CN202388731U - Plastic-packaged mold for producing flattened and patched plastic-packaged diodes - Google Patents
Plastic-packaged mold for producing flattened and patched plastic-packaged diodes Download PDFInfo
- Publication number
- CN202388731U CN202388731U CN201120523283XU CN201120523283U CN202388731U CN 202388731 U CN202388731 U CN 202388731U CN 201120523283X U CN201120523283X U CN 201120523283XU CN 201120523283 U CN201120523283 U CN 201120523283U CN 202388731 U CN202388731 U CN 202388731U
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- China
- Prior art keywords
- plastic
- bar
- packaged
- runner
- strip
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- Expired - Fee Related
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Abstract
The utility model discloses a plastic-packaged mold for producing flattened and patched plastic-packaged diodes. The plastic-packaged mold comprises an upper mold box and a lower mold box, wherein the upper mold box comprises a first upper line pressing strip, a second upper line pressing strip and an upper cavity strip; the lower mold box comprises a first lower line pressing strip, a second lower line pressing strip, a lower cavity strip, a lower sprue strip and a main runner; the lower sprue strip is positioned at the inner end of the main runner; the main runner is positioned at the outer end of the second lower line pressing strip; the outer end of the first lower line pressing strip is provided with a lower auxiliary runner; the outer end of the first upper line pressing strip is provided with a first upper auxiliary runner corresponding to the main runner; and the outer end of the second upper line pressing strip is provided with a second upper auxiliary runner corresponding to the lower auxiliary runner. The plastic-packaged mold disclosed by the utility model has the advantages that by arrangement of the auxiliary runners, a plastic-packaged strip which can connect leads at the same ends of a plurality of diodes can be formed, so that the subsequent processing of waste removal, flattening and trimming and the like are conveniently carried out on the plastic-packaged diodes.
Description
Technical field
The utility model relates to a kind of plastic package die that plastic package diode is produced that is used for, and relates in particular to a kind of plastic package die that flattening type paster plastic package diode is produced that is used for.
Background technology
Tradition is used for the plastic package die that plastic package diode is produced; Has only a sprue; Be mainly used in the plastic packaging of diode, but it is as a whole that a plurality of diodes are connected, and in the production process of flattening type paster plastic package diode; Need the lead-in wire at diode two ends be done to flatten and handle; So need concentrate location back to make things convenient for other flow process behind the plastic packaging smooth, so existing plastic package die can't satisfy the production needs of flattening type paster plastic package diode a plurality of diodes.
Summary of the invention
The purpose of the utility model provides a kind of plastic package die that flattening type paster plastic package diode is produced that is used for regard to being in order to address the above problem.
The utility model is realized above-mentioned purpose by the following technical programs:
The utility model comprises diaphragm capsule and following diaphragm capsule; The said diaphragm capsule of going up comprises on first line ball bar and upper impression bar on the line ball bar, second; Said down diaphragm capsule comprises that first presses down lines, second and press down lines, lower impressions bar, submarine gate bar and sprue; Said submarine gate bar is positioned at the inner of said sprue, said sprue be positioned at said second press down lines the outer end; Said first press down lines the outer end be provided with down auxilliary runner; On said first the outer end of line ball bar be provided with said sprue corresponding first on auxilliary runner, on said second the outer end of line ball bar be provided with said auxilliary runner corresponding second down on auxilliary runner.
In the plastic packaging process, a plurality of diodes are arranged in respectively between upper impression bar and the lower impressions bar, and first lead-in wire of a plurality of diodes is positioned at a side of upper impression bar, and second lead-in wire of a plurality of diodes is positioned at the opposite side of upper impression bar.The epoxy-plastic packaging material that becomes liquid after the heating flow through sprue and each auxilliary runner under the effect of each auxilliary runner, form the first plastic packaging bar in a side of upper impression bar, form the second plastic packaging bar at the opposite side of upper impression bar.First lead-in wire of a plurality of diodes is connected as a whole by the first plastic packaging bar, second lead-in wire of a plurality of diodes is connected as a whole by the second plastic packaging bar, so the two ends lead-in wire of all diodes all is connected to an integral body, is convenient to following process.
As preferably, on the said auxilliary runner, said first down on the auxilliary runner and said second shape of auxilliary runner and size all with the shape and the consistent size of said sprue.Like this, the shape and size of the first plastic packaging bar of formation and the second plastic packaging bar are all the same.
The beneficial effect of the utility model is:
The utility model is through being provided with auxilliary runner; In diode plastic packaging process, can form the plastic packaging bar that the same end lead-in wire of a plurality of diodes is connected together; Be convenient to plastic package diode is gone to give up, flattens, cuts following process such as muscle, satisfied the production needs of flattening type paster plastic package diode.
Description of drawings
Fig. 1 is the main TV structure sketch map of patrix in the utility model;
Fig. 2 is the right TV structure sketch map of patrix in the utility model;
Fig. 3 is the main TV structure sketch map of counterdie in the utility model;
Fig. 4 is the right TV structure sketch map of counterdie in the utility model;
Fig. 5 is the mounting structure sketch map of upper die and lower die in the utility model.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described further:
Like Fig. 1-shown in Figure 4; The utility model comprises diaphragm capsule 2 and following diaphragm capsule 9; Last diaphragm capsule 2 comprises on first line ball bar 7 and upper impression bar 5 on the line ball bar 4, second; Following diaphragm capsule 9 comprises that first presses down lines 11, second and press down lines 14, lower impressions bar 12, submarine gate bar 15 and sprue 13, and submarine gate bar 15 is positioned at the inner of sprue 13, sprue 13 be positioned at second press down lines 14 the outer end; First press down lines 11 the outer end that is provided with down line ball bar 4 on the auxilliary runner 10, the first, outer end be provided with sprue 13 corresponding first on the auxilliary runner 3, the second outer end of line ball bar 7 be provided with auxilliary runner 10 corresponding second down on auxilliary runner 6.On the down auxilliary runner 10, first on the auxilliary runner 3 and second shape of auxilliary runner 6 and size all with the shape and the consistent size of sprue 13.Among Fig. 1, upper head plate 1 is for being positioned at an end of diaphragm capsule 2, and among Fig. 3, bottom plate 8 is for being positioned at an end of diaphragm capsule 9 down.
As shown in Figure 5; In the plastic packaging process; A plurality of diodes are (not shown; Upper impression bar 5 and lower impressions bar 12 corresponding shown in the figure just can be adorned 50 diodes) be arranged in respectively between upper impression bar 5 and the lower impressions bar 12, first lead-in wire of a plurality of diodes is positioned at a side of upper impression bar 5, and second lead-in wire of a plurality of diodes is positioned at the opposite side of upper impression bar 5.The epoxy-plastic packaging material that becomes liquid after the heating flow through sprue 13 and each auxilliary runner; Under the effect of each auxilliary runner; It is (not shown to form the first plastic packaging bar in a side of upper impression bar 5; Corresponding with the position of auxilliary runner 3 on sprue 13 and first), form the second plastic packaging bar (not shown, corresponding) at the opposite side of upper impression bar 5 with the position of auxilliary runner 6 on the following auxilliary runner 10 and second.First lead-in wire of a plurality of diodes is connected as a whole by the first plastic packaging bar, second lead-in wire of a plurality of diodes is connected as a whole by the second plastic packaging bar, so the two ends lead-in wire of all diodes all is connected to an integral body, is convenient to following process.
Claims (2)
1. one kind is used for the plastic package die that flattening type paster plastic package diode is produced; Comprise diaphragm capsule and following diaphragm capsule; The said diaphragm capsule of going up comprises on first line ball bar and upper impression bar on the line ball bar, second; Said down diaphragm capsule comprises that first presses down lines, second and press down lines, lower impressions bar, submarine gate bar and sprue, and said submarine gate bar is positioned at the inner of said sprue, said sprue be positioned at said second press down lines the outer end; It is characterized in that: said first press down lines the outer end be provided with down auxilliary runner; On said first the outer end of line ball bar be provided with said sprue corresponding first on auxilliary runner, on said second the outer end of line ball bar be provided with said auxilliary runner corresponding second down on auxilliary runner.
2. according to claim 1ly be used for the plastic package die that flattening type paster plastic package diode is produced, it is characterized in that: on the said auxilliary runner, said first down on the auxilliary runner and said second shape of auxilliary runner and size all with the shape and the consistent size of said sprue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120523283XU CN202388731U (en) | 2011-12-14 | 2011-12-14 | Plastic-packaged mold for producing flattened and patched plastic-packaged diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120523283XU CN202388731U (en) | 2011-12-14 | 2011-12-14 | Plastic-packaged mold for producing flattened and patched plastic-packaged diodes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202388731U true CN202388731U (en) | 2012-08-22 |
Family
ID=46663681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120523283XU Expired - Fee Related CN202388731U (en) | 2011-12-14 | 2011-12-14 | Plastic-packaged mold for producing flattened and patched plastic-packaged diodes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202388731U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275274A (en) * | 2017-07-27 | 2017-10-20 | 重庆平伟实业股份有限公司 | Diode automatic feed mechanism |
-
2011
- 2011-12-14 CN CN201120523283XU patent/CN202388731U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275274A (en) * | 2017-07-27 | 2017-10-20 | 重庆平伟实业股份有限公司 | Diode automatic feed mechanism |
| CN107275274B (en) * | 2017-07-27 | 2023-06-27 | 重庆平伟实业股份有限公司 | Diode automatic feeding mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120822 Termination date: 20161214 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |