CN202452281U - Integrated backlight module made of conductive chemically toughened glass - Google Patents
Integrated backlight module made of conductive chemically toughened glass Download PDFInfo
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- CN202452281U CN202452281U CN2011205284783U CN201120528478U CN202452281U CN 202452281 U CN202452281 U CN 202452281U CN 2011205284783 U CN2011205284783 U CN 2011205284783U CN 201120528478 U CN201120528478 U CN 201120528478U CN 202452281 U CN202452281 U CN 202452281U
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Abstract
The utility model discloses an integrated backlight module made of conductive chemically toughened glass, a manufacturing method for forming the integrated backlight module by taking the conductive chemically toughened glass as a base material and application of the integrated backlight module. The integrated backlight module comprises a diffusion layer, a light guide layer, an optical micro structure layer, a transparent light transmittance layer, a reflection layer and a luminous source electrode conductive heat radiation module. The integrated backlight module is manufactured by a lithography photochemical erosion technology, a printing and coating technology and an ultrasonic hot-pressing splicing and attaching technology; the integrated backlight module made of the conductive chemically toughened glass has the advantages of high brightness, ultra-thinning and high-efficiency manufacturing; due to the design of the product, direct-type incident light and lateral-type incident light can be distinguished; and the integrated backlight module is mainly applied to lighting or self-non-luminous displays.
Description
Technical field
The relevant one-body molded module backlight of a kind of conduction chemically reinforced glass of the utility model particularly uses little shadow photochemical etching manufactured optical microstructures and utilization ultrasonic wave hot pressing fusion techniques the hot pressing of light emitting source electrodes conduct heat radiation module to be attached to the module backlight that forms on the one-body molded module conduction chemically reinforced glass electrode circuit backlight.
Background technology
Along with the progressive LCD of science and technology is used widely in electronic products such as mobile phone, notebook computer, panel computer, digital camera and LCD TV; But because of LCD is not that autonomous light-emitting component only has the control switch feature, so it need could produce Presentation Function by the face type light source of module backlight.
As shown in Figure 1; Perspective exploded view for existing module backlight; As shown in the figure, the structure of existing module 10 backlight can be divided into down straight aphototropism mode set 10 and side incident type module 10 backlight at present; But no matter be which kind module backlight 10 its to form structures similar mostly; Mainly be above diffusion sheet 12, go up prismatic lens 13, prismatic lens 14, diffusion sheet 15, LGP 18, reflector plate 19, glue frame 17, chase 20 and lamp bar 16 stack groups are upright forms down down, attach buffering adhesive 11 again, so its manufacture process all needs the artificial completion group of labor to stand.
Light, thin, short, little design direction along with electronic product develops simultaneously; The more greatly then difficult more slimming of design size of LGP 18, glue frame 17 and chase 20 in the prior art; Last diffusion sheet 12, go up prismatic lens 13, prismatic lens 14 is prepared in respectively on its base material with following diffusion sheet 15 down; Its base material demand thickness is also arranged; Therefore, along with light, thin, short, the little design direction of electronic product, ultrathin typeization, high-effect manufacturing are the present stage non-autonomous active display industry major issue that must solve with improving module briliancy backlight.
Therefore, in view of the main purpose of appeal situation the utility model is to provide a kind of integrated module backlight, can't ultrathin typeization to solve in the prior art, briliancy is difficult improves, makes optical element cost height and prouctiveness than problems such as difficulty liftings.The one-body molded module backlight of the conduction chemically reinforced glass of the utility model is simplified overall process, and overall structure is more frivolous, can not only shorten man-hour, more can promote the product yield, this be the utility model most important spirit place and desire actively to disclose part.
The utility model content
The purpose of the utility model is for providing a kind of conduction chemically reinforced glass one-body molded module backlight; With the conduction chemically reinforced glass is that base material integrates moulding module backlight, and overall structure is formed and included diffusion layer, optical waveguide layer, conductive electrode circuit, optical microstructures layer, transparent logical photosphere, reflecting layer and light emitting source electrodes conduct heat radiation module.
For reaching above-mentioned purpose; The utility model provides a kind of conduction chemically reinforced glass one-body molded module backlight, comprises: an optical waveguide layer transparent base, a conducting film, a diffusion layer, an optical microstructures layer, a transparent logical photosphere, a reflecting layer and light emitting source electrodes conduct heat radiation module.The optical waveguide layer transparent base is lamellar and for the chemically reinforced glass material, its chemically reinforced glass thickness range is 0.1 millimeter to 5 millimeters; But conducting film is transparent and conductive material, on this optical waveguide layer transparent base, forms conductive electrode circuit predetermined image with little shadow photochemical etching method or radium-shine processing method, and its face resistance value scope is 4.5 Ω/ to 650 Ω/; Diffusion layer is used to the colour temperature that makes exiting surface light even diffused be face type light source and can adjust face type light source, can be allocated according to different proportion by transparent resin, diffusion particle and pigment, and its light transmittance scope is 30% to 98%; The optical microstructures layer forms predetermined optical microstructured layers image in the material with high index of refraction on the optical waveguide layer transparent base according to little shadow photochemical etching method or printing rubbing method on this optical waveguide layer base material; Be used to make incident ray to block anaclasis, can adjust predetermined image and adjust the distribution of light of incident light in face type light source module because of its predetermined optical microstructured layers image; Transparent logical photosphere is coated on the reflecting surface of optical waveguide layer transparent base and optical microstructures layer according to the printing rubbing method with the transparent material resin, mainly acts on to make the light that blocks anaclasis without the optical microstructures layer pass to the reflecting layer; The reflecting layer mainly acts on the light that makes through transparent logical photosphere, and reflection passes to optical waveguide layer, blocks anaclasis to diffusion layer through the optical microstructures layer again; The conductive electrode circuit of light emitting source electrodes conduct heat radiation module on the predetermined image of conducting film passes through ultrasonic wave hot pressing burning-on method with elements such as most light emitting diodes, heat sink, flexible circuit boards with conductive material; Attach with conductive electrode circuit hot pressing on the predetermined image of conducting film and to be connected; Mainly acting as provides incident light source in integrated module backlight and the display that is connected illumination or non-self-luminosity; The conduction chemically reinforced glass is made one-body molded module backlight; The single-point range of structures that it is characterized in that this optical microstructures layer is 0.028 micron to 200 microns with little shadow photochemical etching manufactured, is fabricated to 10 microns to 200 microns with the printing rubbing method.
The utility model has solved in the prior art can't ultrathin typeization, briliancy is difficult improves, makes problems such as optical element cost height and the difficult lifting of prouctiveness.The one-body molded module backlight of the conduction chemically reinforced glass of the utility model is simplified overall process, and overall structure is more frivolous, can not only shorten man-hour, more can promote the product yield,
Description of drawings
Fig. 1 is existing module perspective exploded view backlight.
Fig. 2 is the conduction chemically reinforced glass generalized section of the utility model.
Fig. 3 makes the schematic perspective view of one-body molded module backlight one preferred embodiment for the conduction chemically reinforced glass of the utility model.
Fig. 4 is the A part enlarged drawing of Fig. 3.
Fig. 5 makes the decomposing schematic representation of one-body molded module backlight one preferred embodiment for the conduction chemically reinforced glass of the utility model.
Fig. 6 is the vertical view of effective district of the optics of Fig. 5 and optics dead space.
Fig. 7 is exiting surface and the reflecting surface generalized section of Fig. 5.
Description of reference numerals
(convention)
(the utility model)
The specific embodiment
Below by the embodiment of particular specific embodiment explanation the utility model, be familiar with other advantage and effect that these technological personnel can be understood the utility model easily by the content that this specification disclosed.
The embodiment of the graphic explanation the utility model of following reference; It should be noted, below graphic graphic for the signal of simplifying, the basic conception of the utility model only is described in a schematic way; Only the illustration structure relevant but not component number, shape and plotted when implementing in graphic according to reality with the utility model; Kenel, quantity and the ratio of each element are not to exceed with diagram during its actual implements, and can need change according to actual design, close chat earlier bright.
Please in the lump referring to Fig. 2 to Fig. 7, the one-body molded module 40 backlight of conduction chemically reinforced glass comprises integrated diffusion layer 41, optical waveguide layer 42, optical microstructures layer 43, transparent logical photosphere 44, reflecting layer 45, light emitting source electrodes conduct heat radiation module 46, conductive electrode circuit 47.
By the optical waveguide layer 42 of the chemically reinforced glass 31 in the conduction chemically reinforced glass base material 30 as the one-body molded module 40 backlight of conduction chemically reinforced glass; Conducting film 32 in the base material is made conductive electrode circuit 47 with little shadow photochemical etching or radium-shine etching method again in optics dead space 471; The conductive electrode circuit of having made 47 is made optical microstructures layer 43 with little shadow chemical method for etching or printing rubbing method again after short testing for continuity and radium-shine finishing; Conductive electrode circuit 47 all is to be produced on optical waveguide layer 42 and conducting film 32 reflectings surface 422 with optical microstructures layer 43; But must be when making with its functional functional area separately that is produced on; Conductive electrode circuit 47 is produced on optics dead space 471, and optical microstructures layer 43 is produced on effectively district 431 of optics, and seeing also Fig. 6 and Fig. 7 can clearly appear.
And with the printing rubbing method transparent resin is printed on zone and the optical microstructures layer 43 of conductive electrode circuit 47 except need and light emitting source electrodes conduct heat radiation module 46 forms the electrode points that circuit link and is made into transparent logical photosphere 44.
Again with the printing rubbing method with minute surface silver printing ink with high reflection characteristic or add that titanium dioxide, silver are little, the acrylic resin of nano particle, one or more the printing ink of mixture in the epoxy resin; Be printed on transparent logical photosphere 44 aspects; And on three sides of optical waveguide layer 42 and transparent logical photosphere 44 non-light inlets, seeing also the 5th figure can clearly appear.
Then with the printing rubbing method with adding pigment and titanium dioxide, acrylic resin and silica are little, the acrylic resin of nano particle, one or more the printing ink of mixture in the epoxy resin, be printed on the exiting surface 421 of optical waveguide layer 42.
At last light emitting source electrodes conduct heat radiation module 46 is attached to ultrasonic wave hot pressing burning-on method on the conductive electrode circuit 47 of conduction chemically reinforced glass 30 and promptly accomplishes the one-body molded module 40 backlight of conduction chemically reinforced glass.
Particularly, diffusion layer 41 comprises transparent resin and the diffusion particulate that is scattered in this transparent resin; Optical waveguide layer 42 is the substrate of conduction chemically reinforced glass 30 materials and has the characteristic of all-pass light; There is conducting film 32 on its surface; Mainly act on and make conductive electrode circuit 47 in the module optics backlight dead space 471, the follow-up attaching with the hot pressing of ultrasonic wave hot pressing fusion techniques again connects light emitting source electrodes conduct heat radiation module 46 in the one-body molded module 40 backlight of conduction chemically reinforced glass.Conducting films 32 in the effective district 431 of the one-body molded module optics backlight of conduction chemically reinforced glass need not to make conductive electrode circuit 47 and must be etched to optical waveguide layer 42 comprehensively; Then in optical waveguide layer 42 reflectings surface 422 have not had the effective district 431 of optics of conducting film 32; Manufacture effectively district's 431 interior optical microstructures layers 43 of optics with little shadow photochemical etching method or printing rubbing method; Republish the coating transparent resin on optical microstructures layer 43 and optical waveguide layer 42 reflectings surface 422 and form transparent logical photosphere 44, then printing coating reflection layer 45 on three sides that reach optical waveguide layer 42, transparent logical photosphere 44 non-light inlets on transparent logical photosphere 44 aspects.
Light at first gets into optical waveguide layer 42 during use; Light is dispersed through optical waveguide layer 42 again and is blocked anaclasis through optical waveguide layer 42 to diffusion layer 41 through optical microstructures layer 43; The light that blocks anaclasis without optical microstructures layer 43 again through transparent logical photosphere 44 through the reflecting layer 45 reflections through transparent logical photosphere 44, optical waveguide layer 42; Block anaclasis through optical waveguide layer 42 to diffusion layer 41 via optical microstructures layer 43 again, become face type light source by diffusion layer 41 even diffused again.So, light is incident to outgoing from optical waveguide layer 42, and light need not pass through air layer more therebetween, thereby lets the light conduction loss reduce.Therefore, the above-mentioned one-body molded module 40 backlight of conduction chemically reinforced glass has high briliancy, ultrathin typeization, optical element low cost, is easy to improve the advantage of prouctiveness and light utilization.
Though aforesaid description and the graphic preferred embodiment that has disclosed the utility model; But must recognize variously increase, many modifications and replace and possibly be used in the utility model preferred embodiment, and can not break away from the spirit and the scope of the utility model principle that defines like the application.The those skilled in the art that are familiar with the affiliated technical field of the utility model can know from experience, and the utility model can be used in the modification of many forms, structure, layout, ratio, material, element and assembly.Therefore, this paper should be regarded as in order to explanation the utility model in the embodiment that this disclosed, but not in order to restriction the utility model.The scope of the utility model should be defined by the application, and contains its legal equivalents, is not limited to previous description.
