CN202465291U - Novel device for producing fused silicon powder used for encapsulation of electronic integrated circuits - Google Patents
Novel device for producing fused silicon powder used for encapsulation of electronic integrated circuits Download PDFInfo
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- CN202465291U CN202465291U CN2012200983771U CN201220098377U CN202465291U CN 202465291 U CN202465291 U CN 202465291U CN 2012200983771 U CN2012200983771 U CN 2012200983771U CN 201220098377 U CN201220098377 U CN 201220098377U CN 202465291 U CN202465291 U CN 202465291U
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- transfer roller
- encapsulation
- electronic integrated
- crusher
- machine
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Abstract
The utility model discloses a novel device for producing fused silicon powder used for encapsulation of electronic integrated circuits, and belongs to the field of finish machining of quartz stones. The device takes a water washing machine, a crusher, an acid tank, a high-temperature sintering oven, a magnetic separator, a grinding machine and a grader as equipment and takes high-grade quartz stones as raw material, and the high-grade quartz stones are processed through a series of processes including crushing, acid washing, water washing, high-temperature fusing, crushing magnetic separation, grinding, magnetic separation and the like. The process flow has the main advantages that universal equipment is used, the investment is small, no sewage water or waste gas is discharged, high quality fused silicon powder used for encapsulation of electronic integrated circuits can be produced in large batches, and the product is a preferred material used for encapsulation of electronic integrated circuits.
Description
Technical field
The utility model belongs to quartzite precision work field, and relating in particular to a kind of is the production equipment of primary industry production electronic integrated circuit encapsulation with the molten silicon micro mist with high grade quartz stone.
Background technology
It is a kind of product that makes through the processing of series of process such as fusion, grinding as raw material with high grade quartz stone that the molten silicon micro mist is used in the unicircuit encapsulation; The content of its silicon-dioxide is not less than 99.8%; With selected high grade quartz stone fusion in high temperature sintering furnace, melt temperature is 1800 ℃-1900 ℃ during production, and the fusion time is to become molten state after 11-15 hour; Become the solid fused quartz after the cooling; Because its atomic structure long-range is unordered, its three-dimensional structure is cross-linked to make that it has that resistance to elevated temperatures is strong, thermal expansivity is low, hardness is high, wear resistance is good, printing opacity refrangibility, piezoelectric property are excellent, thereby of many uses.Can be used as the starting material of industries such as refractory materials, Ceramic Material, poured with epoxy resin, electronic integrated circuit encapsulation.The electronic integrated circuit encapsulation is meant the circuit pin on the silicon chip; Connect with lead and to guide to external lug place; So that be connected with other device, these pins are connected with other devices through the lead on the printed substrate again, thereby realize being connected of inside chip and external circuit.Electronic integrated circuit encapsulation is in playing IC chip bonding point and the outside effect that is electrically connected; Also IC chip is played machinery or environment protection effect; Thereby make IC chip ability works better; And guarantee that it has high stability and safety; Therefore packaged material should have stronger mechanical property, good electric property, heat dispersion and chemicalstability, the difference that encapsulation requires according to electronic integrated circuit, and the molten silicon micro powder granule degree of use is generally the 300-3000 order.The utility model is that a kind of specification is that the encapsulation of 300-3000 purpose electronic integrated circuits is with molten silicon micro mist production equipment; This device is an equipment with rinsing machine, crusher, sour pond, high temperature sintering furnace, magnetic separator, shredder, grading machine; With high grade quartz stone is raw material; Through series of process such as the fragmentation of high grade quartz stone, pickling, washing, high-temperature fusion, fragmentation, magnetic separation, grinding, magnetic separation are processed, the major advantage of this technical process is: use general-purpose equipment, less investment, no sewage exhaust gas emission, can mass-produce high-quality electronic integrated circuit encapsulation and use the molten silicon micro mist.
Summary of the invention
The problem that the utility model mainly solves provides the mechanism of a kind of suitability for industrialized production electronic integrated circuit encapsulation with the molten silicon micro mist; This device is made up of rinsing machine, crusher, sour pond, high temperature sintering furnace, magnetic separator, shredder, grading machine, and its advantage is: use that general-purpose equipment, less investment, technology are simple, no sewage exhaust gas emission, can mass-produce high-quality electronic integrated circuit and encapsulate and use the molten silicon micro mist.
The technical scheme that the utility model adopts is:
A kind of electronic integrated circuit encapsulation comprises with molten silicon micro mist production equipment: rinsing machine 1, crusher 2, sour pond 3, high temperature sintering furnace 4, magnetic separator 5, shredder 6, grading machine 7; Rinsing machine 1 is provided with high grade quartz stone import 8, and rinsing machine 1 is provided with transfer roller 9 to 2 of crushers, and crusher 2 is provided with transfer roller 10 to 3 in sour pond; Acid pond 3 is provided with transfer roller 11 to 1 of rinsing machine, and rinsing machine 1 is provided with transfer roller 12 to 4 of high temperature sintering furnaces, and high temperature sintering furnace 4 is provided with transfer roller 13 to 2 of crushers; Crusher 2 is provided with transfer roller 14 to 5 of magnetic separators, and magnetic separator 5 is provided with transfer roller 15 to 6 of shredders, and shredder 6 is provided with induced draft fan 16 to 7 in grading machine; Grading machine 7 is provided with feed back pipe 17 between the shredder 6; Grading machine 7 is provided with discharge port 18, and grading machine 7 is provided with transfer roller 19 between the magnetic separator 5, and magnetic separator 5 is provided with product outlet 20.
