CN202307832U - Wafer drying device - Google Patents
Wafer drying device Download PDFInfo
- Publication number
- CN202307832U CN202307832U CN2011204206912U CN201120420691U CN202307832U CN 202307832 U CN202307832 U CN 202307832U CN 2011204206912 U CN2011204206912 U CN 2011204206912U CN 201120420691 U CN201120420691 U CN 201120420691U CN 202307832 U CN202307832 U CN 202307832U
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- Prior art keywords
- wafer
- drying
- wafer device
- rotation
- rotary
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
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Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011204206912U CN202307832U (en) | 2011-10-29 | 2011-10-29 | Wafer drying device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011204206912U CN202307832U (en) | 2011-10-29 | 2011-10-29 | Wafer drying device |
Publications (1)
Publication Number | Publication Date |
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CN202307832U true CN202307832U (en) | 2012-07-04 |
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Application Number | Title | Priority Date | Filing Date |
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CN2011204206912U Expired - Fee Related CN202307832U (en) | 2011-10-29 | 2011-10-29 | Wafer drying device |
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CN (1) | CN202307832U (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104233224A (en) * | 2013-06-13 | 2014-12-24 | 浩升开发科技股份有限公司 | Spray ultrasonic coating system and coating method |
CN104634087A (en) * | 2013-11-07 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | Blowing device for rapidly drying surfaces of wafers |
CN106842836A (en) * | 2017-04-05 | 2017-06-13 | 武汉华星光电技术有限公司 | Drying device and the exposure imaging equipment with the drying device |
CN108592585A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of energy-efficient apparatus capable of fluctuating that Bubble-floating Method is combined with swing method |
CN108592590A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of method of copper foil surface adherency copper powder when eliminating copper foil cutting of PLC controls |
CN108592586A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of efficient copper foil surface processor |
CN108613523A (en) * | 2016-06-25 | 2018-10-02 | 宁波恒进自动化技术有限公司 | A kind of copper foil drying unit that the rotation that can save energy combines |
CN110265345A (en) * | 2019-05-24 | 2019-09-20 | 信利光电股份有限公司 | A kind of drying method and equipment of underlay substrate |
WO2021046867A1 (en) * | 2019-09-10 | 2021-03-18 | 苏州超硕凡塑料制品有限公司 | Drying device for plastic products |
-
2011
- 2011-10-29 CN CN2011204206912U patent/CN202307832U/en not_active Expired - Fee Related
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104233224A (en) * | 2013-06-13 | 2014-12-24 | 浩升开发科技股份有限公司 | Spray ultrasonic coating system and coating method |
CN104634087A (en) * | 2013-11-07 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | Blowing device for rapidly drying surfaces of wafers |
CN108613526A (en) * | 2016-06-25 | 2018-10-02 | 宁波恒进自动化技术有限公司 | A kind of automation apparatus capable of fluctuating that Bubble-floating Method is combined with swing method |
CN108759418A (en) * | 2016-06-25 | 2018-11-06 | 宁波恒进自动化技术有限公司 | A method of copper foil surface adheres to copper powder when eliminating copper foil cutting |
CN108592590A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of method of copper foil surface adherency copper powder when eliminating copper foil cutting of PLC controls |
CN108592586A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of efficient copper foil surface processor |
CN108613527A (en) * | 2016-06-25 | 2018-10-02 | 宁波恒进自动化技术有限公司 | A kind of apparatus capable of fluctuating that Bubble-floating Method is combined with swing method |
CN108613523A (en) * | 2016-06-25 | 2018-10-02 | 宁波恒进自动化技术有限公司 | A kind of copper foil drying unit that the rotation that can save energy combines |
CN108592590B (en) * | 2016-06-25 | 2020-06-12 | 郑贝贝 | Method for eliminating copper powder adhered to surface of copper foil during slitting of copper foil under control of PLC (programmable logic controller) |
CN108592585A (en) * | 2016-06-25 | 2018-09-28 | 宁波恒进自动化技术有限公司 | A kind of energy-efficient apparatus capable of fluctuating that Bubble-floating Method is combined with swing method |
CN108759419A (en) * | 2016-06-25 | 2018-11-06 | 宁波恒进自动化技术有限公司 | A kind of copper foil surface processor of automation |
CN108800864A (en) * | 2016-06-25 | 2018-11-13 | 宁波恒进自动化技术有限公司 | A kind of copper foil surface processor controlled by PLC |
CN108826918A (en) * | 2016-06-25 | 2018-11-16 | 宁波恒进自动化技术有限公司 | A kind of automation copper foil drying unit that rotation combines |
CN106842836A (en) * | 2017-04-05 | 2017-06-13 | 武汉华星光电技术有限公司 | Drying device and the exposure imaging equipment with the drying device |
CN110265345A (en) * | 2019-05-24 | 2019-09-20 | 信利光电股份有限公司 | A kind of drying method and equipment of underlay substrate |
WO2021046867A1 (en) * | 2019-09-10 | 2021-03-18 | 苏州超硕凡塑料制品有限公司 | Drying device for plastic products |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130425 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130425 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20181029 |