CN202471762U - Manual test base of chip - Google Patents
Manual test base of chip Download PDFInfo
- Publication number
- CN202471762U CN202471762U CN2011204973492U CN201120497349U CN202471762U CN 202471762 U CN202471762 U CN 202471762U CN 2011204973492 U CN2011204973492 U CN 2011204973492U CN 201120497349 U CN201120497349 U CN 201120497349U CN 202471762 U CN202471762 U CN 202471762U
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- China
- Prior art keywords
- chip
- probe
- needle mould
- pin
- pedestal
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- Expired - Lifetime
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Abstract
The utility model relates to a chip testing field and especially relates to a manual test base of a chip. The manual test base of the chip includes a pedestal. A circuit board is arranged in the bottom of the pedestal. An empty cavity is arranged on the pedestal. The bottom of the empty cavity is provided with a lower needle die fitting with the circuit board. The lower needle die is provided with a probe hole. An upper needle die is arranged above the lower needle die. The upper needle die is provided with a probe hole matching with the probe hole of the lower needle die. The probe hole of the upper needle die and the probe hole of the lower needle die are used for installing double-head spring needle contacting with a pin of the to-be-tested chip and a test plate of the circuit together. The pedestal connects with an upper cover that can be pressed down. When the manual test base of the chip provided by the utility model is in use, the to-be-tested chip disposed on a floating plate of the pedestal is lowered by pressing the upper down. Thus, the spring needle is compressed, thereby making the pin of the to-be-tested chip contact with the probe on the needle die of the pedestal. Therefore, the good electric conduction between the pin of the chip and the test plate of the circuit board is realized, thereby realizing the manual test of the chip. The whole process can be realized through simple manual operations. Thus, the cost investment is reduced substantially and the test precision is high.
Description
Technical field
The utility model relates to the chip testing field, especially manually the chip testing seat.
Background technology
In existing chip test industry, all be the test of carrying out chip each item function with wafer prober generally.In the production test procedure of chip, each pin of each chip to be tested and testing tool are realized simply, fast, is connected accurately and efficiently for ease, need usually with test bench as the connection media; Such mode realizes being connected of tester and chip under test, not only enhances productivity, and also improves measuring accuracy.
Because it is the robotization chip testing seat cost of adapt to producing in enormous quantities is higher, less or need use the manual test seat when reducing enterprise investment in the detection scale.
Summary of the invention
The utility model provides reduction chip testing cost, can carry out chip testing, the measuring accuracy that improves individual chip, a kind of manual chip testing seat of testing efficiency through manually-operated.
To achieve these goals, the utility model adopts following technical scheme:
It comprises a base, and described base bottom is provided with circuit board, and base is provided with a cavity; Bottom is provided with the following needle mould that links to each other with circuit board; Following needle mould is provided with pin hole and is used for the mounting spring probe, and following needle mould top is provided with needle mould, and last needle mould is provided with pin hole and is used for the mounting spring probe; Between last needle mould and the following needle mould double end spring probe is housed; The loam cake that described base connection one can press down.
Preferably, describedly go up the kickboard that needle mould is provided with elastic construction, kickboard is provided with probe aperture and is convenient to probe and passes this hole and contact with chip pin.
Preferably, described elastic construction comprises that the following unsteady copper billet and that is fixed on the following needle mould is fixed in the float copper billet on the needle mould, between described unsteady copper billet down and the float copper billet through spring connection.
Preferably, described upper interior surface is provided with a groove, is provided with a briquetting in the groove.
Preferably, a side of described loam cake and base is connected through a hinge, and a side relative with hinge is provided with the hook that is used to be fixed.
Owing to adopted said structure; The manual chip testing seat of the utility model through pressing down loam cake, makes the chip to be measured that is positioned on the base kickboard descend in use; The compression spring probe; Make the pin of chip to be measured contact, realize the good electrical properties conducting between chip pin and the circuit board testing dish, the manual test of realization chip with probe on the base needle mould.The artificial simple operations of whole process can be accomplished, and significantly reduced the cost input, and the precision that detects is high.
