CN202302811U - LED (light-emitting diode) surface light source based on COB (Chip On Board) packaging structure - Google Patents
LED (light-emitting diode) surface light source based on COB (Chip On Board) packaging structure Download PDFInfo
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- CN202302811U CN202302811U CN2011203409360U CN201120340936U CN202302811U CN 202302811 U CN202302811 U CN 202302811U CN 2011203409360 U CN2011203409360 U CN 2011203409360U CN 201120340936 U CN201120340936 U CN 201120340936U CN 202302811 U CN202302811 U CN 202302811U
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Abstract
An LED (light-emitting diode) surface light source based on a COB (Chip On Board) packaging structure belongs to the field of lighting. The LED surface light source is provided with a lamp shell with a frame structure; side vertical edges which turn over upwards are arranged at the edges of the lamp shell; LED light bar module containing grooves are arranged on the two corresponding side vertical edges, and are respectively and correspondingly provided with a COB packaging LED light bar module; one light guide plate is embedded/arranged in the space accommodated/contained by the lamp shell with the frame structure; and the lamp shell with the frame structure, the COB packaging LED light bar module and the light guiding plate form the LED surface light source. According to the utility model, the integrated COB multi-chip packaging technique is adopted, the packaging form of the device and the lamp shell are well combined, heat is directly conducted to a base plate and then to the lamp shell by chips, the heat resistance is obviously reduced, better radiation effect can be achieved, junction temperature of the device can be effectively reduced, the service life of the lamp can be prolonged, the thickness of the LED surface light source is greatly reduced, and the LED surface light source can be widely applied to the lighting field.
Description
Technical field
The utility model belongs to lighting field, relates in particular to a kind of lighting device of the LED of employing luminescent device.
Background technology
Semiconductor lighting is acknowledged as one of high-tech sector of tool development prospect of 21 century.
The LED luminescent device belongs to the semiconductor chip luminescent device, and its superior physical attribute is that conventional incandescent, fluorescent lamp etc. are incomparable.Its luminescence mechanism is: when at semiconductor light-emitting-diode (LED; When two ends light-emitting diode) add the voltage of positively biased; A large amount of electron hole pair injects semiconductor, and compound tense in electronics and hole some sp act zone in semiconductor promptly produces photon and luminous.
Because LED is that to be converted into luminous energy through semiconductor devices be not by thermoluminescence to electric energy; The cold light source so led light source is otherwise known as; Its conversion efficiency is along with the development of scientific research level just progressively improves, and reached now and to surpass level and its potentiality that can dig of electricity-saving lamp also very big.Can reach 100,000 hours as its long-life of semiconductor devices, also be all other light sources can't expect.
The mostly development and differentiation on the Discrete device packaging technical foundation of LED encapsulation technology, but very big particularity is arranged.
Generally speaking, the tube core of discrete device is sealed in the packaging body, and the effect of encapsulation mainly is protection tube core and completion electric interconnection.
LED encapsulation then is to accomplish the output signal of telecommunication, protection tube core operate as normal, and the function of output visible light, existing electrical quantity has the design and the specification requirement of optical parameter again, can't be simply the encapsulation of discrete device be used for LED.
The encapsulation of LED at present mainly is divided into two kinds: the one, and independent encapsulation just encapsulates every chips separately, produces arbitrary source one by one, and then assembles as required; The 2nd, integrated encapsulation according to certain arrangement mode, is carried out integrated encapsulation with a plurality of chips then, and what this method encapsulated out is the aggregate of a multicore sheet.
After getting into 21 century, the high efficiency of LED, super brightnessization, panchromaticization constantly develop innovation, and red, orange LED light efficiency has reached 100Im/W, and green LED is 501m/W, and the luminous flux of single LED also reaches tens of Im.Led chip and encapsulation no longer along the design concept and manufacturing production model of Gong Chuantong, at the light output facet that increases chip, are researched and developed and are not limited only to change amount of impurities in the material; Lattice defect and dislocation improve internal efficiency, simultaneously, how to improve tube core and encapsulation internal structure; Strengthen the inner probability that produces the photon outgoing of LED, improve light efficiency, solve heat radiation; Get the heavy optimal design of light and heat, improve optical property, quicken the surface mount process main flow direction of industrial circle research and development especially.
In 2002; Surface mount encapsulated LED (SMD LED) is accepted by market gradually; And obtain certain market share, and turn to SMD (Surface Mount Devices) encapsulation to meet whole electron trade development main trend from independent pinned encapsulation, a lot of production firms release this series products.
