CN202310457U - Flexible printed circuit (FPC) stack structure - Google Patents
Flexible printed circuit (FPC) stack structure Download PDFInfo
- Publication number
- CN202310457U CN202310457U CN2011204186410U CN201120418641U CN202310457U CN 202310457 U CN202310457 U CN 202310457U CN 2011204186410 U CN2011204186410 U CN 2011204186410U CN 201120418641 U CN201120418641 U CN 201120418641U CN 202310457 U CN202310457 U CN 202310457U
- Authority
- CN
- China
- Prior art keywords
- fpc
- radome
- circuit board
- stacked structure
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Details Of Aerials (AREA)
Abstract
The utility model relates to a flexible printed circuit (FPC) stack structure, which comprises a circuit board, an FPC and a shielding cover, wherein the shielding cover is fixedly arranged on the circuit board and the FPC is directly stacked and fixedly arranged at the top of the shielding cover.
Description
Technical field
The utility model relates to a kind of FPC stacked structure, relates in particular to a kind of FPC (Flexible Printed Circuit, FPC) FPC stacked structure of mechanical strength of increasing.
Background technology
FPC in assembling or use, electrically connects owing to bending to be difficult to assemble set up, perhaps after assembling, owing to the electric connection that bends between the assembly that breaks off electronic installation because mechanical strength is lower probably.To this, on this FPC, adhere to a stiffening plate usually, to strengthen the intensity of said FPC, prevent this FPC generation deformation.In addition, owing to also be provided with some electronic components and cover at the radome on the electronic component on the circuit board of electronic installation, at this moment,, usually said FPC is stacked on the radome in order to reduce occupation space on the circuit board along continuous straight runs as far as possible.Yet the height that this kind method also must cause vertically going up on the circuit board increases, and possibly be difficult to satisfy the growth requirement of the miniaturization of electronic installation on vertical direction.
The utility model content
In view of above content, be necessary to provide a kind of mechanical strength that increases FPC, the FPC stacked structure that the while maximizing reduces to take up room.
A kind of FPC stacked structure comprises circuit board, FPC and radome, and radome is fixed on the circuit board, and said FPC is directly folded to establish and be fixed in cover and pushed up.
Preferably, said FPC adheres on the cover top through viscose glue.
Preferably, said radome comprises the cover frame and is arranged at the cover top of covering frame one end that said FPC is directly folded to establish and be fixed in cover and pushed up.
Preferably, said radome also comprises the host cavity that is surrounded by cover top and cover frame, and said host cavity is in order to accommodating electronic component to be shielded, and through this host cavity of circuit board sealing.
Compared with prior art; Above-mentioned utility model FPC stacked structure is directly folded said FPC to establish and be fixed in cover and is pushed up; With the mechanical strength through this cover top reinforcement FPC, and need not to be provided with in addition one in order to strengthen the stiffening plate of FPC intensity, not only assembling is more simple; And reduce and to take the electronic installation volume inside, to satisfy the demand of electronic device miniaturization.
Description of drawings
Fig. 1 is that the utility model FPC stacked structure is installed in the three-dimensional assembly diagram on the circuit board.
Fig. 2 is the three-dimensional exploded view of Fig. 1.
The main element symbol description
The FPC stacked |
10 |
Radome | 11 |
The |
111 |
The |
113 |
|
115 |
|
12 |
|
13 |
|
14 |
|
30 |
Following embodiment will combine above-mentioned accompanying drawing to further specify the utility model.
Embodiment
See also Fig. 1 and Fig. 2; The utility model FPC stacked structure 10 comprises radome 11, circuit board 12 and FPC 13; Said radome 11 is in order to be covered with the electronic component 30 on the circuit board 12; And carry said FPC 13, to strengthen the mechanical strength of this FPC 13.
Said radome 11 adopts metal material to process, and comprises cover frame 111 and cover top 113.Said cover top 113 is formed by end vertical extent of cover frame 111, and surrounds the host cavity 115 of an end opening with said cover frame 111.This radome 11 is installed in 12 last times of circuit board, said circuit board 12 will seal this host cavity 115 openend and with 30 shieldings of the electronic components in the host cavity 115.
