CN202403580U - Temperature equalizing plate structure - Google Patents
Temperature equalizing plate structure Download PDFInfo
- Publication number
- CN202403580U CN202403580U CN2011203197687U CN201120319768U CN202403580U CN 202403580 U CN202403580 U CN 202403580U CN 2011203197687 U CN2011203197687 U CN 2011203197687U CN 201120319768 U CN201120319768 U CN 201120319768U CN 202403580 U CN202403580 U CN 202403580U
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- equalizing plate
- metal plate
- ceramic laminate
- plate structure
- laminate body
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Abstract
A temperature equalizing plate structure comprises a body. The body comprises a metal plate body and a ceramic plate body which define a cavity together through covered joint; the cavity comprises a capillary structure, a supporting structure and a working fluid; and the metal plate body is connected with the ceramic plate body and the metal plate body and the ceramic plate body are connected with the capillary structure and the supporting structure through a welding method or a direct bonding copper method. The temperature equalizing plate structure is used for solving the problem of crack of a joint boundary between a temperature equalizing plate and a heating source because of thermal fatigue.
Description
Technical field
A kind of equalizing plate structure refers to a kind of metal material combined to form a temperature-uniforming plate with the sheet material of ceramic material especially, improves between temperature-uniforming plate and pyrotoxin to produce the equalizing plate structure that engages boundary's splintering problem because of heat fatigue (thermal fatigue).
Background technology
Press, along with the progress of semiconductor technology, the volume of IC also dwindles gradually; And in order to make IC can handle more data, the IC under the equal volume can hold than Duo the computing element more than the several times in the past; When the computing element quantity in the IC was more and more, the heat energy of the ox that produces was also increasing during computing element work, is example with common central processing unit; When the fully loaded workload of height, the temperature that central processing unit gives out is enough to make that central processing unit is whole burns; Therefore, the heat abstractor of IC becomes and is important problem.
Central Processing Unit and wafer system is the pyrotoxin in the electronic equipment among in the electronic equipment; When electronic equipment operates; Then pyrotoxin will produce the ox heat, this CPU and wafer outer enclosure mainly be with ceramic material as encapsulating material, this ceramic material has character such as thermal coefficient of expansion is low and non-conductive; And this thermal coefficient of expansion system is close with wafer, so be used in encapsulating material and semi-conducting material in a large number.
Heat abstractor generally adopts aluminium, copper material to do the material of radiator structure; And heat dissipation elements such as collocation fan and heat pipe strengthen radiating effect; But when considering heat abstractor integral body reliability, the design of employing cooling fan and heat pipe all can undermine the reliability value of integral product.
Generally speaking design more letter lift heat abstractor integral body reliability better, therefore, as if can directly improving the transmission of heat energy with doing the radiator structure material than copper heat-sinking capability better material.
In addition, " thermal stress " is another reliability potential problems between heat abstractor and pyrotoxin.The thermal coefficient of expansion of pyrotoxin (like the wafer in the CPU) is low, and industry adopts AlN (aluminium nitride) or the SiC low ceramic materials of thermal coefficient of expansion such as (carborundum) to come encapsulated wafer for pursuing production reliability more.
Moreover; For instance; In the application of LED heat radiation; The thermal coefficient of expansion of aluminium, copper material is more much higher than sapphire (sapphire), causes high-brightness LED composition surface under long-term the use to engage the boundary because of heat fatigue (thermal fatigue) produces easily and breaks (crack), and the joint interface thermal resistance of deriving rises.For the high-brightness LED product, when the rising of heat dissipation interface thermal resistance can cause heat history and and then damage LED wafer, cause the illuminator permanent damages.
So then is the existing target that need improve to the composition surface of deriving because of different thermal coefficient of expansions between the heat abstractor of pyrotoxin external ceramic material and metal material because of heat fatigue (thermal fatigue) produces joint circle (crack) this problem of breaking.
The utility model content
For this reason, for solving the shortcoming of above-mentioned known technology, the main purpose of the utility model is to provide a kind of the improvement between temperature-uniforming plate and pyrotoxin to produce the equalizing plate structure that engages boundary's splintering problem because of heat fatigue (thermal fatigue).
For reaching above-mentioned purpose, the utility model system provides a kind of equalizing plate structure, is to comprise: a body;
Said body has a metal plate and a ceramic laminate body; This metal plate correspondence covers this ceramic laminate body and defines a chamber jointly; Have a capillary structure and a supporting construction and working fluid in this chamber; Said capillary structure is located at the aforementioned cavity inwall, and this supporting construction connects this metal plate and this ceramic laminate body.