SMD LED becomes a development focus, has solved problems such as brightness, visual angle, flatness, reliability, uniformity well, adopts lighter pcb board and reflector material; Showing epoxy resin that the reflecting layer need be filled still less, and removing heavier carbon steel material pin, through minification; Reduce weight, can easily product weight be alleviated half, finally make application more become perfect; Especially suitable indoor, the semi-outdoor full color display is used.
But the SMD encapsulation of existing LED is applicable to the encapsulation of low-power LED more, and it also has certain limitation on the package application of great power LED device, trace it to its cause, and mainly is that heat dissipation problem is more outstanding.After adopting integrated encapsulation, multiple chips is gathered on the very little area, and thermal resistance between chip and the fin increases, and High Power Illuminator problem of manufacturing of assembling is more outstanding again than encapsulation separately with regard to making heat dissipation problem for this.
Along with power-type LED in the general lighting extensive applications, the power-type device application has also become trend in indoor illumination light fitting, relatively in the narrow space, harsh more to the requirement of light fixture heat dissipation technology.
The utility model content
The utility model technical problem to be solved provides a kind of LED area source based on the COB encapsulating structure; It adopts incorporate COB multicore encapsulation technology, and packing forms and the lamp casing with device combines well, and the thermally conductive pathways of lamp housing is arrived in the direct heat conduction of realization chip again to substrate; Thermal resistance obviously reduces; Can reach better radiating effect, the conventional package mode can more effectively reduce device junction temperature, the service life of raising/prolongation light fixture relatively; The gauge of LED area source light fixture reduces greatly, and higher illuminance or light amount of lumens can be provided on its unit light-emitting area.
The technical scheme of the utility model is: a kind of LED area source based on the COB encapsulating structure is provided, comprises lamp casing, PCB substrate and a plurality of LED luminescence chip, it is characterized in that: the lamp casing that a frame shape structure is set; At the edge of lamp casing, resupinate edge-on limit is set; On the edge-on limit of two correspondences, LED lamp bar module holding tank is set; In LED lamp bar module holding tank, correspondence is provided with a COB packaged LED lamp bar module respectively; In the space that frame shape structure lamp casing holds/comprises, embed/be provided with a LGP; Described frame shape structure lamp casing, COB packaged LED lamp bar module and LGP are combined into a LED area source.
Wherein, described COB packaged LED lamp bar module comprises a plurality of LED luminescence chips and a strip aluminum base PCB substrate.
Its described a plurality of LED luminescence chips directly encapsulate/are fixed on the strip aluminum base PCB substrate through the heat conduction adhesive linkage.
Described a plurality of LED luminescence chip is single-row arrangement, is distributed on the side of strip aluminum base PCB substrate.
Described a plurality of LED luminescence chip series connection back constitutes one group of luminescence chip group, is connected with external driving power after several luminescence chip group parallel connections.
Described shape aluminum base PCB substrate constitutes a complete COB packaged LED lamp bar module together with a plurality of LED luminescence chips on it and the connection lead that connects each LED luminescence chip.
Further, described LED lamp bar module holding tank is arranged on the edge-on limit of two correspondences of frame shape structure lamp casing.
Described LED lamp bar module holding tank is at least corresponding two.
The exiting surface of said COB packaged LED lamp bar module is towards the flank side surface setting of LGP.
In the two sides of said LGP, protective layer or photic zone are set, wherein, described protective layer is arranged on the back side of LGP, and described photic zone is arranged on the front of LGP.
The equal in length of the length of said strip aluminum base PCB substrate and LED lamp bar module holding tank; The bottom surface of said strip aluminum base PCB substrate directly is fixed on through securing member on the edge-on limit of frame shape structure lamp casing, and the upper surface of said strip aluminum base PCB substrate is towards the flank side surface setting of LGP.
Further; M * n LED luminescence chip is set on the upper surface of said strip aluminum base PCB substrate; Every m series connection back of described LED luminescence chip constitutes one group of luminescence chip group; Be connected with external driving power after the parallel connection of n group luminescence chip group, constitute a complete COB packaged LED lamp bar module.
Compare with prior art, the utility model has the advantages that:
1. in a narrow and small relatively light fixture space, the plurality of LEDs light source is set, adopts the COB encapsulating structure; Make the form of LED lamp bar light emitting module; Directly mount into lamp casing, because COB aluminium base radiating effect obviously is superior to the SMD form, so light fixture overall thermal performance improves;
2. the plurality of LEDs luminescent device is integrated in the same lamp bar, makes the discrete packaged type that it is more traditional, can save a packaging cost, photo engine module cost of manufacture and the secondary light-distribution cost of LED greatly, improves the colour rendering of led light source effectively;
3. well the packing forms and the lamp casing of device combined; Because its thermal resistance obviously reduces, and can effectively reduce the junction temperature of luminescent device, can reach better radiating effect; Can more effectively reduce device junction temperature than the conventional package mode; The service life of raising/prolongation light fixture, and higher illuminance or light amount of lumens can be provided on the unit light-emitting area, so be more suitable in high-power LED illuminating device.
Description of drawings
Fig. 1 is the split structural representation of the utility model;
Fig. 2 is the overall structure sketch map after the assembling of present technique scheme;
Fig. 3 is the structural representation of LED lamp bar module;
Fig. 4 is the sectional structure sketch map of PCB substrate.
1 is lamp casing among the figure, and 2 is edge-on limit, and 3 is holding tank, and 4 is COB packaged LED lamp bar module; 5 is LGP, and 6 is the PCB substrate, and 7 is the LED luminescence chip; 8 is "+" power electrode bar, and 8-1 is that "+" power electrode extends jag, and 9 is "-" power electrode bar; 9-1 is that "-" power electrode extends jag, and 10 is chip chamber connection electrode sheet, and 11 is the fluorescence conversion glue-line.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is further specified.
Among Fig. 1, the present technique scheme provides a kind of LED area source based on the COB encapsulating structure, comprises lamp casing, PCB substrate and a plurality of LED luminescence chip, and it is provided with the lamp casing 1 of a frame shape structure; At the edge of lamp casing, resupinate edge-on limit 2 is set; On the edge-on limit of two correspondences, LED lamp bar module holding tank 3 is set; In LED lamp bar module holding tank, correspondence is provided with a COB packaged LED lamp bar module 4 respectively; In the space that frame shape structure lamp casing holds/comprises, embed/be provided with a LGP 5; Described frame shape structure lamp casing, COB packaged LED lamp bar module and LGP are combined into a LED area source.
Its COB packaged LED lamp bar module comprises a plurality of LED luminescence chips and a shape aluminum base PCB substrate.
Its described a plurality of LED luminescence chips directly encapsulate/are fixed on the strip aluminum base PCB substrate through heat conduction adhesive linkage (not shown).
Described a plurality of LED luminescence chip is single-row arrangement, is distributed on the side of strip aluminum base PCB substrate.
Described a plurality of LED luminescence chip series connection back constitutes one group of luminescence chip group, is connected with external driving power after several luminescence chip group parallel connections.
Described shape aluminum base PCB substrate constitutes a complete COB packaged LED lamp bar module together with a plurality of LED luminescence chips on it and the connection lead that connects each LED luminescence chip.
Further, described LED lamp bar module holding tank is arranged on the edge-on limit of two correspondences of frame shape structure lamp casing.
Described LED lamp bar module holding tank is at least corresponding two.
The LED area source need be provided with the plurality of LEDs light source in narrow and small relatively light fixture space, how to dispel the heat is the key of decision light fixture bulk life time.
In view of tradition envelope commentaries on classics mode forms bigger thermoresistance layer between device and lamp casing, be unfavorable for effective conduction of heat, cause light fixture in use owing to the problem of management of heat constantly worsens.
The present technique scheme adopts the COB technology to be packaged into the lamp strips LED luminescence chip, has realized direct the contacting of lamp bar with area source light fixture housing, has reached better radiating effect.
Among Fig. 2, the exiting surface of COB packaged LED lamp bar module is towards the flank side surface setting of LGP.
In order to increase the service life or to play the corresponding protection effect,, protective layer or photic zone can also be set in the two sides of LGP.
Its protective layer is arranged on the back side of LGP, and its photic zone is arranged on the front of LGP.
Can know by figure; The equal in length of the length of strip aluminum base PCB substrate and LED lamp bar module holding tank; The bottom surface of strip aluminum base PCB substrate directly is fixed on through securing member on the edge-on limit of frame shape structure lamp casing, and the upper surface of strip aluminum base PCB substrate is towards the flank side surface setting of LGP.
Among Fig. 3, on a side of strip aluminum base PCB plate 6, be provided with a plurality of LED luminescence chips 7 and "+", "-" power electrode bar 8 and 9; Its described a plurality of LED luminescence chips are arranged on the PCB substrate along the longitudinal axis of PCB substrate is single-row; Described "+", "-" power electrode bar are arranged in the both sides of each LED luminescence chip respectively; Between each LED luminescence chip, be provided with chip chamber connection electrode sheet 10; Said each LED luminescence chip is connected with chip chamber connection electrode sheet through gold thread/routing (not shown).
Can know that shown in figure a plurality of LED luminescence chip series connection back constitutes one group of luminescence chip group, is connected with external driving power after several luminescence chip group parallel connections.
Adopt the COB packaged type; The LED luminescence chip directly is fixed on the strip aluminum base PCB plate, has shortened the transmission path of chip heat to greatest extent, can significantly reduce the thermal resistance of luminescence chip; Help improving the heat conduction environment of lamp bar module; Under same radiating condition, can adopt more high-power LED luminescence chip, help to improve the luminous illumination or the luminous efficiency of whole light fixture.
Can know by figure; Illustrate the first LED luminescence chip 7 and the 7-2 of each luminescence chip group; 9-1 is connected through the extension of "-" power electrode on gold thread/routing (not shown) and "-" power electrode bar 9 jag; Constitute the head end link of this luminescence chip group; The LED luminescence chip 7-1 of the last position of each luminescence chip group extends jag 8-1 through gold thread/routing with "+" power electrode of "+" power electrode bar 8 and is connected, and constitutes the terminal link of this luminescence chip group, and each middle LED luminescence chip process gold thread/routing is connected in series with the chip chamber connection electrode sheet 10 between each LED luminescence chip order successively.
During actual enforcement; M * n LED luminescence chip is set on the upper surface of strip aluminum base PCB substrate; The every m of LED luminescence chip (for example: 12) series connection back constitutes one group of luminescence chip group; Be connected with external driving power after (for example: 7 groups) the luminescence chip group parallel connection of n group, constitute a complete COB packaged LED lamp bar module.
Adopt above-mentioned connected mode, help the balanced characteristics of luminescence and the luminous harmony of respectively organizing luminescence chip; Also can improve the colour rendering of light source effectively, higher illuminance or light amount of lumens can be provided on the unit light-emitting area.
Adopt the arrangement mode of single LED luminescence chip on the PCB substrate, can effectively reduce the monnolithic case size of light emitting module, help reducing the gauge of light fixture.
The COB encapsulating structure sticks to naked LED luminescence chip on the PCB substrate of interconnection with conduction or non-conductive adhesive exactly, and (being commonly called as gold thread or the routing) bonding that goes between is then realized its electrical connection.If bare chip is directly exposed in the air, pollution or artificial the damage, influence or destruction chip functions are so just seal chip and bonding wire with glue.People claim that also this packing forms is the Soft Roll envelope.
During concrete the making; With the bare chip of COB technology encapsulation be the led chip main body with the I/O terminal above crystal, when welding, this bare chip is bonded on the PCB substrate with conduction/heat-conducting glue, after solidifying; With wire bonder with wire (Al or Au) under the effect of ultrasonic, hot pressing; Be connected on the I/O terminal welding zone and the corresponding pad of PCB of chip, after the test passes, seal up resin glue again.
With the conventional package compared with techniques, the COB technology has following advantage: cheap; Conserve space; Perfect heat-dissipating.Because the envelope of COB technology is changeed mode, reduced chip to the thermo-contact layer between radiating shell.
The packaged type of existing traditional LED luminescent device is that chip at first is encapsulated as device, device is welded on the circuit base plate again; The COB packaged type then is directly chip to be encapsulated on the circuit aluminium base, has also simplified the technological process of encapsulation simultaneously, has reached effective reduction chip thermal resistance, thereby has improved the purpose of light fixture heat dispersion.
In addition; Traditional LED device envelope commentaries on classics form is with single chips individual packages; Under the condition of limited of space, lamp light source chamber, effective quantity that the tradition envelope is changeed device just is restricted so, and the COB packing forms can be arranged in chip on the circuit base plate effectively; The light source that reaches greater number is integrated, satisfies the requirement of different capacity requirement light fixture.
Among Fig. 4, LED luminescence chip 7 directly is encapsulated on the PCB substrate 5 through heat conduction adhesive linkage (not shown).
Above said each LED luminescence chip, fluorescence conversion glue-line 11 is set.
The heat conduction adhesive linkage is heat-conduction epoxy resin layer or argentiferous heat-conduction epoxy resin layer.
Strip aluminum base PCB plate directly is connected with the housing of area source light fixture or fixes through securing member.
In the present technique scheme, fit/fixing version because COB packaged LED lamp bar module and lamp housing adopt directly, the integral thickness of light fixture is 1.3CM only, has significantly reduced the gauge of LED area source light fixture.
Along with power-type LED in the general lighting extensive applications, the power-type device application has also become trend in indoor illumination light fitting, relatively in the narrow space, harsh more to the requirement of light fixture heat dissipation technology; The present technique scheme combines the packing forms and the lamp casing of device well; Design adopts incorporate COB multicore to be packaged into the lamp bar as light source; The direct heat conduction of realization chip is arrived lamp housing again to substrate; Reach better radiating effect, its relative SMD mode lamp bar can effectively reduce device junction temperature, realizes improving the purpose of lamp life.
The utility model can be widely used in the indoor and outdoor illumination field.
Claims (8)
1. the LED area source based on the COB encapsulating structure comprises lamp casing, PCB substrate and a plurality of LED luminescence chip, it is characterized in that:
The lamp casing of one frame shape structure is set;
At the edge of lamp casing, resupinate edge-on limit is set;
On the edge-on limit of two correspondences, LED lamp bar module holding tank is set;
In LED lamp bar module holding tank, correspondence is provided with a COB packaged LED lamp bar module respectively;
In the space that frame shape structure lamp casing holds/comprises, embed/be provided with a LGP;
Described frame shape structure lamp casing, COB packaged LED lamp bar module and LGP are combined into a LED area source.
2. according to the described LED area source of claim 1, it is characterized in that described COB packaged LED lamp bar module comprises a plurality of LED luminescence chips and a strip aluminum base PCB substrate based on the COB encapsulating structure;
Its described a plurality of LED luminescence chips directly encapsulate/are fixed on the strip aluminum base PCB substrate through the heat conduction adhesive linkage;
Described a plurality of LED luminescence chip is single-row arrangement, is distributed on the side of strip aluminum base PCB substrate;
Described a plurality of LED luminescence chip series connection back constitutes one group of luminescence chip group, is connected with external driving power after several luminescence chip group parallel connections;
Described shape aluminum base PCB substrate constitutes a complete COB packaged LED lamp bar module together with a plurality of LED luminescence chips on it and the connection lead that connects each LED luminescence chip.
3. according to the described LED area source of claim 1, it is characterized in that described LED lamp bar module holding tank is arranged on the edge-on limit of two correspondences of frame shape structure lamp casing based on the COB encapsulating structure.
4. according to the described LED area source of claim 1, it is characterized in that described LED lamp bar module holding tank is at least corresponding two based on the COB encapsulating structure.
5. according to the described LED area source of claim 1, it is characterized in that of the flank side surface setting of the exiting surface of said COB packaged LED lamp bar module towards LGP based on the COB encapsulating structure.
6. according to the described LED area source of claim 1 based on the COB encapsulating structure; It is characterized in that two sides, protective layer or photic zone are set, wherein at said LGP; Described protective layer is arranged on the back side of LGP, and described photic zone is arranged on the front of LGP.
7. according to the described LED area source of claim 2 based on the COB encapsulating structure; It is characterized in that the length of said strip aluminum base PCB substrate and the equal in length of LED lamp bar module holding tank; The bottom surface of said strip aluminum base PCB substrate directly is fixed on through securing member on the edge-on limit of frame shape structure lamp casing, and the upper surface of said strip aluminum base PCB substrate is towards the flank side surface setting of LGP.
8. according to the described LED area source of claim 2 based on the COB encapsulating structure; It is characterized in that on the upper surface of said strip aluminum base PCB substrate, being provided with m * n LED luminescence chip; Every m series connection back of described LED luminescence chip constitutes one group of luminescence chip group; Be connected with external driving power after the parallel connection of n group luminescence chip group, constitute a complete COB packaged LED lamp bar module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203409360U CN202302811U (en) | 2011-09-13 | 2011-09-13 | LED (light-emitting diode) surface light source based on COB (Chip On Board) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203409360U CN202302811U (en) | 2011-09-13 | 2011-09-13 | LED (light-emitting diode) surface light source based on COB (Chip On Board) packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN202302811U true CN202302811U (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203409360U Expired - Fee Related CN202302811U (en) | 2011-09-13 | 2011-09-13 | LED (light-emitting diode) surface light source based on COB (Chip On Board) packaging structure |
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| CN (1) | CN202302811U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102853301A (en) * | 2012-09-17 | 2013-01-02 | 东莞勤上光电股份有限公司 | Electric contact and connection type COB (chip on board)-LED light source module |
-
2011
- 2011-09-13 CN CN2011203409360U patent/CN202302811U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102853301A (en) * | 2012-09-17 | 2013-01-02 | 东莞勤上光电股份有限公司 | Electric contact and connection type COB (chip on board)-LED light source module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20160913 |