CN202491316U - Wafer cutting tool - Google Patents
Wafer cutting tool Download PDFInfo
- Publication number
- CN202491316U CN202491316U CN2012200164154U CN201220016415U CN202491316U CN 202491316 U CN202491316 U CN 202491316U CN 2012200164154 U CN2012200164154 U CN 2012200164154U CN 201220016415 U CN201220016415 U CN 201220016415U CN 202491316 U CN202491316 U CN 202491316U
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- Prior art keywords
- cutting tool
- disk body
- wafer cutting
- blade
- utility
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Abstract
The utility model discloses a wafer cutting tool which comprises a round disc body and a blade, wherein the disc body is provided with a first lateral surface, and the blade is arranged at the outer edge of the first lateral surface of the disc body and comprises aring-plate-shapedmetal base material and a plurality of abrasive particles embedded on the surface of the metal base material. Compared with the existing resin blade, the ring-plate-shaped metal base material of the blade of the wafer cutting tool has higher rigidity and can provide higher cutting speed, so that output efficiency improvement is benefited.
Description
Technical field
The utility model relates to a kind of cutting appliance, and particularly relevant for a kind of wafer cutting tool, its metal base is inlayed the blade that abrasive particle constitutes and helped to promote cutting efficiency.
Background technology
General semiconductor crystal wafer can pass through the manufacture process that is divided into crystal grain together; When desiring to carry out the step of cutting crystal wafer; The dealer normally cuts corresponding to the surface of wafer through a dicing saws, with the crystal grain cutting that is made on the wafer separately, so that follow-up work.Wafer rear can attach glued membrane (tape) and place on the framework before cutting.Said glued membrane is crystal grain fixedly, avoids in when cutting stressed inequality of crystal grain and cause the cutting quality bad, and cutting back glued membrane can guarantee that also crystal grain can not collide each other in the process of transporting simultaneously.
Aforementioned dicing saws mainly is to utilize cutter, cooperates the motor shaft of rotation at a high speed, carries out cutting work.Please refer to as shown in Figure 1; Fig. 1 discloses the side of existing wafer cutting tool and cuts open sketch map; Said cutter comprises a disk body 9 and a blade 8, and said disk body 9 is in the form of annular discs, and said blade 8 is loop shaped and is arranged at the outer rim of said disk body 9; The motor shaft of dicing saws can drive the rotation at a high speed of said disk body 9, and utilizes 8 pairs of wafers of blade to carry out cutting work.Further with reference to shown in Figure 1A, Figure 1A is the partial enlarged drawing of the blade 8 of Fig. 1, and said blade 8 includes 1 base material 80 and a plurality of abrasive particle 81 that is laid in base material 80 surfaces, and said abrasive particle 81 helps said blade 8 on wafer, to carry out grinding and cutting at a high speed.
Though above-mentioned wafer cutting tool can be accomplished the wafer cutting; But the blade 8 employed base materials 80 of existing wafer cutting tool are the softer resin base material of quality; Therefore; Its cutting speed (saw speed) should not surpass 5 mm/second usually, will cause base material 80 distortion if speed is too high, and causes the tool marks deflection and can't precisely carry out cutting operation.Therefore, adopt the blade of resin base material to have the slow disappearance of cutting speed, make that the output efficiency of wafer cutting is low, moreover adopt the blade of resin base material also to have the problem that is prone to the abrasion distortion, and improved the cost of cutter maintenance.
So, be necessary to provide a kind of wafer cutting tool, to solve the existing in prior technology problem.
The utility model content
In view of this, the main purpose of the utility model is to provide a kind of wafer cutting tool, and it not only can reach the effect that cutting promotes production capacity efficient fast and effectively, also can save cutter abrasion cost simultaneously.
For reaching the aforementioned purpose of the utility model, the utility model provides a kind of wafer cutting tool, and it comprises:
One disk body, rounded, and have one first side; And
One blade is located at the outer rim of first side of said disk body, and said blade comprises metal base and a plurality of abrasive particle that is embedded in said metallic substrate surface of a ring plate shape.