Claims (6)
1. a conduction chemically reinforced glass is made one-body molded module backlight, it is characterized in that comprising:
One optical waveguide layer transparent base is lamellar and for the chemically reinforced glass material, its chemically reinforced glass thickness range is 0.1 millimeter to 5 millimeters;
One conducting film is transparent conducting film, on this optical waveguide layer transparent base, forms conductive electrode circuit predetermined image with little shadow photochemical etching method or radium-shine processing method, and its face resistance value scope is 4.5 Ω/ to 650 Ω/;
One diffusion layer, its light transmittance scope is 30% to 98%;
One optical microstructures layer; On this optical waveguide layer base material, form predetermined optical microstructured layers image in the material with high index of refraction on this optical waveguide layer transparent base according to little shadow photochemical etching method or printing rubbing method; Be used to make incident ray to block anaclasis, can adjust predetermined image and adjust the distribution of light of incident light in face type light source module because of its predetermined optical microstructured layers image;
One transparent logical photosphere is coated on the reflecting surface of optical waveguide layer transparent base and optical microstructures layer according to the printing rubbing method with the transparent material resin, mainly acts on to make the light that blocks anaclasis without the optical microstructures layer pass to the reflecting layer;
One reflecting layer mainly acts on the light that makes through transparent logical photosphere, and reflection passes to optical waveguide layer, blocks anaclasis to diffusion layer through the optical microstructures layer again;
One light emitting source electrodes conduct heat radiation module; Conductive electrode circuit on the predetermined image of this conducting film sees through ultrasonic wave hot pressing burning-on method with elements such as most light emitting diodes, heat sink, flexible circuit boards with conductive material; Attach with conductive electrode circuit hot pressing on the predetermined image of conducting film and to be connected, mainly acting as provides incident light source in integrated module backlight and be connected and throw light on or the display of non-self-luminosity.
2. conduction chemically reinforced glass as claimed in claim 1 is made one-body molded module backlight; The single-point range of structures that it is characterized in that this optical microstructures layer is 0.028 micron to 200 microns with little shadow photochemical etching manufactured, is fabricated to 10 microns to 200 microns with the printing rubbing method.
3. conduction chemically reinforced glass as claimed in claim 2 is made one-body molded module backlight, it is characterized in that the used material of this printing rubbing method is a minute surface silver printing ink.
4. conduction chemically reinforced glass as claimed in claim 1 is made one-body molded module backlight, it is characterized in that this conducting film is indium tin oxide or zinc oxide or conducting polymer.
5. conduction chemically reinforced glass as claimed in claim 1 is made one-body molded module backlight, it is characterized in that the used conductive material of this light emitting source electrodes conduct heat radiation module is gold or silver or copper or titanium or tin or platinum or nickel.
6. conduction chemically reinforced glass as claimed in claim 1 is made one-body molded module backlight, it is characterized in that the material of this transparent logical photosphere can be acrylic resin or epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205284783U CN202452281U (en) | 2011-12-16 | 2011-12-16 | Integrated backlight module made of conductive chemically toughened glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205284783U CN202452281U (en) | 2011-12-16 | 2011-12-16 | Integrated backlight module made of conductive chemically toughened glass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202452281U true CN202452281U (en) | 2012-09-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205284783U Expired - Fee Related CN202452281U (en) | 2011-12-16 | 2011-12-16 | Integrated backlight module made of conductive chemically toughened glass |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202452281U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103867963A (en) * | 2012-12-14 | 2014-06-18 | 陈帅龙 | Compound backlight module capable of being inserted in liquid crystal display and manufacturing method thereof |
| US10295728B2 (en) | 2014-10-23 | 2019-05-21 | Corning Incorporated | Light diffusing component and a method of manufacturing a light diffusing component |
-
2011
- 2011-12-16 CN CN2011205284783U patent/CN202452281U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103867963A (en) * | 2012-12-14 | 2014-06-18 | 陈帅龙 | Compound backlight module capable of being inserted in liquid crystal display and manufacturing method thereof |
| US10295728B2 (en) | 2014-10-23 | 2019-05-21 | Corning Incorporated | Light diffusing component and a method of manufacturing a light diffusing component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120926 Termination date: 20181216 |