Description of drawings
Fig. 1 is the blast structural representation of the utility model;
Fig. 2 is a deployed configuration synoptic diagram after the assembling of the utility model;
Fig. 3 is a closing structure synoptic diagram after the assembling of this practical information.
Embodiment
In conjunction with Fig. 1-shown in Figure 2; The manual chip testing seat of present embodiment comprises a base 1, and described base 1 bottom is provided with circuit board 2, and base 1 is provided with a cavity 11; Cavity 11 bottoms are provided with the following needle mould 3 that links to each other with circuit board 2; The double end spring needle 31 that is used for contact measured chip stitch is installed on the following needle mould 3, and following needle mould 3 tops are provided with needle mould 4, and last needle mould 4 is provided with the pin hole 41 that probe is crossed; Be provided with elastic construction between last needle mould 4 and the following needle mould 3, the loam cake 5 that described base 1 connection one can press down.Double end spring probe tube shape housing is contained in the hole of needle mould, can do to expose needle mould under two syringe needle state of nature of piston motion.When a syringe needle contacted and is compressed with chip pin, probe had just been realized physical connection with chip pin, but the conducting electric signal.When a syringe needle of probe contacted and is compressed with the circuit board testing dish, probe had just been realized physical connection with circuit board, but the conducting electric signal.Like this, realized that through the double end spring needle chip pin is connected with circuit board testing dish good electrical properties.
Keep a stable station when making chip in being positioned over test bench, increase the stability and the accuracy of testing result, in the present embodiment, described going up on the needle mould 4 is equipped with a kickboard 6, and kickboard 6 is provided with pin hole. Under the state of nature, kickboard come-up protection probe, probe tip is hidden in the pin hole of kickboard; When kickboard is depressed, probe will expose, the contact chip pin.Kickboard is provided with posting, and chip is positioned in the frame, guarantees that chip pin accurately docks with probe
Can keep stable downforce to chip when loam cake 5 is closed, in the present embodiment, described upper interior surface is provided with a groove 51, is provided with a briquetting 52 in the groove 51.
In the present embodiment, a side of described loam cake 5 and base 1 is connected through a rotating shaft 12, is provided with the hook 53 that is used to be fixed with rotating shaft 12 relative sides.
Double end spring probe tube shape housing is contained in the pin hole of kickboard, can do to expose needle mould under two syringe needle state of nature of piston motion.When a syringe needle contacted and is compressed with chip pin, probe had just been realized physical connection with chip pin, but the conducting electric signal.When a syringe needle of probe contacted and is compressed with the circuit board testing dish, probe had just been realized physical connection with circuit board, but the conducting electric signal.Like this, realized that through the double end spring needle chip pin is connected with circuit board testing dish good electrical properties.
Last needle mould is provided with the kickboard of elastic construction, and kickboard is provided with probe aperture and is convenient to probe and passes this hole and contact with chip pin; Under the state of nature, kickboard come-up protection probe, probe tip is hidden in the pin hole of kickboard; When kickboard is depressed, probe will expose, the contact chip pin.Kickboard is provided with posting, and chip is positioned in the frame, guarantees that chip pin accurately docks with probe.
During use; Chip 9 to be measured is installed on the kickboard, and closes loam cake 5, the briquetting 52 in the loam cake 5 presses down chip 9 to be measured; Chip 9 to be measured is together with the elasticity syringe needle of the downward compression spring pin 31 of kickboard at this moment; Make the pin of chip 9 to be measured be connected with spring probe 31, the test panel of circuit board 2 is connected with spring probe 31, and chip pin is connected with the circuit board testing dish like this; Thereby realize being connected of chip to be tested and circuit board, be convenient to each item performance of tester test chip.
The above is merely the preferred embodiment of the utility model; Be not thus the restriction the utility model claim; Every equivalent structure or equivalent flow process conversion that utilizes the utility model instructions and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the utility model.
Claims (5)
1. manual chip testing seat; It is characterized in that: comprise a base, described base bottom is provided with circuit board, and base is provided with a cavity; Bottom is provided with the following needle mould that links to each other with circuit board; Following needle mould is provided with pin hole and is used for the mounting spring probe, and following needle mould top is provided with needle mould, and last needle mould is provided with pin hole and is used for the mounting spring probe; Between last needle mould and the following needle mould double end spring probe is housed; The loam cake that described base connection one can press down.
2. manual chip testing seat as claimed in claim 1 is characterized in that: describedly go up the kickboard that needle mould is provided with elastic construction, kickboard is provided with probe aperture and is convenient to probe and passes this hole and contact with chip pin.
3. manual chip testing seat as claimed in claim 2; It is characterized in that: described elastic construction comprises that the following unsteady copper billet and that is fixed on the following needle mould is fixed in the float copper billet on the needle mould, between described unsteady copper billet down and the float copper billet through spring connection.
4. manual chip testing seat as claimed in claim 3, it is characterized in that: described upper interior surface is provided with a groove, is provided with a briquetting in the groove.
5. manual chip testing seat as claimed in claim 4 is characterized in that: a side of described loam cake and base is connected through a hinge, and a side relative with hinge is provided with the hook that is used to be fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204973492U CN202471762U (en) | 2011-12-02 | 2011-12-02 | Manual test base of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204973492U CN202471762U (en) | 2011-12-02 | 2011-12-02 | Manual test base of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202471762U true CN202471762U (en) | 2012-10-03 |
Family
ID=46919914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204973492U Expired - Lifetime CN202471762U (en) | 2011-12-02 | 2011-12-02 | Manual test base of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202471762U (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104181348A (en) * | 2014-08-19 | 2014-12-03 | 昆山瑞鸿诚自动化设备科技有限公司 | Floating probe mold mechanism |
| CN105004888A (en) * | 2014-11-10 | 2015-10-28 | 成都振芯科技股份有限公司 | Adjustable test tool for integrated circuit |
| CN105136312A (en) * | 2015-09-22 | 2015-12-09 | 中国科学院上海技术物理研究所 | Elasticity testing socket for low-temperature application |
| CN105789077A (en) * | 2014-12-22 | 2016-07-20 | 茂丞科技股份有限公司 | Fingerprint identification chip detection device and operation method thereof |
| CN106841691A (en) * | 2015-12-04 | 2017-06-13 | 三星电子株式会社 | Pin and semiconductor package part test system |
| CN108051732A (en) * | 2018-01-15 | 2018-05-18 | 歌尔股份有限公司 | A kind of test device of integrated circuit plate |
| CN108181489A (en) * | 2018-01-05 | 2018-06-19 | 郑州信大捷安信息技术股份有限公司 | TF card test bench |
| CN108459179A (en) * | 2018-03-26 | 2018-08-28 | 长江存储科技有限责任公司 | Apparatus for testing chip |
| CN108761860A (en) * | 2018-05-23 | 2018-11-06 | 昆山龙雨智能科技有限公司 | A kind of display screen detection device |
| CN108761861A (en) * | 2018-05-23 | 2018-11-06 | 昆山龙雨智能科技有限公司 | A kind of screen detection device |
| CN108845241A (en) * | 2018-05-07 | 2018-11-20 | 北京中微普业科技有限公司 | A kind of high-power chip test ground connection heat dissipation platform and its test method |