In an embodiment of the utility model, first side of said disk body has one first external diameter; Said disk body has second side with respect to first side, and said second side has one second external diameter; Said second external diameter is less than first external diameter.
In an embodiment of the utility model, said disk body is a metal base, has a central perforation; First side of said disk body is provided with first depression of a connection central perforation, and second side is provided with second depression of a connection central perforation.
In an embodiment of the utility model, said first external diameter is between 50～60 millimeters; Said second external diameter is between 40～45 millimeters.
In an embodiment of the utility model, said disk body is an aluminum or aluminum alloy.
In an embodiment of the utility model, the central perforation of said disk body has an internal diameter, and said internal diameter is between 15～25 millimeters.
In an embodiment of the utility model, said abrasive particle is a diamond grains.
In an embodiment of the utility model, the thickness of said disk body is between 3～6 millimeters.
In an embodiment of the utility model, the metal base of said ring plate shape is nickel or nickel alloy.
Description of drawings
Fig. 1 is that the side of an existing wafer cutting tool is cutd open sketch map.
Figure 1A is the partial enlarged drawing of Fig. 1.
Fig. 2 is that the side of the utility model one preferred embodiment wafer cutting tool is cutd open sketch map.
Fig. 2 A is the partial enlarged drawing of Fig. 2.
Fig. 2 B is the application sketch map of the utility model one preferred embodiment wafer cutting tool.
The specific embodiment
For making the utility model above-mentioned purpose, characteristic and advantage more obviously understandable, hereinafter is special lifts the utility model preferred embodiment, and conjunction with figs., elaborates as follows.Moreover, the direction term that the utility model is mentioned, for example " on ", D score, " preceding ", " back ", " left side ", " right side ", " interior ", " outward ", " side " etc., only be direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the utility model, but not in order to restriction the utility model.
Please with reference to shown in Figure 2, its summary discloses the side of the utility model one preferred embodiment wafer cutting tool and cuts open sketch map.As shown in the figure, the utility model provides a kind of wafer cutting tool, and it comprises a disk body 10 and a blade 20.
Please with reference to shown in Figure 2, the said disk body 10 of the utility model first embodiment is rounded, and in the present embodiment, said disk body 10 is a metal base, and preferably aluminum or aluminum alloy, and the thickness of said disk body 10 is preferably between 3～6 millimeters.Said disk body 10 has a central perforation 100, and said central perforation 100 has an internal diameter, and said internal diameter is preferably between 15～25 millimeters.Said disk body 10 also has one first side 11 and second side 12 with respect to first side 11, and wherein said first side 11 has one first external diameter, and said second side 12 has one second external diameter; Said second external diameter is less than first external diameter, and in the present embodiment, said first external diameter is preferably between 50～60 millimeters; Said second external diameter is preferably between 40～45 millimeters.Moreover in the present embodiment, first side 11 of said disk body 10 is provided with first depression 110 of a connection central perforation 100, and its second side 12 is provided with second depression 120 of a connection central perforation 100.
Please with reference to shown in Figure 2; Said blade 20 is outer rims of being located at first side 11 of said disk body 10, and please further with reference to shown in Fig. 2 A, said blade 20 comprises metal base 200 and a plurality of abrasive particle 201 of a ring plate shape; Said a plurality of abrasive particle 201 is inlayed the surface that is laid in said metal base 200; In the present embodiment, said abrasive particle 201 is diamond grains preferably, and the metal base of said ring plate shape is preferably nickel or nickel alloy then.The particle diameter of said abrasive particle 201 is preferably between 8 to 50 microns (μ m).
Please, be the application sketch map of the utility model one preferred embodiment wafer cutting tool further with reference to shown in Fig. 2 B.Said disk body 10 can be connected to the rotating shaft of a motor 40 through its central perforation 100, makes said disk body 10 be able to receive motor 40 and drives and rotate.When carrying out cutting crystal wafer, dicing saws can be controlled the surface that disk body 10 moves to a wafer 32, and wherein said wafer can be attached on the glued membrane 31 and place one to take advantage of and carry on the framework 30; Then rotate said disk body 10, make said blade 20 be high speed rotating, and then carry out the action of grinding and cutting in said crystal column surface through motor 40.
Because the blade 20 of the utility model is to adopt metal base 200, its hardness is superior to the prior resin blade relatively, causes deflection so be difficult for receiving drag effects when cutting; Be able to provide cutting speed (saw speed) faster,, can provide 30 mm/second above cutting speed compared to the conventional resins blade; Therefore; The efficient of wafer cutting can obtain significantly to promote, and blade 20 adopts the relation of metal base 200 simultaneously, and it is than the difficult abrasion of resin blade; Has long service life, so can save the cost of cutter.
As stated; Exist the not good efficient of wafer cutting that causes of cutting speed low compared to existing wafer cutting tool; And adopt resin blade to be prone to abrasion and the technical problem of the raising cost of charp tool; The utility model provides a kind of wafer cutting tool, and it is inlayed blade that the metal base of abrasive particle constitutes by the surface and is installed in a disk body outer rim and forms, and the metal base of the ring plate shape of wherein said blade has higher hardness with respect to existing resin blade; Can reach the effect that cutting promotes production capacity efficient fast and effectively, also can save cutter abrasion cost simultaneously.
The utility model is described by above-mentioned related embodiment, yet the foregoing description is merely the example of implementing the utility model.Must be pointed out that disclosed embodiment does not limit the scope of the utility model.On the contrary, being contained in the spirit of claims and the modification and impartial setting of scope includes in the scope of the utility model.
Claims (9)
1. wafer cutting tool, it is characterized in that: said wafer cutting tool comprises:
One disk body, rounded, and have one first side; And
One blade is located at the outer rim of first side of said disk body, and said blade comprises metal base and a plurality of abrasive particle that is embedded in said metallic substrate surface of a ring plate shape.
2. wafer cutting tool as claimed in claim 1 is characterized in that: first side of said disk body has one first external diameter; Said disk body has second side with respect to first side, and said second side has one second external diameter; Said second external diameter is less than first external diameter.
3. wafer cutting tool as claimed in claim 2 is characterized in that: said disk body is a metal base, has a central perforation; First side of said disk body is provided with first depression of a connection central perforation, and second side is provided with second depression of a connection central perforation.
4. wafer cutting tool as claimed in claim 2 is characterized in that: said first external diameter is between 50～60 millimeters; Said second external diameter is between 40～45 millimeters.
5. wafer cutting tool as claimed in claim 3 is characterized in that: said disk body is an aluminum or aluminum alloy.
6. wafer cutting tool as claimed in claim 3 is characterized in that: the central perforation of said disk body has an internal diameter, and said internal diameter is between 15～25 millimeters.
7. wafer cutting tool as claimed in claim 1 is characterized in that: said abrasive particle is a diamond grains.
8. wafer cutting tool as claimed in claim 1 is characterized in that: the thickness of said disk body is between 3～6 millimeters.
9. wafer cutting tool as claimed in claim 1 is characterized in that: the metal base of said ring plate shape is nickel or nickel alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200164154U CN202491316U (en) | 2012-01-12 | 2012-01-12 | Wafer cutting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200164154U CN202491316U (en) | 2012-01-12 | 2012-01-12 | Wafer cutting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202491316U true CN202491316U (en) | 2012-10-17 |
Family
ID=46997555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200164154U Expired - Lifetime CN202491316U (en) | 2012-01-12 | 2012-01-12 | Wafer cutting tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202491316U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108318971A (en) * | 2018-01-12 | 2018-07-24 | 浙江富春江光电科技有限公司 | A kind of chip of light waveguide exempts from polishing method |
-
2012
- 2012-01-12 CN CN2012200164154U patent/CN202491316U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108318971A (en) * | 2018-01-12 | 2018-07-24 | 浙江富春江光电科技有限公司 | A kind of chip of light waveguide exempts from polishing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121017 |
|
| CX01 | Expiry of patent term |