CN202521278U - Device for realizing light-emitting diode (LED) packaging - Google Patents
Device for realizing light-emitting diode (LED) packaging Download PDFInfo
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- CN202521278U CN202521278U CN2012200142579U CN201220014257U CN202521278U CN 202521278 U CN202521278 U CN 202521278U CN 2012200142579 U CN2012200142579 U CN 2012200142579U CN 201220014257 U CN201220014257 U CN 201220014257U CN 202521278 U CN202521278 U CN 202521278U
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- light source
- radiator
- led
- insulating barrier
- led chip
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to a device for realizing light-emitting diode (LED) packaging. The device for realizing the LED packaging comprises an LED chip, a radiator and an electric connecting piece. One end of the radiator is a big end, and the other end of the radiator is a small end. A big end face is axially provided with a light source room in a concave cavity shape, and an insulating layer attached to the bottom wall of the light source room is arranged in the light source room. The center of the insulating layer is provided with a groove, and the LED chip is fixed on the groove of the insulating layer. One face of the insulating layer used for fixing the LED chip is provided with a lens and sealing is formed. An opening end of the light source room is provided with an inner seam allowance which is provided with a light outlet cover assembly and sealing is formed. A small end face is axially provided with an electric room, and a wire through hole is arranged between the electric room and the light source room. The electric connecting piece is arranged inside the electric room, and a wire of the electric connecting piece passes through the wire through hole to be connected with the insulating layer in the light source room. The device for realizing the LED packaging has the advantages of being good in heat dissipation performance, high in lighting effect, long in service life and convenient to assemble during time of lamp manufacturing, saving production cost, simplifying manufacturing processes and bringing convenience to volume production.
Description
Technical field
The utility model relates to a kind of led light source, particularly a kind of implement device of LED encapsulation.
Background technology
Along with the continuous popularization of LED green energy conservation illumination, the demand of LED light fixture is also increasing day by day.Also increasingly high to the requirement of led light source simultaneously, the heat that produces during owing to led chip work is higher, the heat radiation that must solve the LED light fixture, and present LED light fixture dispels the heat and mainly comprises following several kinds of modes:
1, the heat radiation of taking the initiative; Packaged led light source is fixed on the printed panel; Printed panel is connected with radiator, and the heat that produces when through printed panel led chip being worked conducts to radiator, utilizes radiator distribute heat in air to realize the cooling of led chip.But because the printed panel of this structure is a sandwich construction, and printed panel is connected with radiator through heat-conducting glue, makes its heat transfer path longer, increased totally thermal resistance, reduced capacity of heat transmission, all can cause life-span of LED light fixture and performance to seriously influence.The radiator volume of this structure requires greatly simultaneously, causes the volume of whole LED light fixture to increase.
2, take forced heat radiation, promptly in the lamp box of LED light fixture, electric fan is set, force blowing to radiator, realize forced heat radiation through electric fan.This structure increases the cost of manufacture of LED light fixture, and in the work of LED light fixture, electric fan is also worked; Power consumption increases, and the life-span of use cost also corresponding increase, especially electric fan is well below the life-span of led chip; Need often maintenance, change electric fan; Maintenance cost also increases, and causes expense to increase, and is unfavorable for promoting the use of of LED light fixture.
3, adopt the heat-exchange tube temperature reduction way heat radiation of similar refrigeration plant; This structure need be provided with refrigerating plant, and it carries out heat exchange heat radiation through the fluid heat-exchange tube of flowing through, like this; The integrally-built volume of LED light fixture is increased; And structure is more complicated, and cost of manufacture and use cost are also higher, is unfavorable for promoting the use of of LED light fixture.
Therefore, how designing the LED light fixture that a kind of heat dispersion is good, light efficiency is high, the life-span is long is association area personnel problem demanding prompt solutions.
Summary of the invention
The purpose of the utility model is the deficiency to prior art, and a kind of implement device of LED encapsulation is provided, it not only perfect heat-dissipating, light efficiency is high, the life-span is long; Practiced thrift production cost; And easy to assembly, be convenient to also simplify production technology when the light fixture variation is produced, be convenient to produce in batches.