Said capillary structure system is wherein arbitrary for agglomerated powder opisthosoma and grid body and a plurality of groove; Said ceramic laminate body material is to be silicon nitride (Si
3N
4), zirconia (ZrO
2), aluminium oxide (Al
2O
3) wherein arbitrary; Said supporting construction is to be the copper post.
Said supporting construction system is through soft soldering and hard solder and diffusion bond and ultrasonic welding and directly cover the copper method (Direct Bonding Cooper, DBC) wherein arbitrary mode combines with this ceramic laminate body.
Particularly, the utility model provides a kind of equalizing plate structure, comprises:
One body; Have a metal plate and a ceramic laminate body; This metal plate correspondence covers this ceramic laminate body and defines a chamber jointly; Have a capillary structure and a supporting construction and working fluid in this chamber, said capillary structure is located at the aforementioned cavity inwall, and this supporting construction connects this metal plate and this ceramic laminate body.
Preferably, described equalizing plate structure, said capillary structure are that agglomerated powder opisthosoma and grid body and a plurality of groove are wherein arbitrary.
Preferably, described equalizing plate structure, said ceramic laminate body material is silicon nitride (Si
3N
4), zirconia (ZrO
2), aluminium oxide (Al
2O
3) wherein arbitrary.
Preferably, described equalizing plate structure, said supporting construction is through soft soldering and hard solder and diffusion bond and ultrasonic welding and directly cover the copper method (Direct Bonding Cooper, DBC) wherein arbitrary mode combines with this ceramic laminate body and this metal plate.
Preferably, described equalizing plate structure, said supporting construction is the copper post.
Preferably, described equalizing plate structure, the material of said metal plate is that the preferable material of copper material and aluminium material and stainless steel and heat radiation and thermal conductive property is wherein arbitrary.
The utility model directly combines to be applied to temperature-uniforming plate with ceramic laminate body; Combine with the ceramic outer surface of pyrotoxin outside by ceramic laminate body again, can improve between temperature-uniforming plate and pyrotoxin because of what the heat fatigue (thermal fatigue) that different heat expansion coefficient produced was derived engaging boundary's splintering problem.
Description of drawings
Fig. 1 a system is the three-dimensional exploded view of equalizing plate structure first embodiment of the utility model;
Fig. 1 b system is the three-dimensional combination figure of equalizing plate structure first embodiment of the utility model;
Fig. 2 system is the cutaway view of equalizing plate structure first embodiment of the utility model;
Fig. 3 system is the cutaway view of equalizing plate structure second embodiment of the utility model;
Fig. 4 system is the cutaway view of equalizing plate structure the 3rd embodiment of the utility model;
[main element symbol description]
Body 1
Chamber 13
Supporting construction 15
Working fluid 16
The specific embodiment
Characteristic on above-mentioned purpose of the utility model and structure thereof and the function will be explained according to appended graphic preferred embodiment.
See also Fig. 1 a, Fig. 1 b, Fig. 2, be three-dimensional decomposition and constitutional diagram and cutaway view for equalizing plate structure first embodiment of the utility model, as shown in the figure, said equalizing plate structure is to comprise: a body 1;
Said body 1 has a metal plate 11 and a ceramic laminate body 12; These metal plate 11 correspondences cover this ceramic laminate body 12; And define a chamber 13 jointly, and having a capillary structure 14 and a supporting construction 15 in this chamber 13, said capillary structure 14 is located at aforementioned cavity 13 inwalls; This supporting construction 15 connects this metal plate 11 and this ceramic laminate body 12, has working fluid 16 in the said chamber 13.
Said capillary structure 14 be with the agglomerated powder opisthosoma as the explanation but be not limited in this kind material.
Said ceramic laminate body 12 materials are to be silicon nitride (Si
3N
4), zirconia (ZrO
2), aluminium oxide (Al
2O
3) wherein arbitrary.
Said supporting construction 15 is through soft soldering and hard solder and diffusion bond and ultrasonic welding and directly covers the copper method (Direct Bonding Cooper, DBC) wherein arbitrary mode combines with this ceramic laminate body 12.
Said supporting construction 15 is to be the copper post; The material of said metal plate 11 system is wherein arbitrary for the preferable material of copper material and aluminium material and stainless steel and heat radiation and thermal conductive property.
See also Fig. 3; System is the cutaway view of equalizing plate structure second embodiment of the utility model; As shown in the figure; Present embodiment system is identical with aforementioned first embodiment part-structure and connection relationship, thus will repeat no more at this, thought present embodiment and aforementioned first embodiment do not exist together be for said capillary structure 14 be as explaining but be not limited in this kind material with the grid body.
