CN202421984U - Heat radiation device for central processing unit of computer - Google Patents
Heat radiation device for central processing unit of computer Download PDFInfo
- Publication number
- CN202421984U CN202421984U CN2011205477273U CN201120547727U CN202421984U CN 202421984 U CN202421984 U CN 202421984U CN 2011205477273 U CN2011205477273 U CN 2011205477273U CN 201120547727 U CN201120547727 U CN 201120547727U CN 202421984 U CN202421984 U CN 202421984U
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- heat
- heat radiation
- cpu
- pipe
- heat conduction
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat radiation device for a central processing unit (CPU) of a computer. Heat can be directly radiated to the outside of a case, so that the heat radiation efficiency is high, the heat radiation effect is good, and the noise is low. The heat radiation device comprises a heat conduction block contacted with the CPU, a group of heat conduction pipes for conducting the heat absorbed by the heat conduction block, and a plurality of heat radiation sheets arranged in parallel, wherein one or more abreast transverse pipe slots are formed on the front of the heat conduction block; one end of each heat conduction pipe is placed on the corresponding pipe slot and contacted with the pipe slot; the other end of each heat conduction pipe is inserted in each heat radiation sheet; the interiors of the heat conduction pipes are closed and vacuumized, and refrigerants are filled in the heat conduction pipes; a plurality of parallel heat radiation sheets are arranged on the inner side of a power supply fan of the computer; 3 to 5 heat conduction pipes are available; the parts of the heat conduction pipes in the heat radiation sheets are slightly higher than those in the pipe slots; and the heat conduction pipes are closed copper pipes or aluminum pipes of which the diameters are 3 to 15 millimeters. The heat radiation device has the advantages of simple structure, low noise, good heat radiation effect and high heat radiation efficiency and can directly radiate the heat of the CPU to the outside of the case.
Description
Technical field
The utility model relates to heat sink of computer system, is specifically related to a kind of heating radiator of central processing unit (CPU) of computer system.
Background technology
At present the heat radiation process of the heating radiator in the personal computer is such: CPU earlier heat be transmitted to the contacted heat-conducting block of CPU on; Cpu fan blows to the heat on the heat-conducting block in the cabinet then; Last power supply fan or system fan are discharged cabinet to the heat that the CPU in the cabinet and other parts send, and the problem that above-mentioned heat abstractor occurs is:
One, cpu fan be the life-span short, power consumption is big, noise is big, is not suitable for long-term use,
Two, the CPU heat is discharged into earlier in the machine system, causes the system environments temperature too high easily, and is unfavorable to the heat radiation of parts such as video card, mainboard, hard disk because CPU heating at present is big, brings potential safety hazard for the normal operation of system.
Three, computer run speed is more and more faster, and efficient is high more, and the heat that CPU produces also significantly increases, and only leans on the heat radiation of existing heat-conducting block and cpu fan, can't satisfy increasingly high heat radiation requirement, and radiating effect is poor.
The utility model content
For overcoming the deficiency of prior art, the utility model provides a kind of and directly rejects heat to outside the cabinet, the heat abstractor of radiating efficiency height, good heat dissipation effect, central processing unit (CPU) that noise is low.
The technical scheme that the utility model adopts is: comprise the contacted heat-conducting block with CPU; Comprise that also one group is used to conduct the heat pipe of heat-conducting block absorption heat, the heat radiator that multi-disc is arranged in parallel, be provided with at least two horizontal tube seats side by side in the heat-conducting block front, heat pipe one end is placed on above the tube seat; And contact with tube seat; The heat pipe other end interts in the multi-disc heat radiator, and the heat pipe enclose inside is evacuated; Refrigeration working medium is housed, and it is inboard that the parallel heat radiator of multi-disc is arranged on the computer power supply fan.
For guaranteeing higher heat transfer efficiency, heat pipe can be 3-5.
For more helping liquid refrigeration working medium backflow heat absorption, the heat pipe part in the heat radiator is a little more than the heat pipe part in the tube seat.
For guaranteeing heat-transfer effect preferably, heat pipe is that diameter is the copper pipe or the aluminum pipe of 3-15 millimeters sealings.
The good effect of the utility model is: simple in structure; Reasonable in design; Owing to there is not special cpu fan that the CPU heat is blown in the cabinet, the utility model is directly discharged the CPU heat outside the cabinet, avoids the destruction of CPU heat to cabinet mainboard, video card, hard disk etc.; Temperature reduces greatly in the cabinet system, helps the heat radiation of parts such as mainboard, video card, hard disk; Simultaneously, owing to save this maximum system noise sound source of cpu fan, significantly reduced noise; And than prior art, the radiating efficiency of CPU is also high, and radiating effect is better.
