CN202344994U - Fitting structure and electronic device with same - Google Patents
Fitting structure and electronic device with same Download PDFInfo
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- CN202344994U CN202344994U CN2011204467202U CN201120446720U CN202344994U CN 202344994 U CN202344994 U CN 202344994U CN 2011204467202 U CN2011204467202 U CN 2011204467202U CN 201120446720 U CN201120446720 U CN 201120446720U CN 202344994 U CN202344994 U CN 202344994U
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Abstract
The utility model provides a fitting structure and an electronic device with the same. The fitting structure comprises a cementation frame and a perimeter zone arranged on a first baseplate, wherein the surface of the cementation frame comprises a plurality of bulges, gaps are arranged between two adjacent bulges and can contain an overflow part of cementation glue in the liquid state. According to the utility model, by forming the cementation frame of a patterning, glue overflowing can not happen in the press fitting process of the baseplates, therefore, frictioning and gel cleaning are not required in the whole press-fitting processing, thereby reducing the consumption of manpower and material resources.
Description
Technical field
The utility model is relevant for a kind of coating technique, is particularly to a kind of bonding structure, has the electronic installation of this bonding structure.
Background technology
Optical cement (OCA, Optical Clear Adhesive) is widely used in electronic equipment such as portable phone, personal digital assistant, global positioning system and laptop computer etc., as the laminated material of these electronic equipment internal inter-modules.General optical cement is divided into solid-state glue and liquid glue, but along with the popularization of liquid glue material, people give up solid-state glue gradually; And use liquid glue more and more; Yet problems such as excessive glue can appear in liquid glue in the applying process, in actual production; The general mode of frictioning and gel resin of using solves this excessive glue problem, but needs the human and material resources of labor.
Summary of the invention
The utility model provides a kind of bonding structure, has the electronic installation of this bonding structure; It is by the frame that coheres that forms patterning; Make substrate and substrate in the applying process, can not produce the problem of excessive glue; Therefore whole processing procedure need not to carry out frictioning and gel resin, and can reduce expending of manpower and material resources.
The utility model provides a kind of bonding structure, comprises:
One coheres frame, is arranged at the neighboring area of one first substrate, and this surface of cohering frame comprises a plurality of protrusions, and respectively has a space between this two adjacent protrusion thing, coheres the part of overflowing of glue to take in a liquid state.
The utility model provides a kind of electronic installation with above-mentioned bonding structure in addition, comprising:
One first substrate;
One coheres frame, is arranged at the neighboring area of this first substrate, and this surface of cohering frame comprises a plurality of protrusions, and respectively has a space between this two adjacent protrusion thing, coheres the part of overflowing of glue to take in a liquid state; And
One second substrate coheres glue and this first substrate fits by this liquid state.
Owing to adopt the bonding structure of the utility model; Be that it has between a plurality of protrusions and the adjacent protrusion thing and has a space, make win substrate and second substrate in the applying process, can not produce the problem of the glue that overflows, therefore whole processing procedure need not to carry out frictioning and gel resin; And can reduce expending of manpower and material resources; In addition, also can bubble be discharged from this space, and then reduce in the applying process because of existing bubble to cause the bad of product.
Description of drawings
Fig. 1 forms the vertical view that coheres frame for the neighboring area of first substrate of the utility model;
Fig. 2 forms the side view that coheres frame for the neighboring area of first substrate of the utility model;
Fig. 3 is the exploded view of the electronic installation with bonding structure of the utility model;
Fig. 4 is the side view of bonding structure of the electronic installation of the utility model; And
Fig. 5 coheres glue for the liquid state of the utility model and is filled in first substrate and the side view that coheres among the frame.
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the utility model is described in further detail.
Fig. 1 and Fig. 2 show the bonding structure of the utility model.Fig. 1 forms the vertical view that coheres frame for the neighboring area of first substrate of the utility model, and Fig. 2 forms the side view that coheres frame for the neighboring area of first substrate of the utility model.This bonding structure comprises and coheres frame 16; This coheres the neighboring area that frame 16 is arranged at one first substrate 12; And on first substrate 12, surround a fit area 121; Be used to be coated with liquid state and cohere glue, making this liquid state cohere adhesive plaster expires this fit area 121 and forms a liquid gluing layer with another substrate of fitting.Cohere frame 16 and be the adhesive agent of rubber-like macromolecular compound (for example epoxy resin or acrylic resin).
As shown in Figure 1, this surface of cohering frame 16 comprises a plurality of protrusions 161, and this protrusion 161 upwards arches upward along the direction perpendicular to this first substrate 12, and forms well-regulated pattern, as, those protrusions 161 link together and are bead chain shape.In one embodiment, those protrusion 161 indentations, but be not limited to this, can also be other well-regulated similar pattern.Those protrusions 161 are equidistantly arranged continuously, be interconnected to form surround above-mentioned fit area 121 cohere frame 16.As shown in Figure 2; Respectively has a space 162 between this two adjacent protrusion thing 161; When the liquid state that is arranged in this fit area 121 was cohered glue and outwards overflowed, the part of overflowing that this liquid state is cohered glue was taken in space 162, and liquid state is cohered glue and filled space 162 simultaneously; And bubble discharged from space 162, reduce because of bubble and cause the bad phenomenon of product.
Above-mentioned bonding structure can be arranged in the electronic installation, and this electronic installation can be a contact panel or a display floater.
Fig. 3 and shown in Figure 4 for having the exploded view and the side view of electronic installation of above-mentioned bonding structure.Electronic installation comprises: one first substrate 12, one second substrate 14, coheres frame 16 and a liquid state is cohered glue 18.
This electronic installation can be a contact panel, and this contact panel can be used in the electronic equipment, like mobile phone; Portable computer; Global positioning systems etc. are as its input unit or confession user interface operable, when electronic installation is a contact panel; First substrate 12 is the touch base plates that form a touch-control sensing layer, and second substrate 14 is the cover plate with respect to touch base plate.Wherein, the touch-control sensing layer comprises capacitance touching control inductive layer or electric resistance touch-control inductive layer.This electronic installation also can be a display floater; Same this display floater also is used for electronic equipment; When electronic installation was a display floater, first substrate 12 was optical filtering substrates, and second substrate 14 is thin film transistor base plate or polarisation substrate with respect to optical filtering substrate.Wherein, first substrate 12 or second substrate 14 are inorganic substrate (for example glass) or organic substrate (for example plastics).
The structure of cohering frame 16 in the present embodiment is identical with the structure of the foregoing description one; Promptly cohere frame 16 and be arranged at the neighboring area of first substrate 12; The surface of cohering frame 16 comprises a plurality of protrusions 161; And have a space 162 between each two adjacent protrusion thing 161, cohere the part of overflowing of glue 18, do not overflow outside electronic installation and can not make liquid state cohere glue 18 to take in liquid state.This liquid state is cohered glue 18 and is covered with this fit area 121, makes second substrate 14 cohere glue 18 by liquid state and first substrate 12 fits.
These protrusions that cohere frame 16 are indentation or bead chain shape and for equidistantly arranging continuously.Cohere frame 16 and be the adhesive agent of rubber-like macromolecular compound (for example epoxy resin or acrylic resin).Wherein, this adhesive agent is formed by ultraviolet ray, infrared radiation or baking-curing.
The applying method of above-mentioned electronic installation below will be described.
Fig. 1 and 2 shows the bonding structure of electronic installation.Prepare one first substrate 12.Lay one and cohere the periphery of frame 16, wherein, lay the mode of cohering frame 16 and comprise printing, some glue, ejaculation and chemical etching with at a plurality of protrusions 161 of its surface formation, and have a space 162 between each two adjacent protrusion thing in first substrate 12.Wherein, these protrusions 162 that formed are zigzag or bead chain shape and equidistantly arrangement continuously.In addition, this coheres frame 16 and is the adhesive agent of rubber-like macromolecular compound, for example is epoxy resin or acrylic resin.
Then, cohere frame 16, cohere frame 16 formed patterns to stablize this with partly solidified these of mode such as ultraviolet ray, infrared radiation or bakings; It should be noted that; This is cured as incomplete curing, still has certain viscosity so that this coheres frame 16, with the neighboring area of second substrate 14 that bonds.
Coating is liquid cohere glue 18 on first substrate 12 by cohering the fit area 121 that frame 16 is surrounded, as shown in Figure 5.Wherein, the part of overflowing of glue 18 is cohered in order to take in liquid state in the space 162 between these protrusions 161, does not overflow outside electronic installation and can not make liquid state cohere glue 18.
Pressing first substrate 12 and second substrate 14; Under pressure; Liquid state is cohered glue 18 to diffusion all around, flows to and coheres frame 16, and the space 162 that has the adjacent protrusion thing 161 that coheres frame 16 of elasticity simultaneously diminishes; Liquid state is cohered glue 18 pin in the fit area 121 of first substrate 12 and cohere in the space 162 of frame 16 and not excessive, can air molecule be discharged from space 162 again simultaneously.
Cohere glue 18 by liquid state second substrate 14 is fitted in first substrate 12, as shown in Figure 4.After fit first substrate 12 and second substrate 14, solidify liquid state with modes such as ultraviolet ray, infrared radiation or bakings and cohere glue 18, and simultaneously fully curing cohere frame 16, to accomplish first substrate 12 as shown in Figure 4 and the applying of second substrate 14.
The advantage of the invention provides a kind of bonding structure, has the electronic installation and the applying method thereof of this bonding structure; It is by the frame that coheres that forms patterning; Make substrate and substrate in the applying process, can not produce the problem of excessive glue; Therefore whole processing procedure need not to carry out frictioning and gel resin, and can reduce expending of manpower and material resources.
Though the utility model is narrated as above with reference to preferred embodiment and illustrative accompanying drawing, precisely because should not be considered to be restricted person.Be familiar with this art and make various modifications, omission and variation, all do not leave institute's opinion scope of the claim of the utility model holding within its form and the concrete example.
Claims (17)
1. a bonding structure is characterized in that, comprises:
One coheres frame, is arranged at the neighboring area of one first substrate, and this surface of cohering frame comprises a plurality of protrusions, and respectively has a space between this two adjacent protrusion thing, coheres the part of overflowing of glue to take in a liquid state.
2. bonding structure according to claim 1; It is characterized in that; More comprise a fit area on this first substrate, frame is cohered around forming by this in this fit area, and this liquid state cohere full this fit area of adhesive plaster and form a liquid gluing layer with one second substrate of fitting in this first substrate.
3. bonding structure according to claim 2 is characterized in that, this first substrate or this second substrate are inorganic substrate or organic substrate.
4. bonding structure according to claim 2 is characterized in that, this bonding structure is to be arranged in the electronic installation, and this electronic installation is a contact panel or a display floater.
5. bonding structure according to claim 1 is characterized in that, these protrusions are equidistantly to arrange continuously.
6. bonding structure according to claim 1 is characterized in that, this protrusion is zigzag or bead chain shape.
7. bonding structure according to claim 1 is characterized in that, this coheres frame is the rubber-like macromolecular compound.
8. bonding structure according to claim 1 is characterized in that this coheres frame for to be formed by an adhesive agent.
9. bonding structure according to claim 8 is characterized in that, this adhesive agent is formed by ultraviolet ray, infrared radiation or baking-curing.
10. the electronic installation with bonding structure is characterized in that, comprising:
One first substrate;
One coheres frame, is arranged at the neighboring area of this first substrate, and this surface of cohering frame comprises a plurality of protrusions, and respectively has a space between this two adjacent protrusion thing, coheres the part of overflowing of glue to take in a liquid state; And
One second substrate coheres glue and this first substrate fits by this liquid state.
11. the electronic installation with bonding structure according to claim 10 is characterized in that, this electronic installation is a contact panel, and this first substrate is the touch base plate that forms a touch-control sensing layer, and this second substrate is the cover plate with respect to this touch base plate.
12. the electronic installation with bonding structure according to claim 11 is characterized in that, this touch-control sensing layer comprises capacitance touching control inductive layer or electric resistance touch-control inductive layer.
13. the electronic installation with bonding structure according to claim 10 is characterized in that, this electronic installation is a display floater, and this first substrate is an optical filtering substrate, and this second substrate is with respect to the thin film transistor base plate of this optical filtering substrate or polarisation substrate.
14. the electronic installation with bonding structure according to claim 10 is characterized in that, these protrusions are equidistantly to arrange continuously.
15. the electronic installation with bonding structure according to claim 10 is characterized in that, these protrusions are zigzag or bead chain shape.
16. the electronic installation with bonding structure according to claim 10 is characterized in that, this coheres frame is the rubber-like macromolecular compound.
17. the electronic installation with bonding structure according to claim 10 is characterized in that, this first substrate or this second substrate are inorganic substrate or organic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204467202U CN202344994U (en) | 2011-11-02 | 2011-11-02 | Fitting structure and electronic device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204467202U CN202344994U (en) | 2011-11-02 | 2011-11-02 | Fitting structure and electronic device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202344994U true CN202344994U (en) | 2012-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204467202U Expired - Lifetime CN202344994U (en) | 2011-11-02 | 2011-11-02 | Fitting structure and electronic device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202344994U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103085437A (en) * | 2011-11-02 | 2013-05-08 | 宸鸿科技(厦门)有限公司 | Bonding structure, electronic device with bonding structure and bonding method |
| CN108630112A (en) * | 2017-03-16 | 2018-10-09 | 上海和辉光电有限公司 | A kind of bearing frame and organic LED display device |
| CN108934151A (en) * | 2018-07-16 | 2018-12-04 | Oppo广东移动通信有限公司 | Housing unit and electronic equipment |
| CN109445624A (en) * | 2018-09-29 | 2019-03-08 | 昆山国显光电有限公司 | The applying method and touch control display apparatus of touch-control display component, touch-control display component |
| CN109671353A (en) * | 2018-12-18 | 2019-04-23 | 武汉华星光电半导体显示技术有限公司 | Display device |
| US11127923B2 (en) | 2018-12-18 | 2021-09-21 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display device |
-
2011
- 2011-11-02 CN CN2011204467202U patent/CN202344994U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103085437A (en) * | 2011-11-02 | 2013-05-08 | 宸鸿科技(厦门)有限公司 | Bonding structure, electronic device with bonding structure and bonding method |
| CN108630112A (en) * | 2017-03-16 | 2018-10-09 | 上海和辉光电有限公司 | A kind of bearing frame and organic LED display device |
| CN108934151A (en) * | 2018-07-16 | 2018-12-04 | Oppo广东移动通信有限公司 | Housing unit and electronic equipment |
| CN109445624A (en) * | 2018-09-29 | 2019-03-08 | 昆山国显光电有限公司 | The applying method and touch control display apparatus of touch-control display component, touch-control display component |
| CN109671353A (en) * | 2018-12-18 | 2019-04-23 | 武汉华星光电半导体显示技术有限公司 | Display device |
| US11127923B2 (en) | 2018-12-18 | 2021-09-21 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120725 Effective date of abandoning: 20160406 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |