating and cleaning apparatus under the board-like PECVD is characterized in that: the silicon chip of fan behind plated film is installed on the buffer table of following material level dries quick heat radiating and remove silicon chip upper surface silicon nitride dust.
As preferably, said fan is provided with two groups, and the height of two groups of fan settings is 20CM.
As preferably, said every group of number of fans and position and the corresponding one by one setting of following material level blanking silicon chip.
As preferably, the blowing mouth of said two groups of fans and buffer table plane are 30 angle faces opposite and are provided with.
As preferably, said fan is by Frequency Converter Control, and fan power supply is the 24V power supply; Thermopair and temperature controller are installed by following material level place; Fan power supply connects protective breaker, and protective breaker one tunnel outlet connects temperature controller to thermopair, and another road outlet of protective breaker connects frequency transformer.
The utility model is equipped with the silicon chip of fan behind plated film and dries quick heat radiating and remove silicon chip upper surface silicon nitride dust on the buffer table of following material level; Wherein the number of every group of fan and horizontal direction are corresponding one by one with the silicon chip that the graphite frame carries, to realize evenly fully heat radiation and to remove dust comprehensively; And be the angle about 30 with the buffer table plane, then can remove dust fully; Select farthest heat radiation and dedusting of wind-force with buffer table planar height, and can not cause fragment with reference to fan; Thermopair and temperature controller are installed by following material level place, and in time monitoring temperature and the rotating speed of adjusting fan automatically keep temperature-stable; Select the fan of high temperature resistant material to reduce the fan damage; The damage equipment when protector that installs isolating switch during installation additional can be avoided fault.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further described:
Fig. 1 is the utility model front view;
Fig. 2 is the utility model vertical view.
Embodiment
Specify the embodiment of material level quick heat radiating and cleaning apparatus under the board-like PECVD of the utility model in conjunction with Fig. 1 and Fig. 2, on the buffer table 1 of material level down, the silicon chip of fan 2 behind plated film is installed and dries quick heat radiating and remove silicon chip upper surface silicon nitride dust.Said fan is provided with two groups, and the height of two groups of fan settings is 20CM.Said every group of number of fans and position and the corresponding one by one setting of following material level blanking silicon chip.The blowing mouth of said two groups of fans and buffer table plane are 30 angle faces opposite setting.Said fan is by Frequency Converter Control, and fan power supply is the 24V power supply, and thermopair and temperature controller are installed by following material level place, and fan power supply connects protective breaker, and protective breaker one tunnel outlet connects temperature controller to thermopair, and another road outlet of protective breaker connects frequency transformer.
Pick out the power supply of 24V on the slave unit 220V power supply, be connected to protective breaker, the one tunnel connects temperature controller to thermopair, and another road connects frequency transformer to fan.
Principle: through the thermopair monitoring temperature of material level down, in time control the rotating speed of fan through temperature controller and frequency transformer, the adjusting wind speed reaches the maintenance homo(io)thermism.
Claims (5)
1. material level quick heat radiating and cleaning apparatus under the board-like PECVD is characterized in that: the silicon chip of fan (2) behind plated film is installed on the buffer table (1) of following material level dries quick heat radiating and remove silicon chip upper surface silicon nitride dust.
2. material level quick heat radiating and cleaning apparatus under the board-like PECVD according to claim 1 is characterized in that: said fan is provided with two groups, and the height of two groups of fan settings is 20CM.
3. material level quick heat radiating and cleaning apparatus under the board-like PECVD according to claim 2 is characterized in that: said every group of number of fans and position and the corresponding one by one setting of following material level blanking silicon chip.
4. material level quick heat radiating and cleaning apparatus under the board-like PECVD according to claim 3 is characterized in that: the blowing mouth of said two groups of fans and buffer table plane are 30 angle faces opposite setting.
5. material level quick heat radiating and cleaning apparatus under the board-like PECVD according to claim 4; It is characterized in that: said fan is by Frequency Converter Control; Fan power supply is the 24V power supply, and thermopair and temperature controller are installed by following material level place, and fan power supply connects protective breaker; Protective breaker one tunnel outlet connects temperature controller to thermopair, and another road outlet of protective breaker connects frequency transformer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202524417U CN202558932U (en) | 2012-05-28 | 2012-05-28 | Rapid heat dissipation and dust removal device for plate PECVD discharge position |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202524417U CN202558932U (en) | 2012-05-28 | 2012-05-28 | Rapid heat dissipation and dust removal device for plate PECVD discharge position |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202558932U true CN202558932U (en) | 2012-11-28 |
Family
ID=47208608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202524417U Expired - Fee Related CN202558932U (en) | 2012-05-28 | 2012-05-28 | Rapid heat dissipation and dust removal device for plate PECVD discharge position |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202558932U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107473599A (en) * | 2017-08-23 | 2017-12-15 | 中航三鑫太阳能光电玻璃有限公司 | A kind of coating film on glass leveling device |
-
2012
- 2012-05-28 CN CN2012202524417U patent/CN202558932U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107473599A (en) * | 2017-08-23 | 2017-12-15 | 中航三鑫太阳能光电玻璃有限公司 | A kind of coating film on glass leveling device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121128 Termination date: 20170528 |