See also Fig. 4; System is the cutaway view of equalizing plate structure the 3rd embodiment of the utility model; As shown in the figure; Present embodiment system is identical with aforementioned first embodiment part-structure and connection relationship, thus will repeat no more at this, thought present embodiment and aforementioned first embodiment do not exist together be for said capillary structure 14 be to exceed as explaining but not regarding it as with a plurality of grooves.
The utility model mainly is that temperature-uniforming plate is contacted one of conduction heat side directly replaces traditional temperature-uniforming plate one side with ceramic laminate body 12 metal plate with pyrotoxin; Thermal coefficient of expansion through ceramic laminate body 12 is close with the ceramic package of pyrotoxin outer enclosure; So can avoid between temperature-uniforming plate and pyrotoxin because of heat fatigue (thermal fatigue) ox that spreads out of ox that different heat expansion coefficient produces engage boundary's splintering problem, and can increase the field that heat dissipation element is suitable for.
Claims (6)
1. an equalizing plate structure is characterized in that, comprises:
One body; Have a metal plate and a ceramic laminate body; This metal plate correspondence covers this ceramic laminate body and defines a chamber jointly; Have a capillary structure and a supporting construction and working fluid in this chamber, said capillary structure is located at the aforementioned cavity inwall, and this supporting construction connects this metal plate and this ceramic laminate body.
2. equalizing plate structure as claimed in claim 1 is characterized in that, said capillary structure is that agglomerated powder opisthosoma and grid body and a plurality of groove are wherein arbitrary.
3. equalizing plate structure as claimed in claim 1 is characterized in that, said ceramic laminate body material is silicon nitride Si
3N
4, zirconia ZrO
2, aluminium oxide Al
2O
3Wherein arbitrary.
4. equalizing plate structure as claimed in claim 1 is characterized in that, said supporting construction is through soft soldering and hard solder and diffusion bond and ultrasonic welding and directly cover the wherein arbitrary mode of copper method and combine with this ceramic laminate body and this metal plate.
5. equalizing plate structure as claimed in claim 1 is characterized in that, said supporting construction is the copper post.
6. equalizing plate structure as claimed in claim 1 is characterized in that, the material of said metal plate is that the preferable material of heat radiations such as copper material and aluminium material and stainless steel and thermal conductive property is wherein arbitrary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203197687U CN202403580U (en) | 2011-08-29 | 2011-08-29 | Temperature equalizing plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203197687U CN202403580U (en) | 2011-08-29 | 2011-08-29 | Temperature equalizing plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202403580U true CN202403580U (en) | 2012-08-29 |
Family
ID=46701222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203197687U Expired - Fee Related CN202403580U (en) | 2011-08-29 | 2011-08-29 | Temperature equalizing plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202403580U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956583A (en) * | 2011-08-29 | 2013-03-06 | 奇鋐科技股份有限公司 | Temperature equalization plate structure and manufacturing method thereof |
| CN104053335A (en) * | 2013-03-13 | 2014-09-17 | 联想(北京)有限公司 | Heat radiation device of electronic equipment |
| CN104661489A (en) * | 2013-11-22 | 2015-05-27 | 奇鋐科技股份有限公司 | Heat-dissipation unit of handheld electronic device |
| CN104976909A (en) * | 2014-04-04 | 2015-10-14 | 奇鋐科技股份有限公司 | Uniform-temperature plate structure and manufacturing method thereof |
| CN106949764A (en) * | 2017-05-04 | 2017-07-14 | 广州华钻电子科技有限公司 | A kind of loop soaking plate |
| CN109883225A (en) * | 2019-01-03 | 2019-06-14 | 奇鋐科技股份有限公司 | Radiator |
-
2011
- 2011-08-29 CN CN2011203197687U patent/CN202403580U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956583A (en) * | 2011-08-29 | 2013-03-06 | 奇鋐科技股份有限公司 | Temperature equalization plate structure and manufacturing method thereof |
| CN102956583B (en) * | 2011-08-29 | 2015-08-19 | 奇鋐科技股份有限公司 | Equalizing plate structure and manufacture method thereof |
| CN104053335A (en) * | 2013-03-13 | 2014-09-17 | 联想(北京)有限公司 | Heat radiation device of electronic equipment |
| CN104661489A (en) * | 2013-11-22 | 2015-05-27 | 奇鋐科技股份有限公司 | Heat-dissipation unit of handheld electronic device |
| CN104976909A (en) * | 2014-04-04 | 2015-10-14 | 奇鋐科技股份有限公司 | Uniform-temperature plate structure and manufacturing method thereof |
| CN106949764A (en) * | 2017-05-04 | 2017-07-14 | 广州华钻电子科技有限公司 | A kind of loop soaking plate |
| CN109883225A (en) * | 2019-01-03 | 2019-06-14 | 奇鋐科技股份有限公司 | Radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120829 Termination date: 20170829 |