The technical scheme of the utility model is: a kind of implement device of LED encapsulation, comprise led chip, radiator and electrical fitting, and an end of said radiator is a stub end; The other end is little head end; The end face axial of said radiator stub end is provided with the light source chamber that is cavity, and the insulating barrier that a center has groove is set in the said light source chamber, and insulating barrier and light source chamber diapire are fitted; Led chip is fixed in the groove of insulating barrier; Said insulating barrier is used for fixing a mounted lens of led chip and forms sealing, and said light source chamber mouth end is provided with inner stopper, and this inner stopper assembling bright dipping shade assembly also forms sealing; The end face axial of the little head end of said radiator is provided with electric panel room, is provided with cable-through hole between said electric panel room and the light source chamber, and said electrical fitting is installed in the electric panel room, and the lead of electrical fitting passes cable-through hole and is connected with insulating barrier in the light source chamber.
The outer wall of said radiator is provided with some fin.
Said insulating barrier is provided with the open slot of stepping down for lead, is inlaid with the conducting block that is used to connect lead in this open slot.
The lead of led chip and the lead of electrical fitting all are connected on the conducting block in the insulating barrier open slot.
Said inner stopper diapire is provided with annular groove, circumferentially is evenly equipped with some convexities on the inner stopper sidewall, is equipped with locating slot on each convexity.
Said bright dipping shade assembly comprises light shield, sealing ring and trim ring; Sealing ring is located in the annular groove of inner stopper; Go out light shield and push down sealing ring, be pressed into through trim ring in the locating slot on the convexity of inner stopper, will go out light shield and press-fit the inner stopper that is fixed on light source chamber and form sealing.
Said electrical fitting is provided with pin.
Adopt technique scheme, the implement device of the utility model LED encapsulation had the following advantages:
The end face axial of said radiator stub end is provided with the light source chamber that is cavity, and the insulating barrier that a center has groove is set in the said light source chamber, and insulating barrier and light source chamber diapire are fitted; Led chip is fixed in the groove of insulating barrier; Said insulating barrier is used for fixing a mounted lens of led chip and forms sealing, and led chip can directly be encapsulated in the radiator, and the heat that produces during led chip work so just can absorb the back through insulating barrier and conduct fast to radiator; Light source locular wall and fin distribute heat through radiator; Shortened heat conduction path greatly, reduced the accumulative total thermal resistance, the junction temperature of led chip is reduced; Guarantee better heat radiating effect, improved the life-span and the performance of led chip; And light efficiency and distinctive luminous intensity distribution have been guaranteed in the setting of scioptics.
And said light source chamber mouth end is provided with inner stopper; This inner stopper assembling bright dipping shade assembly also forms sealing, makes light source chamber form hermetically-sealed construction like this, can prevent that rainwater, fog from getting into light source chamber; Guarantee the stable of electrical structure, further improved the life-span and the performance of led chip.
The end face axial of the little head end of said radiator is provided with electric panel room simultaneously; Be provided with cable-through hole between said electric panel room and the light source chamber; Said electrical fitting is installed in the electric panel room, and the lead of electrical fitting passes cable-through hole and is connected with insulating barrier in the light source chamber, is convenient to electrically conducting.Because insulating barrier is provided with the open slot of stepping down for lead; Be provided with the conducting block that is used to connect lead in this open slot; The lead of led chip and the lead of electrical fitting all are connected on the conducting block in the insulating barrier open slot, make between led chip and the electrical fitting and can realize that lead be electrically connected through conducting block.
The implement device of this LED encapsulation is simple in structure, easy to assembly, has simplified production technology when being convenient to light fixture variation design, is convenient to produce in batches.And while sealing is strong, its protection effect reaches the IP65 level.
Below in conjunction with the accompanying drawing and the specific embodiment the utility model is described further.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the fractionation sketch map of the utility model;
Fig. 3 is the structural representation of the radiator of the utility model;
Fig. 4 is the structural representation of the insulating barrier of the utility model;
Fig. 5 is the led chip of the utility model and the confined state sketch map of insulating barrier.
