CN202462784U

CN202462784U - Die structure

Info

Publication number: CN202462784U
Application number: CN2011205394270U
Authority: CN
Inventors: 张永波
Original assignee: Mitac Precision Technology Kunshan Ltd
Current assignee: Mitac Precision Technology Kunshan Ltd
Priority date: 2011-12-21
Filing date: 2011-12-21
Publication date: 2012-10-03
Anticipated expiration: 2021-12-21

Abstract

The utility model relates to a die structure, which comprises a core insert, a cavity insert, a heat conductor and a waterway, wherein the core insert is used for molding a product; the cavity insert is matched with the core insert to mold the product; the heat conductor is arranged under a region of the product, which needs to be deformed, in the core insert; the thermal conductivity of the heat conductor is larger than the thermal conductivity of the core insert and the cavity insert; and the waterway is arranged under the heat conductor, and enables the heat conductor to warm and cool. The die structure can change a deformation direction of the product arbitrarily when being used for molding products with long length and thin thickness, and has a simple structure and convenient and quick production process.

Description

Mould structure

[technical field]

The utility model relates to a kind of mould structure, is specifically related to a kind of mould structure that can change the product deformation direction.

[background technology]

General length is long but plastic cement products that thickness is relatively thinner; Because characteristics of product; In moulding after-contraction direction all is that two from product begins the contraction distortion warpage, first product 10 as shown in Figure 1, thus be that product two ends 11 are shunk and become warpages after these first product, 10 moulding.

Yet the specification that different clients or different vendor require is different, and client or manufacturer can require product warpage in the opposite direction of the longer thinner thickness of length sometimes; Second product 20 as shown in Figure 2; Thereby the zone line of this second product 20 21 shrinks and becomes warpages, and two kinds of methods are arranged this moment: first method is the deformation direction through board adjustment product, yet this method all is same temperature during ejection formation at every turn; And can cause mold temperature too high, the ejaculation cycle is long; Second method is to adopt secondary ejecting mechanism, yet this method causes mould structure complicated, and die cost improves, and the Mould Machining time is long.

In view of this, be necessary to develop a kind of novel mould structure in fact, this mould structure can change the deformation direction of product arbitrarily when the product of the long thin thickness type of moulding length, and simple in structure, and production process is fast convenient.

[summary of the invention]

Therefore, the purpose of the utility model provides a kind of novel mould structure, and this mould structure can change the deformation direction of product arbitrarily when the product of the long thin thickness type of moulding length, and simple in structure, and production process is fast convenient.

In order to achieve the above object, the mould structure of the utility model, it comprises:

Male model benevolence, this male model benevolence is used for shaped article;

Mother module core, this mother module core cooperates shaped article with above-mentioned male model benevolence;

Heat carrier, it is located at the below of product need deformed region in the above-mentioned male model benevolence, and this heat carrier thermal conductivity is greater than the thermal conductivity of male model benevolence and mother module core;

The water route, it is located at above-mentioned heat carrier below, and this water route heats up above-mentioned heat carrier and cooling.

Especially, said heat carrier is that beryllium copper is gone into son.

Especially, the quantity of said heat carrier is two.

Especially, the quantity in said water route is two.

Compared to prior art; The mould structure of the utility model is when the product of the long thin thickness type of moulding length; Through adopting the heat carrier of thermal conductivity greater than male model benevolence and mother module core, improve the temperature that product needs deformed region, can change the deformation direction of product arbitrarily with this; And simple in structure, production process is fast convenient.

[description of drawings]

Fig. 1 illustrates a kind of product sketch map of deformation direction.

Fig. 2 illustrates the product sketch map of another kind of deformation direction.

Fig. 3 illustrates the schematic perspective view of the utility model mould structure preferred embodiment.

Fig. 4 illustrates the vertical view of the utility model mould structure preferred embodiment.

Fig. 5 illustrates the side view of the utility model mould structure preferred embodiment.

[specific embodiment]

Please consult Fig. 3, Fig. 4 and shown in Figure 5 simultaneously, it is respectively schematic perspective view, vertical view and the side view of the utility model mould structure.

In preferred embodiment, when the product 500 of the long thin thickness type of this kind length needed deformed region 501 to be zone line, the mould structure of the utility model comprised:

Male model benevolence 100, this male model benevolence 100 is used for shaped article 500;

Mother module core 200, this mother module core 200 cooperates shaped article 500 with above-mentioned male model benevolence 100;

Heat carrier 300, it is located at the both sides of product 500 need deformed regions 501 zone lines in the above-mentioned male model benevolence 200, and the quantity of this heat carrier 300 is two; This heat carrier 300 has very high heat conductivility; Higher with the material thermal conductivity of mother module core 200 than male model benevolence 100, this heat carrier 300 is gone into son for beryllium copper in present embodiment, and it is a kind of supersaturated solid solution that this beryllium copper is gone into son; Have very high heat conductivility, higher than male model benevolence 100 with the material thermal conductivity of mother module core 200;

Water route 400, its quantity are two, and it is located at above-mentioned heat carrier 300 belows respectively, and this water route 400 is rapidly heated above-mentioned heat carrier 300 and lowers the temperature.

When moulding product 500; Feeding liquid in the water route 400 is rapidly heated above-mentioned heat carrier 300 and lowers the temperature; Because the heat conductivility of heat carrier 300 is greater than the heat conductivility of male model benevolence 100 with mother module core 200 materials, therefore, heat carrier 300 can heat up and cool off compared to male model benevolence 100 and mother module core 200 apace; Thereby change the temperature that product 500 needs deformed region 501 zone lines; Need deformed region 501 zone lines of product 500 are upwards shunk,, reach the deformation effect of envisioning among Fig. 2 with this buckling deformation direction that changes product 500.

The above is merely the preferred embodiment of the utility model mould structure, in other embodiment of the utility model mould structure, can also change product 500 other regional deformation directions.

Compared to prior art; The mould structure of the utility model is when the product of the long thin thickness type of moulding length; Through adopting the heat carrier of thermal conductivity greater than male model benevolence and mother module core, improve the temperature that product needs deformed region, change the deformation direction of product arbitrarily with this; And simple in structure, production process is fast convenient.

Claims

1. a mould structure is characterized in that, this mould structure comprises:

Male model benevolence, this male model benevolence is used for shaped article;

2. mould structure according to claim 1 is characterized in that, said heat carrier is that beryllium copper is gone into son.

3. mould structure according to claim 1 and 2 is characterized in that, the quantity of said heat carrier is two.

4. mould structure according to claim 1 is characterized in that, the quantity in said water route is two.