CN202362820U - Combined multifunctional chip encapsulation head for SIM card - Google Patents
Combined multifunctional chip encapsulation head for SIM card Download PDFInfo
- Publication number
- CN202362820U CN202362820U CN 201120477673 CN201120477673U CN202362820U CN 202362820 U CN202362820 U CN 202362820U CN 201120477673 CN201120477673 CN 201120477673 CN 201120477673 U CN201120477673 U CN 201120477673U CN 202362820 U CN202362820 U CN 202362820U
- Authority
- CN
- China
- Prior art keywords
- encapsulation
- chip
- sim card
- head
- combined multifunctional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model belongs to the technical field of card manufacturing, and specifically relates to a combined multifunctional chip encapsulation head for an SIM card, which solves the following problems: current SIM card chip encapsulation needs two times of operations to be completed; production efficiency is low; and spot welding temperature is not easy to control in operation, which influences the quality of the SIM card. The combined multifunctional chip encapsulation head for the SIM card comprises a vacuum chuck, an encapsulation head and a heater. The vacuum chuck is one made of heat-resisting silica gel; the vacuum chuck of the heat-resisting silica gel, which can telescope upwards and downwards along the encapsulation head and can impose a certain force on the chip, is installed in the hollow encapsulation head; and the heater for encapsulation heating is installed around the encapsulation head at the upper side. The combined multifunctional chip encapsulation head for the SIM card has the following beneficial effects: the encapsulation of the SIM card chip can be completed in one step; production efficiency is improved since spot welding does not need to be conducted firstly before encapsulation; and chip encapsulation quality is guaranteed.
Description
Technical field
The utility model belongs to the technical field that the card blocking is made, and is specifically related to a kind of combined multifunctional Chip Packaging head that is used for SIM.
Background technology
At present, in the manufacturing process of SIM, be earlier Ka Ji and chip to be made respectively, then Chip Packaging is being blocked on the base.The Chip Packaging operation is to accomplish like this: with vacuum cup chip is picked up; Put into the chip groove of the SIM base on the production line station and apply certain power; Put soldering tip subsequently and stretch out heating any and the welding of SIM foundation trench, make chip can not misplace when moving, when the chip of spot welding moves to next station along with the SIM base along with the next station of SIM basal orientation with chip edge; Encapsulation header is stretched out the welding of accomplishing chip periphery and SIM foundation trench; Chip after the encapsulation is formed SIM with the card base, and chip places the chip groove of SIM base, and chip surface is concordant with the SIM primary surface.This operation process need be accomplished the Chip Packaging operation through spot welding, two steps of encapsulation; Production efficiency is low; The spot welding temperature control requirement is strict; The periphery inhomogeneous chip quality that influences that is heated when too high meeting makes Chip Packaging, it is insecure to cross low welding, is influencing the SIM quality in service possibly dislocation of next station.
Summary of the invention
The utility model needs twice operation could accomplish in order to solve existing SIM Chip Packaging, production efficiency is low, operate in the spot welding temperature wayward, influence the problem of SIM quality, a kind of combined multifunctional Chip Packaging head that is used for SIM is provided.
The utility model adopts following technical scheme to realize:
The combined multifunctional Chip Packaging head that is used for SIM; Comprise vacuum cup, encapsulation header and well heater; Vacuum cup is the heat-proof silica gel vacuum cup; Can be along encapsulation header flexible up and down and the heat-proof silica gel vacuum cup that chip applies certain force is contained in the hollow encapsulation header, the well heater that is used to encapsulate heating is housed around the top of encapsulation header.
The peripheral shape of encapsulation header section is identical with the chip form size, and peripheral thickness is consistent.
The relative prior art of the utility model has following beneficial effect: one step of encapsulation of SIM chip accomplishes, and has improved the production efficiency height, has not needed first spot welding to encapsulate again, has guaranteed the Chip Packaging quality.
Description of drawings
Fig. 1 is the structural representation of the utility model
Fig. 2 is existing vacuum cup and some welding head structure synoptic diagram
Fig. 3 is existing encapsulation header structural representation
Among the figure: 1-heat-proof silica gel vacuum cup, 2-encapsulation header, 3-well heater, 4-vacuum cup, 5-point soldering tip.
Embodiment
Be described further in conjunction with the embodiment of accompanying drawing the utility model.
Be used for the combined multifunctional Chip Packaging head of SIM, comprise heat-proof silica gel vacuum cup, encapsulation header and well heater.
Heat-proof silica gel vacuum cup 1 is contained in the hollow encapsulation header 2, and the well heater 3 that is used to encapsulate heating is housed above encapsulation header on every side.
The peripheral shape of encapsulation header 2 sections and chip form, big or small consistent, peripheral thickness is consistent, and the encapsulation header inner space is used for suit vacuum cup 1.
Heat-proof silica gel vacuum cup 1 is contained in the hollow encapsulation header 2, and is can be along encapsulation header 2 flexible up and down and chip applied certain power.
Combined multifunctional Chip Packaging head rest heat-proof silica gel vacuum cup 1 picks up chip and chip is placed in the chip groove of SIM base on the station during work, and encapsulation header 2 moves down chip heating completion encapsulation.
Claims (2)
1. combined multifunctional Chip Packaging head that is used for SIM; Comprise vacuum cup, encapsulation header and well heater; It is characterized in that vacuum cup is heat-proof silica gel vacuum cup (1); Can be along encapsulation header (2) flexible up and down and the heat-proof silica gel vacuum cup (1) that chip applies certain force is contained in the hollow encapsulation header (2), the well heater (3) that is used to encapsulate heating is housed around the top of encapsulation header (2).
2. the combined multifunctional Chip Packaging head that is used for SIM according to claim 1 is characterized in that the peripheral shape of encapsulation header (2) section is identical with the chip form size, and peripheral thickness is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120477673 CN202362820U (en) | 2011-11-26 | 2011-11-26 | Combined multifunctional chip encapsulation head for SIM card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120477673 CN202362820U (en) | 2011-11-26 | 2011-11-26 | Combined multifunctional chip encapsulation head for SIM card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202362820U true CN202362820U (en) | 2012-08-01 |
Family
ID=46573991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120477673 Expired - Fee Related CN202362820U (en) | 2011-11-26 | 2011-11-26 | Combined multifunctional chip encapsulation head for SIM card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202362820U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172530A (en) * | 2017-12-01 | 2018-06-15 | 蔡明挽 | A kind of automatic chip die Bonder |
-
2011
- 2011-11-26 CN CN 201120477673 patent/CN202362820U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172530A (en) * | 2017-12-01 | 2018-06-15 | 蔡明挽 | A kind of automatic chip die Bonder |
| CN108172530B (en) * | 2017-12-01 | 2019-08-09 | 蔡明挽 | A kind of automatic chip die Bonder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120801 Termination date: 20131126 |