The further technical scheme of the utility model is:
Described whole transfer roller is a rotary conveyor.
Described feed back pipe 17 is a wind-force feed back pipe.
The beneficial effect of the utility model is: provide a kind of novel electron unicircuit encapsulation with molten silicon micro mist production equipment; The advantage of this device is: use general-purpose equipment, less investment, no sewage exhaust gas emission, can mass-produce high-quality electronic integrated circuit encapsulation and use the molten silicon micro mist; Series of advantages such as that product has is high temperature resistant, low-thermal-expansion, hardness is higher, wear resistance good, printing opacity refraction performance, piezoelectric property excellence are the preferred material that the electronic integrated circuit encapsulation is used.
Description of drawings:
Like figure is the utility model principle schematic.
Embodiment
1. the quartzite of high-quality bulk is sent into rinsing machine 1 through 8, use high pressure water washing, remove dirt settling on the quartzite, the boulder diamond stone after will washing is then sent into crusher 2 through transfer roller 9, is broken for the quartz wedge that granularity is 2mm-20mm.
2. the quartz wedge after the fragmentation is sent into sour pond through transfer roller 10; Use the mixing acid of concentration presses 3:1 as Hydrogen chloride and the concentration of 10%-15% as the hydrofluoric acid of 45%-47% mixed to soak 75-80 hour, the purpose of pickling is to remove dirt settling contained in the silica sand and MOX.
3. after the quartz wedge after mixing acid being soaked is pulled out; Send into rinsing machine 1 water flushing deacidification through transfer roller 11; The quartz wedge of cleaning is through sending into high temperature sintering furnace 4 through transfer roller 12; Transferring the interior temperature of stove is 1800 ℃-1900 ℃, and fusing time is 11-15 hour, makes the interior quartzite of stove become molten state.
4. stop after fusing finishes being cooled to the solid fused quartz that obtains bulk after normal temperature cools off to the high temperature sintering furnace power supply, quartz wedge is sent into crusher 2 fragmentations through transfer roller 13 after physical shock, is broken for the quartz particles of 5mm-10mm.
5. the quartz particles of 5mm-10mm is sent into magnetic separator 5 through transfer roller 14 and carry out magnetic separation, the magnetic separation time is 0.2-0.3 hour, will contain magnetic, the removal of metallic quartz particles.
6. quartz particles after the magnetic separation is sent into shredder 6 through transfer roller 15 and grinds, input speed and the discharging speed equilibrium of control shredder, for the 1.4-1.5 ton/hour; The rotating speed of shredder is 23-25 rev/min, and milling time is controlled to be 128-700 minute, and the powder after the grinding is delivered to grading machine 7 through induced draft fan 16 wind; Granularity is returned shredder 6 continuation grindings greater than the feed back pipe 17 that passes through of 300 order silicon powders; Granularity is that granularity reserves for other use through 18 dischargings packing less than 3000 purpose silicon powders, and 300-3000 purpose silicon powder is sent into magnetic separator 5 through transfer roller 19, will contain magnetic and metallic silicon powder and remove; The magnetic separation time is 0.3-0.5 hour; Obtain electronic integrated circuit package specific molten silicon micro mist after the magnetic separation, the content of its silicon-dioxide is more than 99.8%, through obtaining finished product after the discharge port 20 dischargings packing.
Claims (3)
1. a novel electron unicircuit encapsulation is characterized in that: comprise rinsing machine (1), crusher (2), sour pond (3), high temperature sintering furnace (4), magnetic separator (5), shredder (6), grading machine (7) with molten silicon micro mist production equipment; Rinsing machine (1) is provided with high grade quartz stone import (8); Rinsing machine (1) is provided with transfer roller (9) between crusher (2); Crusher (2) is provided with transfer roller (10) between sour pond (3), and sour pond (3) are provided with transfer roller (11) between rinsing machine (1), and rinsing machine (1) is provided with transfer roller (12) between high temperature sintering furnace (4); High temperature sintering furnace (4) is provided with transfer roller (13) between crusher (2); Crusher (2) is provided with transfer roller (14) between magnetic separator (5), and magnetic separator (5) is provided with transfer roller (15) between shredder (6), and shredder (6) is provided with induced draft fan (16) between grading machine (7); Grading machine (7) is provided with feed back pipe (17) between the shredder (6); Grading machine (7) is provided with discharge port (18), and grading machine (7) is provided with transfer roller (19) between the magnetic separator (5), and magnetic separator (5) is provided with product outlet (20).
2. a kind of novel electron unicircuit encapsulation according to claim 1 is with molten silicon micro mist production equipment, and it is characterized in that: described whole transfer rollers are rotary conveyor.
3. a kind of novel electron unicircuit encapsulation according to claim 1 is with molten silicon micro mist production equipment, and it is characterized in that: described feed back pipe 17 is wind-force feed back pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200983771U CN202465291U (en) | 2012-03-16 | 2012-03-16 | Novel device for producing fused silicon powder used for encapsulation of electronic integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200983771U CN202465291U (en) | 2012-03-16 | 2012-03-16 | Novel device for producing fused silicon powder used for encapsulation of electronic integrated circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202465291U true CN202465291U (en) | 2012-10-03 |
Family
ID=46913471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200983771U Expired - Fee Related CN202465291U (en) | 2012-03-16 | 2012-03-16 | Novel device for producing fused silicon powder used for encapsulation of electronic integrated circuits |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202465291U (en) |
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2012
- 2012-03-16 CN CN2012200983771U patent/CN202465291U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20130316 |