Said FPC 13 is in order to realize the electric connection between the assembly in the electronic installation.This FPC 13 comprises electrical connection section (figure does not show).13 tilings of this FPC are fixed on the cover top 113, make this FPC 13 deviate from host cavity 115, electrical connection section deviates from cover top 113, support said FPC 13 to support through cover top 113, thereby realize strengthening the intensity of this FPC 13.In the utility model execution mode, said FPC 13 adheres on the cover top 113 through viscose glue 14.Be appreciated that said FPC 13 also can be through being fixed or fastening other modes that wait of screw are fixed on the cover top 113.
When assembling this FPC stacked structure 10, may further comprise the steps:
The first, radome 11 is covered on the circuit board 12, with through the said host cavity 115 of circuit board 12 sealing, and electronic component 30 is contained in the host cavity 115 of said sealing and shields mutually with the external world.
The second, FPC 13 is fixed on the cover top 113, make the electrical connection section of said FPC 13 deviate from said cover top 113.In the utility model execution mode, FPC 13 is adhered on the cover top 113 through viscose glue 14.
The FPC stacked structure 10 of the utility model; Said FPC 13 folded establishing are fixed on the cover top 113; With the mechanical strength through these cover top 113 reinforcement FPCs 13, and need not to be provided with in addition one in order to strengthen the stiffening plate of FPC 13 intensity, not only assembling is more simple; And reduce and to take the electronic installation volume inside, to satisfy the demand of electronic device miniaturization.
To those skilled in the art; The actual needs that can combine to produce according to the utility model scheme and the utility model design of the utility model is made other corresponding changes or adjustment, and these changes and adjustment all should belong to the protection range of the utility model claim.
Claims (4)
1. a FPC stacked structure comprises circuit board and FPC, it is characterized in that: said FPC stacked structure also comprises radome, and radome is fixed on the circuit board, and said FPC is directly folded to be established and be fixed on the radome.
2. FPC stacked structure as claimed in claim 1 is characterized in that: said FPC adheres on the cover top through viscose glue.
3. FPC stacked structure as claimed in claim 1 is characterized in that: said radome comprises the cover frame and is arranged at the cover top of covering frame one end that said FPC is directly folded to establish and be fixed in cover and pushed up.
4. FPC stacked structure as claimed in claim 3 is characterized in that: said radome also comprises the host cavity that is surrounded by cover top and cover frame, and said host cavity is in order to accommodating electronic component to be shielded, and through this host cavity of circuit board sealing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011204186410U CN202310457U (en) | 2011-10-28 | 2011-10-28 | Flexible printed circuit (FPC) stack structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011204186410U CN202310457U (en) | 2011-10-28 | 2011-10-28 | Flexible printed circuit (FPC) stack structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202310457U true CN202310457U (en) | 2012-07-04 |
Family
ID=46379256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011204186410U Expired - Fee Related CN202310457U (en) | 2011-10-28 | 2011-10-28 | Flexible printed circuit (FPC) stack structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202310457U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102612260A (en) * | 2012-03-29 | 2012-07-25 | 上海华勤通讯技术有限公司 | Reinforced FPC (Flexible Printed Circuit) board and manufacturing method |
CN107484405A (en) * | 2017-09-27 | 2017-12-15 | 广东欧珀移动通信有限公司 | Mobile terminal and its circuit board assemblies |
-
2011
- 2011-10-28 CN CN2011204186410U patent/CN202310457U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102612260A (en) * | 2012-03-29 | 2012-07-25 | 上海华勤通讯技术有限公司 | Reinforced FPC (Flexible Printed Circuit) board and manufacturing method |
CN107484405A (en) * | 2017-09-27 | 2017-12-15 | 广东欧珀移动通信有限公司 | Mobile terminal and its circuit board assemblies |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20191028 |