| CN109239575A (en) * | 2018-08-01 | 2019-01-18 | 上海移远通信技术股份有限公司 | A kind of detection device, detection method and automated detection system |
| CN109884507A (en) * | 2019-03-20 | 2019-06-14 | 苏州和林微纳科技有限公司 | QFN chip high-frequency test seat |
| CN112083313A (en) * | 2020-09-11 | 2020-12-15 | 苏州韬盛电子科技有限公司 | Test fixture of ultra-thin naked die IGBT chip |
| CN113740699A (en) * | 2020-05-14 | 2021-12-03 | 中山市江波龙电子有限公司 | Test socket, control method thereof, test device and storage medium |
| CN114879018A (en) * | 2022-06-21 | 2022-08-09 | 上海捷策创电子科技有限公司 | Chip testing device |
| TWI800187B (en) * | 2021-11-12 | 2023-04-21 | 大陸商環維電子(上海)有限公司 | A microneedle floating test tool and test module |
-
2011
- 2011-12-02 CN CN2011204973492U patent/CN202471762U/en not_active Expired - Lifetime
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104181348A (en) * | 2014-08-19 | 2014-12-03 | 昆山瑞鸿诚自动化设备科技有限公司 | Floating probe mold mechanism |
| CN105004888A (en) * | 2014-11-10 | 2015-10-28 | 成都振芯科技股份有限公司 | Adjustable test tool for integrated circuit |
| CN105004888B (en) * | 2014-11-10 | 2017-11-24 | 成都振芯科技股份有限公司 | A kind of adjustable integrated circuit measurement jig |
| CN105789077A (en) * | 2014-12-22 | 2016-07-20 | 茂丞科技股份有限公司 | Fingerprint identification chip detection device and operation method thereof |
| CN105136312A (en) * | 2015-09-22 | 2015-12-09 | 中国科学院上海技术物理研究所 | Elasticity testing socket for low-temperature application |
| CN106841691A (en) * | 2015-12-04 | 2017-06-13 | 三星电子株式会社 | Pin and semiconductor package part test system |
| CN106841691B (en) * | 2015-12-04 | 2020-05-01 | 三星电子株式会社 | Pin and semiconductor package testing system |
| CN108181489A (en) * | 2018-01-05 | 2018-06-19 | 郑州信大捷安信息技术股份有限公司 | TF card test bench |
| CN108051732A (en) * | 2018-01-15 | 2018-05-18 | 歌尔股份有限公司 | A kind of test device of integrated circuit plate |
| CN108459179A (en) * | 2018-03-26 | 2018-08-28 | 长江存储科技有限责任公司 | Apparatus for testing chip |
| CN108845241A (en) * | 2018-05-07 | 2018-11-20 | 北京中微普业科技有限公司 | A kind of high-power chip test ground connection heat dissipation platform and its test method |
| CN108761861A (en) * | 2018-05-23 | 2018-11-06 | 昆山龙雨智能科技有限公司 | A kind of screen detection device |
| CN108761860A (en) * | 2018-05-23 | 2018-11-06 | 昆山龙雨智能科技有限公司 | A kind of display screen detection device |
| CN108761860B (en) * | 2018-05-23 | 2024-01-23 | 昆山龙雨智能科技有限公司 | Display screen detection device |
| CN108761861B (en) * | 2018-05-23 | 2024-01-30 | 昆山龙雨智能科技有限公司 | Screen detection device |
| CN109239575A (en) * | 2018-08-01 | 2019-01-18 | 上海移远通信技术股份有限公司 | A kind of detection device, detection method and automated detection system |
| CN109884507A (en) * | 2019-03-20 | 2019-06-14 | 苏州和林微纳科技有限公司 | QFN chip high-frequency test seat |
| CN113740699A (en) * | 2020-05-14 | 2021-12-03 | 中山市江波龙电子有限公司 | Test socket, control method thereof, test device and storage medium |
| CN112083313A (en) * | 2020-09-11 | 2020-12-15 | 苏州韬盛电子科技有限公司 | Test fixture of ultra-thin naked die IGBT chip |
| TWI800187B (en) * | 2021-11-12 | 2023-04-21 | 大陸商環維電子(上海)有限公司 | A microneedle floating test tool and test module |
| CN114879018A (en) * | 2022-06-21 | 2022-08-09 | 上海捷策创电子科技有限公司 | Chip testing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Kun Kun science and Technology Industrial Co., Ltd. Assignor: Jin Yingjie Contract record no.: 2012440020281 Denomination of utility model: Manual test base of chip Granted publication date: 20121003 License type: Exclusive License Record date: 20121109 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121003 |
|
| CX01 | Expiry of patent term |