In the accompanying drawing, 1 is led chip, and 2 is radiator, and 2a is a fin, and 3 is electrical fitting, and 3a is a pin; 4 is light source chamber, and 5 is insulating barrier, and 5a is a groove, and 5b is an open slot, and 6 is lens, and 7 is inner stopper; 71 is annular groove, and 72 is protruding, and 72a is a locating slot, and 8 is electric panel room, and 9 is cable-through hole, and 10 is lead; 11 is conducting block, and 12 is lead, and 13 for going out light shield, and 14 is sealing ring, and 15 is trim ring, 16 fluorescent material.
The specific embodiment
Referring to Fig. 1 to Fig. 5, the implement device of a kind of LED encapsulation comprises led chip 1, radiator 2 and electrical fitting 3, and wherein the exiting surface of led chip 1 scribbles fluorescent material 16, through led chip 1 excitated fluorescent powder 16 to send white light; The outer wall of radiator 2 is provided with some fin 2a, has guaranteed radiating effect; Electrical fitting 3 is provided with pin 3a, is used to connect external power source.One end of said radiator 2 is a stub end, and the other end is little head end, and the end face axial of said radiator stub end is provided with the light source chamber 4 that is cavity; The insulating barrier 5 that one center has groove 5a is set in the said light source chamber 4, and insulating barrier 5 is fitted with light source chamber 4 diapires, and led chip 1 is fixed among the groove 5a of insulating barrier; The material of insulating barrier 5 adopts elargol or insulating cement in the present embodiment, has high adhesiveness and thermal conductivity, and led chip 1 is encapsulated among the groove 5a of insulating barrier through a glue; Make led chip 1 can directly be encapsulated in the radiator 2; The heat that produces when led chip 1 is worked so just can conduct to radiator 2 after insulating barrier 5 absorbs fast, and light source locular wall and fin distribute heat through radiator have shortened heat conduction path greatly; Reduced the accumulative total thermal resistance; The junction temperature of led chip 1 is reduced, guaranteed better heat radiating effect, improved the life-span and the performance of led chip 1.Said insulating barrier 5 is used for fixing a mounted lens 6 of led chip 1 and forms sealing, has guaranteed the sealing of led chip 1, has improved the light efficiency of led chip 1.Said insulating barrier 5 is provided with the open slot 5b that steps down for lead; Be inlaid with the conducting block 11 that is used to connect lead among this open slot 5b; The material of conducting block 11 adopts conductive materials such as gold, copper, and the lead 12 of led chip is connected on the conducting block 11 in the insulating barrier open slot.Said light source chamber mouth end is provided with inner stopper 7, and these inner stopper 7 assembling bright dipping shade assemblies also form sealing, and said inner stopper 7 diapires are provided with annular groove 71; Circumferentially be evenly equipped with some protrudingly 72 on the inner stopper sidewall, be equipped with locating slot 72a on each convexity, said bright dipping shade assembly comprises light shield 13, sealing ring 14 and trim ring 15; Sealing ring 14 is located in the annular groove 71 of inner stopper, goes out light shield 13 and pushes down sealing ring 14, is pressed into through trim ring 15 among the locating slot 72a on the convexity of inner stopper; To go out light shield 13 and press-fit the inner stopper 7 that is fixed on light source chamber and form sealing, and make light source chamber 4 form hermetically-sealed construction like this, can prevent that rainwater, fog from getting into light source chamber 4; Its protection effect reaches the IP65 level; Guarantee electric stability, further improved the life-span and the performance of led chip 1, and be convenient to assembling and dismounting.The end face axial of the little head end of said radiator is provided with electric panel room 8; Be used to install electrical fitting 3, electric panel room 8 is two cavitys spaced apart from each other with light source chamber 4 in the present embodiment, is provided with cable-through hole 9 between said electric panel room 8 and the light source chamber 4; Said electrical fitting 3 is installed in the electric panel room 8; The electrical fitting 3 of present embodiment is fixed in the electric panel room 8, is convenient to installation and removal, and the lead 10 of electrical fitting passes cable-through hole 9 and is connected with insulating barrier 5 in the light source chamber; The lead 10 of electrical fitting is connected on the conducting block 11 in the insulating barrier open slot, makes between led chip 1 and the electrical fitting 3 and can realize that leads be electrically connected through conducting block 11.