Description of drawings
Fig. 1 is the utility model one-piece construction synoptic diagram (heat conduction pipe range, an omissive representation);
Fig. 2 is that the A-A of Fig. 1 is to cut-away diagram.
Embodiment
The utility model mainly is used to conduct the heat pipe 3 of heat-conducting block 2 heats, heat radiator 4 compositions that multi-disc is arranged in parallel for 2, one groups by heat-conducting block, and heat-conducting block 2 contacts with central processor CPU 6; In the front of heat-conducting block 2, two or more horizontal tube seats 1 side by side that promptly are provided with the back side of CPU 6 contacted end faces (promptly not with the contacted end face of CPU), heat pipe 3 one ends are placed on above the tube seat 1; And contact with tube seat 1; Heat pipe 3 other ends intert in a plurality of heat radiator 4, and heat pipe 3 enclose insides are evacuated; Refrigeration working medium is housed; Refrigeration working medium can be liquid refrigerant (like fluorine Lyons) or gas working medium (environment-friendly type gas working medium), and in the course of work, refrigeration working medium is vaporized, evaporates, refluxed along with absorbing heat, dispelling the heat.The parallel heat radiator 4 of multi-disc is arranged on the side towards cabinet inside of computer power supply fan 5.Heat pipe 3 can have 3-5, the copper pipe of 3-15 millimeters sealings of diameter or aluminum pipe, and the heat pipe part that heat radiator is 4 li is a little more than the heat pipe part of 1 li of tube seat.
In the use, CPU 6 contacts with heat-conducting block 2, and the heat of its generation passes to heat pipe 3 through heat-conducting block 2; Refrigeration working medium in the heat pipe 3 is vaporized by heat-conducting block 2 heating and is evaporated, and heat transferred heat radiator 4, gives out heat through heat radiator 4; The power supply fan 5 of the heat that distributes in cabinet directly discharged outside the cabinet, flows back to heated portion after the steam liquefaction in the heat pipe 3, goes round and begins again; The heat of CPU 6 is constantly taken out of, CPU 6 is in the normal working temperature scope.
The figure of above-mentioned expression, explanation; Be merely several kinds of preferred embodiments of the utility model; Be not to be that protection domain to the utility model limits, all equivalent variations or modifications of being done according to the utility model claim are the utility model claim and contain.
Claims (4)
1. the heat abstractor of a central processing unit (CPU) comprises: with the contacted heat-conducting block of CPU, it is characterized in that: comprise that also one group is used to conduct the heat pipe of heat that heat-conducting block absorbs, the heat radiator that multi-disc is arranged in parallel; Be provided with at least two horizontal tube seats side by side in the heat-conducting block front; Heat pipe one end is placed on above the tube seat, and contacts with tube seat, and the heat pipe other end interts in heat radiator; The heat pipe enclose inside; Be evacuated, refrigeration working medium is housed, it is inboard that the parallel heat radiator of multi-disc is arranged on the computer power supply fan.
2. the heat abstractor of central processing unit (CPU) according to claim 1, it is characterized in that: heat pipe can be 3-5.
3. the heat abstractor of central processing unit (CPU) according to claim 1 is characterized in that: the heat pipe part in the heat radiator is a little more than the heat pipe part in the tube seat.
4. the heat abstractor of central processing unit (CPU) according to claim 1, it is characterized in that: heat pipe is the copper pipe or the aluminum pipe of 3-15 millimeters sealings of diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205477273U CN202421984U (en) | 2011-12-24 | 2011-12-24 | Heat radiation device for central processing unit of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205477273U CN202421984U (en) | 2011-12-24 | 2011-12-24 | Heat radiation device for central processing unit of computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202421984U true CN202421984U (en) | 2012-09-05 |
Family
ID=46746727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205477273U Expired - Fee Related CN202421984U (en) | 2011-12-24 | 2011-12-24 | Heat radiation device for central processing unit of computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202421984U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
| CN112328051A (en) * | 2020-09-27 | 2021-02-05 | 苏州浪潮智能科技有限公司 | Novel octopus heat dissipation device |
-
2011
- 2011-12-24 CN CN2011205477273U patent/CN202421984U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
| CN108762443B (en) * | 2018-05-24 | 2020-08-04 | 苏州浪潮智能科技有限公司 | T-shaped heat dissipation device applied to computer |
| CN112328051A (en) * | 2020-09-27 | 2021-02-05 | 苏州浪潮智能科技有限公司 | Novel octopus heat dissipation device |
| CN112328051B (en) * | 2020-09-27 | 2023-08-08 | 苏州浪潮智能科技有限公司 | Novel octopus heat dissipation device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20131224 |