CN202310457U

CN202310457U - Flexible printed circuit (FPC) stack structure

Info

Publication number: CN202310457U
Application number: CN2011204186410U
Authority: CN
Inventors: 谢明君; 杨昌勳; 吴俊蔚; 吴合龙; 华人庆; 黄俊颖
Original assignee: Shenzhen Futaihong Precision Industry Co Ltd
Current assignee: Shenzhen Futaihong Precision Industry Co Ltd
Priority date: 2011-10-28
Filing date: 2011-10-28
Publication date: 2012-07-04
Anticipated expiration: 2021-10-28

Abstract

The utility model relates to a flexible printed circuit (FPC) stack structure, which comprises a circuit board, an FPC and a shielding cover, wherein the shielding cover is fixedly arranged on the circuit board and the FPC is directly stacked and fixedly arranged at the top of the shielding cover.

Description

The FPC stacked structure

Technical field

The utility model relates to a kind of FPC stacked structure, relates in particular to a kind of FPC (Flexible Printed Circuit, FPC) FPC stacked structure of mechanical strength of increasing.

Background technology

FPC in assembling or use, electrically connects owing to bending to be difficult to assemble set up, perhaps after assembling, owing to the electric connection that bends between the assembly that breaks off electronic installation because mechanical strength is lower probably.To this, on this FPC, adhere to a stiffening plate usually, to strengthen the intensity of said FPC, prevent this FPC generation deformation.In addition, owing to also be provided with some electronic components and cover at the radome on the electronic component on the circuit board of electronic installation, at this moment,, usually said FPC is stacked on the radome in order to reduce occupation space on the circuit board along continuous straight runs as far as possible.Yet the height that this kind method also must cause vertically going up on the circuit board increases, and possibly be difficult to satisfy the growth requirement of the miniaturization of electronic installation on vertical direction.

The utility model content

In view of above content, be necessary to provide a kind of mechanical strength that increases FPC, the FPC stacked structure that the while maximizing reduces to take up room.

A kind of FPC stacked structure comprises circuit board, FPC and radome, and radome is fixed on the circuit board, and said FPC is directly folded to establish and be fixed in cover and pushed up.

Preferably, said FPC adheres on the cover top through viscose glue.

Preferably, said radome comprises the cover frame and is arranged at the cover top of covering frame one end that said FPC is directly folded to establish and be fixed in cover and pushed up.

Preferably, said radome also comprises the host cavity that is surrounded by cover top and cover frame, and said host cavity is in order to accommodating electronic component to be shielded, and through this host cavity of circuit board sealing.

Compared with prior art; Above-mentioned utility model FPC stacked structure is directly folded said FPC to establish and be fixed in cover and is pushed up; With the mechanical strength through this cover top reinforcement FPC, and need not to be provided with in addition one in order to strengthen the stiffening plate of FPC intensity, not only assembling is more simple; And reduce and to take the electronic installation volume inside, to satisfy the demand of electronic device miniaturization.

Description of drawings

Fig. 1 is that the utility model FPC stacked structure is installed in the three-dimensional assembly diagram on the circuit board.

Fig. 2 is the three-dimensional exploded view of Fig. 1.

The main element symbol description

The FPC stacked structure	10
		Radome	11
The cover frame	111
		The cover top	113
Host cavity	115
		Circuit board	12
FPC	13
		Viscose glue	14
Electronic component	30

Following embodiment will combine above-mentioned accompanying drawing to further specify the utility model.

Embodiment

See also Fig. 1 and Fig. 2; The utility model FPC stacked structure 10 comprises radome 11, circuit board 12 and FPC 13; Said radome 11 is in order to be covered with the electronic component 30 on the circuit board 12; And carry said FPC 13, to strengthen the mechanical strength of this FPC 13.

Said radome 11 adopts metal material to process, and comprises cover frame 111 and cover top 113.Said cover top 113 is formed by end vertical extent of cover frame 111, and surrounds the host cavity 115 of an end opening with said cover frame 111.This radome 11 is installed in 12 last times of circuit board, said circuit board 12 will seal this host cavity 115 openend and with 30 shieldings of the electronic components in the host cavity 115.

Said FPC 13 is in order to realize the electric connection between the assembly in the electronic installation.This FPC 13 comprises electrical connection section (figure does not show).13 tilings of this FPC are fixed on the cover top 113, make this FPC 13 deviate from host cavity 115, electrical connection section deviates from cover top 113, support said FPC 13 to support through cover top 113, thereby realize strengthening the intensity of this FPC 13.In the utility model execution mode, said FPC 13 adheres on the cover top 113 through viscose glue 14.Be appreciated that said FPC 13 also can be through being fixed or fastening other modes that wait of screw are fixed on the cover top 113.

When assembling this FPC stacked structure 10, may further comprise the steps:

The first, radome 11 is covered on the circuit board 12, with through the said host cavity 115 of circuit board 12 sealing, and electronic component 30 is contained in the host cavity 115 of said sealing and shields mutually with the external world.

The second, FPC 13 is fixed on the cover top 113, make the electrical connection section of said FPC 13 deviate from said cover top 113.In the utility model execution mode, FPC 13 is adhered on the cover top 113 through viscose glue 14.

The FPC stacked structure 10 of the utility model; Said FPC 13 folded establishing are fixed on the cover top 113; With the mechanical strength through these cover top 113 reinforcement FPCs 13, and need not to be provided with in addition one in order to strengthen the stiffening plate of FPC 13 intensity, not only assembling is more simple; And reduce and to take the electronic installation volume inside, to satisfy the demand of electronic device miniaturization.

To those skilled in the art; The actual needs that can combine to produce according to the utility model scheme and the utility model design of the utility model is made other corresponding changes or adjustment, and these changes and adjustment all should belong to the protection range of the utility model claim.

Claims

1. a FPC stacked structure comprises circuit board and FPC, it is characterized in that: said FPC stacked structure also comprises radome, and radome is fixed on the circuit board, and said FPC is directly folded to be established and be fixed on the radome.

2. FPC stacked structure as claimed in claim 1 is characterized in that: said FPC adheres on the cover top through viscose glue.

3. FPC stacked structure as claimed in claim 1 is characterized in that: said radome comprises the cover frame and is arranged at the cover top of covering frame one end that said FPC is directly folded to establish and be fixed in cover and pushed up.

4. FPC stacked structure as claimed in claim 3 is characterized in that: said radome also comprises the host cavity that is surrounded by cover top and cover frame, and said host cavity is in order to accommodating electronic component to be shielded, and through this host cavity of circuit board sealing.