Because the implement device of this LED encapsulation has said structure; Its radiating efficiency is greatly improved; It can solve the heat dissipation problem of high-power LED lamp, and sealing is strong, makes it become the independent led chip that carries radiator; Be convenient to the shape-designing of light fixture, can be used for Landscape Lighting, road lighting etc. moulding and the strict light fixture of performance requirement.Simultaneously, also solve the technology difficult problem of present LED light fixture complex manufacturing, be convenient to batch product.
Claims (7)
1. the implement device of LED encapsulation; Comprise led chip (1), radiator (2) and electrical fitting (3); It is characterized in that: an end of said radiator (2) is a stub end, and the other end is little head end, and the end face axial of said radiator stub end is provided with the light source chamber (4) that is cavity; The insulating barrier (5) that the center that is provided with in the said light source chamber (4) has groove (5a); Insulating barrier (5) is fitted with light source chamber (4) diapire, and led chip (1) is fixed in the groove (5a) of insulating barrier, and said insulating barrier (5) is used for fixing a mounted lens (6) of led chip (1) and forms sealing; Said light source chamber mouth end is provided with inner stopper (7), and this inner stopper (7) assembling bright dipping shade assembly also forms sealing; The end face axial of the little head end of said radiator is provided with electric panel room (8); Be provided with cable-through hole (9) between said electric panel room (8) and the light source chamber (4); Said electrical fitting (3) is installed in the electric panel room (8), and the lead of electrical fitting (10) passes cable-through hole (9) and is connected with insulating barrier (5) in the light source chamber.
2. the implement device of LED encapsulation according to claim 1, it is characterized in that: the outer wall of said radiator (2) is provided with some fin (2a).
3. the implement device of LED encapsulation according to claim 1, it is characterized in that: said insulating barrier (5) is provided with the open slot (5b) of stepping down for lead, is inlaid with the conducting block (11) that is used to connect lead in this open slot (5b).
4. according to the implement device of claim 1 or 3 described LED encapsulation, it is characterized in that: the lead (10) of lead of led chip (12) and electrical fitting all is connected on the conducting block (11) in the insulating barrier open slot.
5. the implement device of LED encapsulation according to claim 1, it is characterized in that: said inner stopper (7) diapire is provided with annular groove (71), circumferentially is evenly equipped with some convexities (72) on the inner stopper sidewall, is equipped with locating slot (72a) on each convexity.
6. according to the implement device of claim 1 or 5 described LED encapsulation; It is characterized in that: said bright dipping shade assembly comprises light shield (13), sealing ring (14) and trim ring (15); Sealing ring (14) is located in the annular groove (71) of inner stopper; Go out light shield (13) and push down sealing ring (14), be pressed into through trim ring (15) in the locating slot (72a) on the convexity of inner stopper, will go out light shield (13) and press-fit the inner stopper (7) that is fixed on light source chamber and form sealing.
7. the implement device of LED encapsulation according to claim 1, it is characterized in that: said electrical fitting (3) is provided with pin (3a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200142579U CN202521278U (en) | 2012-01-13 | 2012-01-13 | Device for realizing light-emitting diode (LED) packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200142579U CN202521278U (en) | 2012-01-13 | 2012-01-13 | Device for realizing light-emitting diode (LED) packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202521278U true CN202521278U (en) | 2012-11-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200142579U Expired - Fee Related CN202521278U (en) | 2012-01-13 | 2012-01-13 | Device for realizing light-emitting diode (LED) packaging |
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| Country | Link |
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| CN (1) | CN202521278U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206624A (en) * | 2012-01-13 | 2013-07-17 | 重庆四联光电科技有限公司 | Device for realizing LED (Light Emitting Diode) encapsulation |
-
2012
- 2012-01-13 CN CN2012200142579U patent/CN202521278U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206624A (en) * | 2012-01-13 | 2013-07-17 | 重庆四联光电科技有限公司 | Device for realizing LED (Light Emitting Diode) encapsulation |
| CN103206624B (en) * | 2012-01-13 | 2015-06-17 | 重庆四联光电科技有限公司 | Device for realizing LED (Light Emitting Diode) encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20190113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |