CN202425190U - Stepped circuit board - Google Patents
Stepped circuit board Download PDFInfo
- Publication number
- CN202425190U CN202425190U CN2011205366497U CN201120536649U CN202425190U CN 202425190 U CN202425190 U CN 202425190U CN 2011205366497 U CN2011205366497 U CN 2011205366497U CN 201120536649 U CN201120536649 U CN 201120536649U CN 202425190 U CN202425190 U CN 202425190U
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- China
- Prior art keywords
- pcb
- base material
- backing plate
- development
- film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model relates to a PCB (Printed Circuit Board), in particular to a stepped circuit board. The stepped circuit board comprises a PCB base material which is covered by a conducting layer; a dry film is glued on the conducting layer and is covered by a negative film for exposure; a backing plate is arranged on the PCB base material; after first development, the backing plate is taken out, and then second development is carried out; the developed PCB is electroplated so that an electroplated layer is formed on the surface of the PCB; the film of the electroplated PCB is removed, and the dry film is washed out; the etched PCB is used for carrying out pattern transfer; and then the tin of the PCB is removed to form an effective pattern. The PCB manufactured by adopting the method can better avoid the phenomena of film sticking instability and the base material exposure.
Description
Technical field
The utility model relates to a kind of pcb board, is specifically related to a kind of step circuit board.
Background technology
Integrated component PCB (Printed Circuit Board, printed circuit board (PCB)) is passive component, for example resistance, electric capacity and inductance etc., respectively or comprehensive integration process to PCB.Pcb board is the supplier that electronic component is electrically connected, and design mainly is a layout design, and advantage is the mistake that significantly reduces the assembling of wiring, has improved automatization level and productive labor rate.In pcb board manufacturing process, need to place backing plate and can prevent that just pad pasting is bad; Develop and need take off backing plate before developing; In getting the backing plate process, backing plate and peripheral broken film are sticked at the two-layer dry film of formation in the plate like this; Cause the surplus glue that develops easily, surplus glue position can't plated with copper tin in subsequent process, can cause during alkali etching and reveal the base material phenomenon.
Summary of the invention
The technical problem that the utility model solves provides a kind of step circuit board, can in manufacturing process, avoid exposing base material.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of step circuit board comprises the PCB base material; Be coated with conductive layer on the PCB base material; On conductive layer, post dry film, be coated with on the dry film and be used to the egative film that makes public, wherein; Place backing plate on the described PCB base material, the back of developing is for the first time taken out backing plate and is carried out second development again; Pcb board after the development is electroplated, and the surface of pcb board forms electrodeposited coating; Pcb board after electroplating is moved back film, wash dry film; Use the etching pcb board to carry out figure transfer; Again pcb board is moved back tin, form active graphical.Conductive layer is a copper foil plate.
Traditional P CB board processing method is the slotted eye that one deck is milled out a certain size, through local continuum in the pressing manufacturing ejecting plate of other one deck the step-like part that is used to install the client is arranged then.Form and step-likely in the flow process manufacturing process of follow-up outer-layer circuit, bring certain difficulty, form easily behind the normal flow step place pad pasting and bubble, the back dry film that causes developing comes off.
The part that will be milled with the PCB substrate material mills out makes the ladder place of pad pad in plate; Can avoid the problems referred to above in the pad pasting dry film process again; Normally doing needs after the exposure in the plate process these backing plates are taken out before development; Carry out copper facing tin after the development, move back film, etching afterwards again, move back tin and finally obtain active graphical.
Pasted dry film on the wherein one side of backing plate; Backing plate top is morcelled film and backing plate peripheral upper portion and is morcelled film and be bonded in together in the taking-up process; With the method for the normal development two-layer dry film that can't develop to fall; Just formed surplus glue after developing in two-layer broken film bonding part at last, surplus glue position is can't plated with copper tin in subsequent process, can cause during alkali etching and reveal the base material phenomenon.
Therefore; Method through placing backing plate before the pad pasting has avoided pad pasting not firm; Keep the state normal development of backing plate in plate through before developing simultaneously; Backing plate is taken out in the back of developing for the first time, but this moment backing plate and PCB between water mark and part developing solution are arranged, can it be removed through second development once more.
Compared with prior art, beneficial effect is: place backing plate on the PCB base material of the utility model, carry out the first time after the exposure and develop, the back of developing is for the first time taken out backing plate and is carried out second development again.Adopt this method manufacturing PCB plate can better avoid the not firm phenomenon of pad pasting, and can avoid revealing the phenomenon of base material.
Description of drawings
Fig. 1 is the making schematic flow sheet of the utility model;
Fig. 2 is the development schematic flow sheet of the utility model;
Fig. 3 is the conductive layer and the backing plate vertical view of the utility model.
Embodiment
As shown in Figure 1, a kind of step circuit board comprises PCB base material 1; Be coated with conductive layer 2 on the PCB base material 1; On conductive layer 2, post dry film 3, be coated with on the dry film 3 and be used to make public egative film 4, wherein; Place backing plate 7 on the described PCB base material 1, the back of developing is for the first time taken out backing plate 7 and is carried out second development again; Pcb board after the development is electroplated, and the surface of pcb board forms electrodeposited coating 6; Pcb board after electroplating is moved back film, wash dry film 3; Use the etching pcb board to carry out figure transfer; Again pcb board is moved back tin, form active graphical 5.
Wherein, may further comprise the steps: prepare PCB base material 1, be coated with conductive layer 2 on the PCB base material 1; On PCB base material 1, place backing plate 7; On conductive layer 2, stick dry film 3; Covering egative film 4 on the dry film 3 makes public; Carry out the first time after the exposure and develop, the back of developing is for the first time taken out backing plate 7 and is carried out second development again; Pcb board after developing is electroplated, and the surface of pcb board forms electrodeposited coating 6; Pcb board after electroplating is moved back film, wash dry film 3; Use the etching pcb board to carry out figure transfer; Again pcb board is moved back tin, form active graphical 5.Conductive layer 2 is a copper foil plate.
Traditional P CB board processing method is the slotted eye that one deck is milled out a certain size, through local continuum in the pressing manufacturing ejecting plate of other one deck the step-like part that is used to install the client is arranged then.Form and step-likely in the flow process manufacturing process of follow-up outer-layer circuit, bring certain difficulty, form easily behind the normal flow step place pad pasting and bubble, the back dry film that causes developing comes off.The part that will be milled with the PCB substrate material mills out makes the ladder place of pad pad in plate; Can avoid the problems referred to above in the pad pasting dry film process again; Doing needs after the exposure in the plate process these backing plates are taken out before development; Carry out copper facing tin after the development, move back film, etching afterwards again, move back tin and finally obtain active graphical.But; Pasted dry film on the wherein one side of backing plate; Backing plate top is morcelled film and backing plate peripheral upper portion and is morcelled film and be bonded in together in the taking-up process, with the method for the normal development two-layer dry film that can't develop to fall, after developing in two-layer broken film bonding part, has just formed surplus glue at last; Surplus glue position is can't plated with copper tin in subsequent process, can cause during alkali etching and reveal the base material phenomenon.
As shown in Figure 2; This programme is placed the method for backing plate 7 before through pad pasting and has been avoided pad pasting not firm; Keep the state normal development of backing plate 7 in plate through before developing simultaneously; Backing plate 7 is taken out in the back of developing for the first time, but this moment backing plate and PCB between water mark and part developing solution are arranged, can it be removed through second development once more.And only need to open a development cylinder in the second development process and get final product (the development line amounts to two development cylinders).And it is can pad pasting insecure not place backing plate in original operating process, before development, takes out dry film and bonds to the thicker photopolymer layer of copper face formation easily and can't develop to fall and place backing plate, follows flow the base material phenomenon can occur revealing.
As shown in Figure 3; Dotted line is expressed as the groove figure in the conductive layer 2; Its inner solid line is expressed as the position and the figure of backing plate 7, the relative position that from then on can find out two kinds of structures clearly among the figure and their shape, the setting of the shape through relative position; The not firm phenomenon of pad pasting can be when the manufacturing PCB plate, better avoided, and the phenomenon of base material can be avoided revealing.
The above only is the preferred implementation of the utility model; Should be understood that; For those skilled in the art, under the prerequisite that does not break away from the utility model principle, can do the improvement of some suitable actual conditions to the technical scheme of utility model.Therefore, the protection range of the utility model is not limited thereto, and those of skill in the art are any to be included within the utility model protection range based on non-material change on the utility model technical scheme.
Claims (3)
1. step circuit board; Comprise PCB base material (1); Be coated with conductive layer (2) on the PCB base material (1), on conductive layer (2), post dry film (3), be coated with on the dry film (3) and be used to make public egative film (4); It is characterized in that: described PCB base material (1) is gone up and is placed backing plate (7), and the back of developing is for the first time taken out backing plate (7) and carried out second development again; Pcb board after the development is electroplated, and the surface of pcb board forms electrodeposited coating (6); Pcb board after electroplating is moved back film, wash dry film (3); Use the etching pcb board to carry out figure transfer; Again pcb board is moved back tin, form active graphical (5).
2. a kind of step circuit board according to claim 1 is characterized in that: described pcb board takes out backing plate (7) after developing for the first time, and PCB base material (1) is gone up and formed water mark and developing solution, removes water mark and developing solution behind the second development.
3. a kind of step circuit board according to claim 1 is characterized in that: described conductive layer (2) is a copper foil plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205366497U CN202425190U (en) | 2011-12-20 | 2011-12-20 | Stepped circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205366497U CN202425190U (en) | 2011-12-20 | 2011-12-20 | Stepped circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202425190U true CN202425190U (en) | 2012-09-05 |
Family
ID=46749909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205366497U Expired - Lifetime CN202425190U (en) | 2011-12-20 | 2011-12-20 | Stepped circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202425190U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883545A (en) * | 2012-09-17 | 2013-01-16 | 东莞康源电子有限公司 | Protection process for inner layer welding point of soft and hard combined plate |
-
2011
- 2011-12-20 CN CN2011205366497U patent/CN202425190U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883545A (en) * | 2012-09-17 | 2013-01-16 | 东莞康源电子有限公司 | Protection process for inner layer welding point of soft and hard combined plate |
| CN102883545B (en) * | 2012-09-17 | 2015-04-22 | 东莞康源电子有限公司 | Protection process for inner layer welding point of soft and hard combined plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160203 Address after: 519170, No. three, No. 1, Toyama Industrial Park, dry town, Doumen District, Guangdong, Zhuhai, Toyama Patentee after: Zhuhai Smart Technology Co., Ltd. Address before: 510310 No. 381 middle Xingang Road, Guangdong, Guangzhou Patentee before: GCI Science & Technology Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20120905 |
|
| CX01 | Expiry of patent term |